WO1991019415A1 - Puits thermique pour composants produisant de la chaleur - Google Patents

Puits thermique pour composants produisant de la chaleur Download PDF

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Publication number
WO1991019415A1
WO1991019415A1 PCT/US1991/003839 US9103839W WO9119415A1 WO 1991019415 A1 WO1991019415 A1 WO 1991019415A1 US 9103839 W US9103839 W US 9103839W WO 9119415 A1 WO9119415 A1 WO 9119415A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
circuit board
heat sink
clamp
heat generating
Prior art date
Application number
PCT/US1991/003839
Other languages
English (en)
Inventor
Lawrence Y. Lee
Original Assignee
Lee Lawrence Y
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Lawrence Y filed Critical Lee Lawrence Y
Publication of WO1991019415A1 publication Critical patent/WO1991019415A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • the present invention relates to heat sinks for conducting heat away from electronic components on printed circuit boards.
  • the heat sink is mounted directly onto an individual heat generating component, or onto a plurality of heat generating components.
  • the heat sink may, for example, be bolted onto one or more components.
  • the heat dissipation capacity of a heat sink is proportional to its surface area. Thus, it is common for heat sinks to be made with a large surface area.
  • a problem is introduced, however, when the surface area of the heat sink is increased. That is, when the surface area of the heat sink is increased, more room is taken up on the circuit board, so that fewer components can be mounted onto the surface of the circuit board. Furthermore, because heat sinks protrude from the surface of the circuit board, a heat sink generally protrudes farther from the surface of the circuit board when the surface area of the heat sink is increased. This places a restriction on the minimum acceptable distance between circuit boards in a high power device. Also, because many components have thin leads, bulky heat sinks increase the possibility of accidentally misaligning or separating a component lead (i.e., breaking a lead at the connection between the component and the lead, or breaking the connection between the lead and the contact pad on the circuit board) .
  • a further problem is introduced in equipment which is intended to be operated at frequencies above ' several thousand Hertz. Because of the high operating frequencies, components which are electrically associated with the operation of the heat generating power components should be located proximate to the power components in order to reduce the length of circuit interconnections. The size of conventional heat sinks, coupled with the rise in operating ambient temperature around the heat sink may preclude an optimum layout of components.
  • An improved heat sink which provides for a higher density of components on one side of a circuit board than conventional heat dissipating devices.
  • the disclosed heat sink also provides for increased heat dissipation efficiency over conventional heat dissipating devices.
  • the heat sink is mounted proximate to the low component density side of a circuit board so that selected heat generating components on the low component density side of the circuit board are in heat dissipating contact with the heat sink.
  • the heat sink comprises a highly thermally conductive material, such as aluminum, copper, or the like, and includes a device for securely fastening the heat generating components between the heat sink and the circuit board.
  • the heat generating components are securely positioned between the low component density side of the printed circuit board and the heat sink.
  • a clamp is mounted on the component side of the printed circuit board and is used to apply pressure between the printed circuit board and the heat sink.
  • a bolt passes through the clamp and the printed circuit board to the heat sink. When the bolt is tightened, the printed circuit board and the heat sink are drawn toward each other so that the heat generating components therebetween are forced into good thermal contact with the heat sink thereby creating thermally conductive paths from the heat generating components to the heat sink.
  • the clamp has a generally flat bottom with raised pedestals thereon.
  • the clamp is positioned on the component side of the printed circuit board so that the raised pedestals of the clamp are juxtaposed with the heat generating components on the low component density side of the printed circuit board.
  • the clamp advantageously includes stiffening ridges opposed to the pedestals to increase the rigidity of the clamp, thus increasing the pressure transferred from the bolt to the pedestals.
  • the heat generating components are electrically isolated from the heat sink by a conductive layer which is connected to an optimal noise return source, and by dielectric insulating layers. Both layers are thermally conductive so as to maintain the thermally conductive paths from the heat generating components to the heat sink.
  • Figure 1 is an exploded perspective view of a conventional heat sink and a single heat generating component illustrating a typical method of mounting the component to the heat sink.
