WO1991011467A1 - Ethers alkenyles et compositions polymerisables par radiation - Google Patents
Ethers alkenyles et compositions polymerisables par radiation Download PDFInfo
- Publication number
- WO1991011467A1 WO1991011467A1 PCT/US1990/006758 US9006758W WO9111467A1 WO 1991011467 A1 WO1991011467 A1 WO 1991011467A1 US 9006758 W US9006758 W US 9006758W WO 9111467 A1 WO9111467 A1 WO 9111467A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ether
- value
- mixture
- alkyl
- chr
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 69
- -1 Alkenyl ethers Chemical class 0.000 title claims abstract description 38
- 230000005855 radiation Effects 0.000 title claims abstract description 18
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 46
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003999 initiator Substances 0.000 claims abstract description 21
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 13
- 239000001257 hydrogen Substances 0.000 claims abstract description 13
- 125000002091 cationic group Chemical group 0.000 claims abstract description 12
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 9
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 9
- 150000002367 halogens Chemical group 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 5
- 125000005529 alkyleneoxy group Chemical group 0.000 claims abstract description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 4
- 125000004450 alkenylene group Chemical group 0.000 claims abstract description 3
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 3
- 125000004419 alkynylene group Chemical group 0.000 claims abstract description 3
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims abstract 3
- 150000001721 carbon Chemical group 0.000 claims abstract 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 13
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 12
- 239000012952 cationic photoinitiator Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims description 5
- GXBYFVGCMPJVJX-UHFFFAOYSA-N Epoxybutene Chemical compound C=CC1CO1 GXBYFVGCMPJVJX-UHFFFAOYSA-N 0.000 claims description 4
- CHNNDUADDBVAPA-UHFFFAOYSA-N tris(4-ethenoxybutyl) ethyl silicate Chemical compound C=COCCCCO[Si](OCC)(OCCCCOC=C)OCCCCOC=C CHNNDUADDBVAPA-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- OLTYQWOYWODXLS-UHFFFAOYSA-N bis(4-ethenoxybutoxy)-ethoxy-hydroxysilane Chemical compound C=COCCCCO[Si](O)(OCC)OCCCCOC=C OLTYQWOYWODXLS-UHFFFAOYSA-N 0.000 claims description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 2
- DYLIWHYUXAJDOJ-OWOJBTEDSA-N (e)-4-(6-aminopurin-9-yl)but-2-en-1-ol Chemical compound NC1=NC=NC2=C1N=CN2C\C=C\CO DYLIWHYUXAJDOJ-OWOJBTEDSA-N 0.000 claims 1
- NHWJOYMRQQIFDL-UHFFFAOYSA-N 4-ethenoxybutoxy-ethoxy-dihydroxysilane Chemical class CCO[Si](O)(O)OCCCCOC=C NHWJOYMRQQIFDL-UHFFFAOYSA-N 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229910052605 nesosilicate Inorganic materials 0.000 claims 1
- 150000004762 orthosilicates Chemical class 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 1
- 235000019256 formaldehyde Nutrition 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 18
- 229960000834 vinyl ether Drugs 0.000 description 12
- 239000000047 product Substances 0.000 description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical class [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 239000004094 surface-active agent Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 229940052303 ethers for general anesthesia Drugs 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000000376 reactant Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- ZKJNETINGMOHJG-GLIMQPGKSA-N (z)-1-[(z)-prop-1-enoxy]prop-1-ene Chemical compound C\C=C/O\C=C/C ZKJNETINGMOHJG-GLIMQPGKSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000010894 electron beam technology Methods 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- ZKJNETINGMOHJG-GGWOSOGESA-N (e)-1-[(e)-prop-1-enoxy]prop-1-ene Chemical compound C\C=C\O\C=C\C ZKJNETINGMOHJG-GGWOSOGESA-N 0.000 description 4
- ZKJNETINGMOHJG-UHFFFAOYSA-N 1-prop-1-enoxyprop-1-ene Chemical class CC=COC=CC ZKJNETINGMOHJG-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical class O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 235000011118 potassium hydroxide Nutrition 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical class C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 3
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229930188620 butyrolactone Natural products 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000012442 inert solvent Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 238000003847 radiation curing Methods 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- JJWWPYANGKCLRB-UHFFFAOYSA-N 2-but-1-enoxyethanol Chemical compound CCC=COCCO JJWWPYANGKCLRB-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- PXKOXHRZLMDJQR-UHFFFAOYSA-N 3-ethenoxyprop-2-yn-1-ol Chemical compound OCC#COC=C PXKOXHRZLMDJQR-UHFFFAOYSA-N 0.000 description 1