  • Figure 2 is a perspective view of an exemplary printed circuit board showing a plurality of conventional heat sinks mounted onto heat generating components positioned on the printed circuit board.
  • Figure 3 is a perspective view of an exemplary printed circuit board illustrating a conventional multi-component heat sink mounted onto heat generating components on the printed circuit board.
  • Figures 4 and 5 are elevational views of the printed circuit boards of Figures 2 and 3, respectively, illustrating the spacing required between adjacent circuit boards with conventional heat sinking devices.
  • Figure 6 is a perspective view of an embodiment of a heat sink constructed in accordance with the present invention.
  • Figure 7 is a perspective view of a particularly preferred embodiment of a clamp constructed in accordance with the present invention showing the pedestals and the stiffening ridges.
  • Figure 8 is a perspective view of an exemplary printed circuit board mounted to the heat sink of Figure 6 using a plurality of clamps constructed in accordance with Figure 7, illustrating the space savings on the component side of the printed circuit board.
  • Figure 9 is an enlarged exploded perspective view of a portion of the printed circuit board and heat sink of Figure 8 illustrating the positional relationships between the components and showing the isolation layers between the. heat generating component and the heat sink.
  • Figure 10 is an enlarged cross-sectional view taken along the lines 10-10 in Figure 8 showing the spatial relationship between the clamp and the heat sink with the heat generating components sandwiched therebetween.
  • Figure 11 is an elevational view of the printed circuit board of Figure 8 mounted onto a chassis adjacent to another printed circuit board to illustrate the reduced spacing requirement between circuit boards when using the heat sink of the present invention.
  • Figure 12 is an exploded perspective view of an alternative embodiment of the present invention wherein the clamping mechanism includes adaptable pieces.
  • Figure 13 is a cutaway view which shows an adaptation of the embodiment of Figure 12.
  • FIG 14 is a perspective view of an alternative embodiment of the heat sink 300, wherein the heat sink 300 is formed with fins.
  • FIG. 15 is an exploded perspective view of an alternate circuit mounting assembly in which a single heat generating component having a through-hole is mounted to the heat sink.
  • a conventional heat sink assembly 100 is depicted in Figure 1.
  • a heat sink 110 is mounted onto a heat-generating silicon component, such as a field effect transistor (FET) 112, and is designed to maximize heat dissipation for that component.
  • FET field effect transistor
  • heat sinks which have a large surface area provide more efficient heat dissipation. Thus, it is desirable to maximize the surface area of a heat sink.
  • the heat sink 110 shown in Figure 1 is attached to the FET 112 by a bolt or screw 120 through a hole 150.
  • Figure 2 shows the FET 112 and heat sink 110, along with a plurality of similarly constructed FET/heat sink combinations 100, mounted onto the "component" side of a printed circuit board 170.
  • the “component” side of a circuit board is the side which typically has the highest density of components.
  • the opposite side of the printed circuit board 170 typically has few, if any, components mounted on it, and is referred to herein as the "non-component" side, or, alternatively, as the "low component density side.”
  • heat sinking devices Because it is desirable to maximize the surface area of a heat sink, heat sinking devices often become very bulky and cumbersome, especially on printed circuit boards which have a high density of electrical components. Consequently, when a number of heat sinking devices are to be employed on a circuit board, there is very little room left for other components. Hence, circuit board space is sacrificed. Thus, the FET/heat sink combinations 100 are mounted in a vertical configuration as shown in Figure 2. However, because most components are connected to the circuit board 170 with relatively thin leads, bulky heat sinks, with their relatively large masses cantilevered away from the surface of the printed circuit board 170, exert significant leverage on the leads and increase the possibility of accidentally misaligning or separating a lead of a component having a heat sink.
  • Another type of conventional heat sink is mounted to multiple components, as shown in Figure 3, so that a large heat conducting element 200 mounted on a circuit board 210 is shared by several heat generating components 220.
  • board surface area is compromised because certain types of components which protrude from the board surface will not fit in areas covered by the heat sink 200.
  • conventional heat sinks pose a further limitation.
  • FIG. 4 illustrates that the minimum allowable distance between circuit boards is increased when conventional heat sinks are employed.
  • Figure 4 depicts an elevational side view of the circuit board 170 in * close proximity to a second circuit board 250. Note that the protrusion of the conventional heat sinking devices 100 from the surface of the circuit board 170 requires that a greater amount of space be provided between the circuit board 170 and the circuit board 250.
  • Figure 5 depicts an elevational side view of the circuit board 210 in close proximity to a second circuit board 270. Note that the protrusion of the conventional heat sink 200 from the surface of the circuit board 210 also requires that a greater amount of space be provided between the circuit board 210 and the circuit board 270.
  • Figure 6 depicts a broad, flat heat sink 300 used in accordance with the preferred embodiment of the present invention.
  • the heat sink 300 preferably has right angled portions 302, 304.
  • the heat sink 300 is provided with threaded screw-holes 310, or pern ® nuts on the right angle portion 302, so as to facilitate mounting of the heat sink 300 onto the chassis (see Figure 11) of an electronic device (e.g., a power supply).
  • a plurality of threaded holes 312 are also provided to facilitate mounting the heat sink 300 onto a printed circuit board as will be discussed below.
  • the heat sink 300 is advantageously constructed from a thermally conductive material such as an aluminum alloy.
  • Figure 7 depicts a clamp 330 which is * used in accordance with the present invention to mount the heat sink 300 onto a circuit board.
  • the clamp 330 has a pair of stiffening ridges 332, and a pair of pedestals 334.
  • the clamp 330 comprises phenolic, metal, or other material of suitable strength, and is also provided with a through-hole 336 so that a bolt or screw can be passed therethrough.
  • the pedestals 334 are advantageously insulated using an electrically insulating tape, or the like, to prevent contact with conducting lines on the circuit board 340.
  • FIGs 8, 9, and 10 show the heat sink 300 mounted proximate to the low component density side of a printed circuit board 340.
  • the heat sink 300 is attached by a plurality of bolts 380 which pass through a corresponding plurality of clamps 330 on the "component" side of the circuit board 340.
  • the clamps 330 take up less board space on the "component" side of the circuit board 340 than the conventional heat sinking elements shown in Figures 2 and 3.
  • the bolts 380 pass through the circuit board 340, and engage the holes 312 in the heat sink 300.
  • Two heat generating components 390 (shown in Figures 9 and 10) are mounted between the heat sink 300 and the circuit board 340 on either side of the bolt 380.
  • the bolts 380 are tightened with sufficient torque so that the heat generating components 390 are sandwiched between the printed circuit board 340 and the heat sink 300 with good thermal contact provided between the heat generating components 390 and the heat sink 300.
  • the heat generated by the components 390 is readily transferred to the heat sink 300.
  • Figure 9 is an exploded view of the elements of Figure 8 illustrating the use of the clamp 330 in greater detail.
  • Figure 9 depicts the manner in which the components 390, having leads 410, are fastened between the circuit board 340 and the heat sink 300.
  • the pedestals 334 of the clamp 330 are positioned at locations on the "component" surface of the circuit board 340 opposite the locations of the "non-component” surface where the heat generating components 390 are to be situated.
  • the bolt 380 is tightened, the heat sink 300 is drawn towards the circuit board 340 and pressure is exerted onto the circuit board 340 through the pedestals 334.
  • the pedestals 334 serve to concentrate the pressure exerted by the clamp 330.
  • the pressure is coupled to the components 390 so that a clamping effect between the heat sink 300 and the pedestals 334 is produced which holds the components 390 securely in place.
  • the stiffening ridges 332 provide structural support to the clamp 330 so that the ends of the clamp 330 do not bend or break when the bolt 380 is tightened as a result of the reactive force applied to the pedestals 334.
  • the clamp 330 may also have alternative embodiments which would allow for clamping of more than two components 390.
  • Figure 9 also depicts a conductive isolation layer 420 and a dielectric isolation layer 422 interposed between the heat sink 300, and the heat generating component 390, so that the conductive isolation layer 420 is proximate to the heat generating component 390.
  • the conductive isolation layer 420 is advantageously made of copper or some other material with good electrically conductive properties as well as good thermally conductive properties, and is connected to a circuit ground connector (not shown) on the "non-component" side of the circuit board 340.
  • the dielectric isolation layer 422 is advantageously constructed from Kapton ® or another electrically insulating, thermally conductive material.
  • an additional dielectric isolation layer (not shown) may be interposed be'tween the heat generating component 390 and the conductive isolation layer 420. Since the conductive isolation layer 420 and the dielectric insulation layer 422 are thermally conductive, the efficacy of the heat sink 300 is not significantly reduced.
  • Figure 10 illustrates an enlarged cutaway view, along the line 10-10 in Figure 8, showing the spatial relationship of the clamp 330, and the heat sink 300 with respect to the heat generating components 390.
  • the high power components 390 which require cooling are clamped between the circuit board 340 and the heat sink 300.
  • the components 390 are advantageously mounted flat onto the surface of the circuit board 340 so that the heat conducting side of the components 390 are in thermal contact with the heat sink 300, thereby forming a thermal sandwich. By mounting the components 390 flat on their sides, the chances of separating or misaligning one of the leads 410 from the circuit board 340 is reduced since the leads 410 are not used to provide structural support for the components 390.
  • the circuit board 340 is advantageously of the through-hole variety so that the leads 410 (shown in Figures 9 and 11) of the component 390 can be easily connected in a conventional manner to the conductive path provided on the circuit board 340.
  • leads 410 shown in Figures 9 and 11
  • no components 390 which require a heat sink for cooling purposes are mounted on the "component" side of the circuit board 340.
  • the components 390 which require cooling are mounted on the underside (or alternatively, the low component density , or "non-component,” side) of the circuit board 340, between the heat sink 300 and the circuit board 340, so that the heat conductive surface of each heat generating component 390 is in contact with the heat sink 300.
  • other components may be mounted on the low component density side of the circuit board 340 so long as the components on the low component density side have a sufficiently low profile so that they do not interfere with the heat sink 300.
  • the circuit density on the low component density side is typically substantially less than the circuit density of the "component" side.
  • the surface area of the heat sink 300 is very large compared to the heat sinks employed in the previously discussed devices.
  • the large surface area of the heat sink 300 provides a high thermal dissipation capacity.
  • the mounting of the heat sink 300 onto a chassis 345 acts to thermally couple the heat sink 300 to the chassis 345, so that additional heat dissipation occurs through the chassis 345.
  • the heat sink 300 provides for maximum thermal dissipation efficiency, while occupying a minimum area on the "component" side of the circuit board 340.
  • the present invention also allows for reduced spacing between circuit boards within an electronic device, such as a power supply.
  • Figure 11 illustrates that the present invention permits closer spacing between circuit boards than the conventional heat sinks depicted in Figures 4 and 5. It can be seen in Figure 11 that the right angle portion 304 of the heat sink 300 does not extend higher than the highest component on the circuit board 340 and that the minimum spacing between circuit boards is determined by the height of the tallest component and not by the heat sink 300. Thus, no increase in distance between the "component" side of the circuit board 340 and an adjacent circuit board 480 is necessitated by the presence of the heat sink 300.
  • the heat sink 300 is advantageously mounted onto the chassis 345 of the device containing the circuit board 340 (e.g., a power supply).
  • the mounting of the heat sink 300 to the chassis 345 is accomplished in a conventional manner using bolts or screws.
  • the screw-holes 310 ( Figure 8) are provided on the right angle portion 302 of the heat sink 300.
  • the heat sink 300 can be mounted to the chassis 345 on either right angled portion 302, 304.
  • the large heat sink 300 is particularly advantageous in combination with a cooling fan (not shown) which removes heat from the surface of the heat sink 300. By passing air across a heat dissipating surface, as is typically done in electronic equipment, heat dissipation can often be increased.
  • fins could be added onto the bottom of the heat sink (see Figure 14) so long as the fins are formed so that they run parallel to the direction of air flow. Because air is permitted to flow rapidly along the surface of the heat sink 300, the heat produced on the surface of the heat
  • 25 sink 300 is removed at a faster rate.
  • Another advantage of the present invention is that the component layout for high frequency circuits can be optimized. This is because the heat sink 300 extends over the entire surface of the circuit board 340, and the heat
  • Figure 12 is an exploded perspective view of an
  • a bridge 500 having bilateral holes 502 and a center hole 504, is used in conjunction with a pair of pressure pads 510 to provide a clamping configuration.
  • the pads 510 include an insert portion 512 and a base portion 514, and are advantageously constructed so that the insert portions 512 of the pads 510 fit within the holes 502.
  • the pads 510 may be made of plastic, phenolic, metal, or other material having suitable strength.
  • the base portions 514 of the pads 510 serve to concentrate the pressure applied by the bridge 500.
  • the pressure is coupled to the components 390 so that a clamping effect between the heat sink 300 and the pads 510 is produced which holds the components 390 securely in place.
  • the bridge 500 and the pads 510 could be formed as one piece, however, the embodiment described above provides a more adaptable configuration.
  • Figure 13 is a cutaway view showing a modification of the embodiment of the present invention shown in Figure 12.
  • a spacer 530 is shown in place of one of the pads 510.
  • the spacer 530 may, for example, be made of metal or other material of suitable strength.
  • it may be convenient to clamp only one component 390 at a certain area on the circuit board 340.
  • one of the pads 510 would apply pressure to a portion of the circuit board 340 that does not have a component on the opposite side. It is likely that a significant amount of stress would be placed on the circuit board 340 at that location since movement would not be inhibited by a component. Such stress could crack the circuit board 340.
  • the spacer 530 acts as a pivot point, or fulcrum, for the bridge 500 by maintaining a constant distance between the bridge 500 and the heat sink 300, while also acting to transfer pressure to the remaining pressure pad 510 when the bolt 380 is tightened.
  • the spacer 530 is advantageously constructed to fit within one of the holes 502, and a hole may be drilled into the circuit board 340 so that the base of the spacer 530 can be placed in contact with the heat sink 300.
  • FIG 14 is a perspective view which shows the underside of an alternative embodiment of the heat sink 300.
  • the heat " sink 300 is advantageously constructed with fins 500 to further increase the surface area of the heat sink 300.
  • the fins 550 are most advantageous when they are formed to run parallel to the direction of air flow, so that minimum resistance to air flow is provided.
  • Figure 15 is an exploded view of an alternative embodiment in which the clamp 330 is replaced by a conventional washer 610.
  • the alternative embodiment comprises the bolt 380, the washer 610, the circuit board 340, the heat generating component 390 (e.g., a silicon controlled rectifier) having leads 410, and the heat sink 300.
  • the heat generating component 390 e.g., a silicon controlled rectifier
  • the heat sink 300, the circuit board 340, and the washer 610 are all provided with a hole of substantially the same diameter (e.g., 0.156 inches in the preferred embodiment) so that the bolt 380 can pass therethrough.
  • the heat generating component 390 also has a hole so that the bolt 380 can pass therethrough.
  • the hole 312 in the heat sink 300 may be threaded, so as to provide secure thermal engagement between the elements shown in Figure 15.
  • the washer 610 can be replaced by a threaded nut (not shown) so that the bolt 380 is inserted from the side of the heat sink 300, and engages the threaded nut on the "component" side of the circuit board 340.
  • the hole 312 in the heat sink 300 is not threaded.
  • the embodiment of the heat sink 300 described herein is illustrated with one larger right angled portion 304 and one smaller right angled portion 302, other shapes and forms of the heat sink 300 may be employed in order to facilitate mounting of the heat sink 300 within a particular device.
  • the heat sink 300 could be manufactured with only one right angled portion.
  • the heat sink 300 could be made flat with notches cut out in certain areas to form mounting tabs.
  • the clamp might be constructed with more than two pedestals.
  • the clamp 330 may be used to secure only one component 390 under one of the pedestals 334.
  • a permanent rivet may be used in place of the removable bolt 380.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention se rapporte à un puits thermique (300) qui permet d'obtenir une densité des composants sur l'un des côtés d'une carte de circuits (340) ainsi qu'une capacité de dissipation de la chaleur plus grandes que les dissipateurs thermiques traditionnels. Ce puits thermique (300) est monté sur le côté à faible densité en composants de la carte de circuits (340), pour que la dissipation de la chaleur par le puits thermique (300) s'effectue à partir des composants haute puissance (390) qui sont également montés sur le côté à faible densité en composants de la carte de circuits (340). Des trous (312) sont ménagés à travers le puits thermique (300) et la carte de circuits (340) de sorte que les composants haute puissance (390) peuvent être pris en sandwich entre le puits thermique (300) et la carte de circuits (340) au moyen d'une plaquette de serrage (330) et d'un élément de boulonnerie (380) introduit dans chacun des trous (312) . Dans un mode de réalisation, la plaquette de serrage (330) comporte des socles (334) qui servent à concentrer la pression de serrage qui s'applique aux composants haute puissance (390), ainsi que des bords rigidifiants (332) servant à assurer une rigidité supplémentaire. Dans une variante, une pièce d'espacement amovible (530) est introduite à la place des socles (334) pour assurer une répartition uniforme de la pression de serrage, en cas de présence d'un seul composant (390). Le puits thermique (300) est de préférence fixé par boulons à un châssis (345) à travers des trous supplémentaires (310) pratiqués dans une partie à angle droit (302) du puits thermique (300). Dans une autre variante, les composants haute puissance (390) sont munis de trous pour permettre le passage de l'élément de boulonnerie (380).
PCT/US1991/003839 1990-05-31 1991-05-31 Puits thermique pour composants produisant de la chaleur WO1991019415A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53107390A 1990-05-31 1990-05-31
US531,073 1990-05-31

Publications (1)

Publication Number Publication Date
WO1991019415A1 true WO1991019415A1 (fr) 1991-12-12

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PCT/US1991/003839 WO1991019415A1 (fr) 1990-05-31 1991-05-31 Puits thermique pour composants produisant de la chaleur

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2883448A1 (fr) * 2005-03-17 2006-09-22 Siemens Vdo Automotive Sas Ensemble comprenant un circuit imprime, un composant de puissance et un radiateur
EP1806041A2 (fr) * 2004-09-23 2007-07-11 Hamilton Sundstrand Corporation Procede de montage d'igbt combine
DE102011085870A1 (de) * 2011-11-07 2013-05-08 Lenze Automation Gmbh Frequenzumrichter
EP3389136A4 (fr) * 2015-12-10 2019-04-24 Panasonic Intellectual Property Management Co., Ltd. Module sans fil et dispositif d'affichage d'image

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356904A (en) * 1966-12-07 1967-12-05 Rlf Ind Inc Heat dissipating arrangement for electrical components
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
US4724514A (en) * 1986-07-18 1988-02-09 Kaufman Lance R Low cost compressively clamped circuit and heat sink assembly
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356904A (en) * 1966-12-07 1967-12-05 Rlf Ind Inc Heat dissipating arrangement for electrical components
US4459639A (en) * 1982-07-12 1984-07-10 Rockwell International Corporation Circuit board heatsink clamping assembly and technique
US4724514A (en) * 1986-07-18 1988-02-09 Kaufman Lance R Low cost compressively clamped circuit and heat sink assembly
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1806041A2 (fr) * 2004-09-23 2007-07-11 Hamilton Sundstrand Corporation Procede de montage d'igbt combine
EP1806041A4 (fr) * 2004-09-23 2010-12-22 Hamilton Sundstrand Corp Procede de montage d'igbt combine
FR2883448A1 (fr) * 2005-03-17 2006-09-22 Siemens Vdo Automotive Sas Ensemble comprenant un circuit imprime, un composant de puissance et un radiateur
DE102011085870A1 (de) * 2011-11-07 2013-05-08 Lenze Automation Gmbh Frequenzumrichter
EP2590493B1 (fr) * 2011-11-07 2019-03-27 Lenze Automation Gmbh Convertisseur de fréquence
EP3389136A4 (fr) * 2015-12-10 2019-04-24 Panasonic Intellectual Property Management Co., Ltd. Module sans fil et dispositif d'affichage d'image

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