- QBUHWUOTVIYZLA-UHFFFAOYSA-N 4-but-1-enoxybutan-1-ol Chemical compound CCC=COCCCCO QBUHWUOTVIYZLA-UHFFFAOYSA-N 0.000 description 1
- RWWFOLQIOBPNNT-UHFFFAOYSA-N 4-ethenoxybut-3-yn-1-ol Chemical compound OCCC#COC=C RWWFOLQIOBPNNT-UHFFFAOYSA-N 0.000 description 1
- UFRCCJVCWZAEBT-UHFFFAOYSA-N 4-prop-1-enoxybutan-1-ol Chemical compound CC=COCCCCO UFRCCJVCWZAEBT-UHFFFAOYSA-N 0.000 description 1
- ASPUDHDPXIBNAP-UHFFFAOYSA-N 6-ethenoxyhexan-1-ol Chemical compound OCCCCCCOC=C ASPUDHDPXIBNAP-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 1
- LJFKLJNQGZKJMK-UHFFFAOYSA-N C(=C)OC=CCCO Chemical compound C(=C)OC=CCCO LJFKLJNQGZKJMK-UHFFFAOYSA-N 0.000 description 1
- MSCYKCLSHDWGBK-UHFFFAOYSA-N C(=CCCCC)OC(CCCO)CC Chemical compound C(=CCCCC)OC(CCCO)CC MSCYKCLSHDWGBK-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CVRBVUPPXBSJSX-UHFFFAOYSA-N OCCC#COC=CC Chemical compound OCCC#COC=CC CVRBVUPPXBSJSX-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 1
- DVYWWINZULHNGQ-UHFFFAOYSA-N [Si](OC(C)CCCCOC=C)(OC(C)CCCCOC=C)(OC(C)CCCCOC=C)OC(C)CCCCOC=C Chemical compound [Si](OC(C)CCCCOC=C)(OC(C)CCCCOC=C)(OC(C)CCCCOC=C)OC(C)CCCCOC=C DVYWWINZULHNGQ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- DALDUXIBIKGWTK-UHFFFAOYSA-N benzene;toluene Chemical compound C1=CC=CC=C1.CC1=CC=CC=C1 DALDUXIBIKGWTK-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- OJTAZTJFBPGHCA-UHFFFAOYSA-N bis(4-ethenoxybutyl) diethyl silicate Chemical compound C=COCCCCO[Si](OCC)(OCC)OCCCCOC=C OJTAZTJFBPGHCA-UHFFFAOYSA-N 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- IIXOVPGRABFCAI-UHFFFAOYSA-N cyclohexylmethanediol Chemical compound OC(O)C1CCCCC1 IIXOVPGRABFCAI-UHFFFAOYSA-N 0.000 description 1
- RHXIYCXNOQKKMZ-UHFFFAOYSA-N diethoxy(dihydroxy)silane Chemical compound CCO[Si](O)(O)OCC RHXIYCXNOQKKMZ-UHFFFAOYSA-N 0.000 description 1
- VYGOHUKEGJHBCA-UHFFFAOYSA-N dihydroxy(dipropoxy)silane Chemical compound CCCO[Si](O)(O)OCCC VYGOHUKEGJHBCA-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical class C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- IXFFLCQKZXIGMH-UHFFFAOYSA-N ethenoxyethene;ethyl carbamate Chemical compound C=COC=C.CCOC(N)=O IXFFLCQKZXIGMH-UHFFFAOYSA-N 0.000 description 1
- OINAZFIYBQXATD-UHFFFAOYSA-N ethyl n-[4,4-bis(ethenoxy)butyl]carbamate Chemical compound CCOC(=O)NCCCC(OC=C)OC=C OINAZFIYBQXATD-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000004508 fractional distillation Methods 0.000 description 1
- 239000012949 free radical photoinitiator Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- IEZWOVIWXFLQTP-UHFFFAOYSA-N hydroperoxyethene Chemical class OOC=C IEZWOVIWXFLQTP-UHFFFAOYSA-N 0.000 description 1
- 125000005020 hydroxyalkenyl group Chemical group 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- AIFMYMZGQVTROK-UHFFFAOYSA-N silicon tetrabromide Chemical compound Br[Si](Br)(Br)Br AIFMYMZGQVTROK-UHFFFAOYSA-N 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- FYCLYMDZXAFURW-UHFFFAOYSA-N tetrakis(4-ethenoxybutyl) silicate Chemical compound C=COCCCCO[Si](OCCCCOC=C)(OCCCCOC=C)OCCCCOC=C FYCLYMDZXAFURW-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WDTDSLYQFFOBFK-UHFFFAOYSA-N tributoxy(hydroxy)silane Chemical compound CCCCO[Si](O)(OCCCC)OCCCC WDTDSLYQFFOBFK-UHFFFAOYSA-N 0.000 description 1
- FYUZFGQCEXHZQV-UHFFFAOYSA-N triethoxy(hydroxy)silane Chemical compound CCO[Si](O)(OCC)OCC FYUZFGQCEXHZQV-UHFFFAOYSA-N 0.000 description 1
- ADNDDCJURLFKNN-UHFFFAOYSA-N trihydroxy(2,2,2-tribromoethoxy)silane Chemical compound O[Si](O)(O)OCC(Br)(Br)Br ADNDDCJURLFKNN-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- ZKVFTKUIKRPMEB-UHFFFAOYSA-N tris(6-ethenoxyhexan-2-yloxy)-hydroxysilane Chemical compound C=COCCCCC(C)O[Si](O)(OC(C)CCCCOC=C)OC(C)CCCCOC=C ZKVFTKUIKRPMEB-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/04—Esters of silicic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/42—Introducing metal atoms or metal-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
Definitions
- X is halogen, -OR wherein R is lower alkyl, a mixture of halogen and -OR, a mixture of -OR and hydrogen or a mixture of halogen and hydrogen;
- R- ⁇ contains from l to 8 carbon atoms and is alkylene, alkenylene, alkynylene, optionally alkoxylated with up to 20 units of
- Y is hydrogen or methyl
- R 2 is hydrogen or lower alkyl
- n has a value' of from 1 to 4.
- silicate reactants include tetrachlorosilane, tetrafluorosilane, tetrabromosilane, tetramethyl orthosilicate, tetrabutyl orthosilicate, tetraethyl orthosilicate, tetrapropylyl orthosilicate, diethyl orthosilicate, dipropyl orthosilicate, tributyl orthosilicate, triethyl orthosilicate, tribromoethyl orthosilicate, dichlorodiethyl orthosilicate.
- hydroxy vinyl ethers which are suitably employed in the reaction include hydroxybutyl vinyl ether, hydroxyethyl vinyl ether, hydroxybutyl prop-1-enyl ether, hydroxyethyl but-1-enyl ether, hydroxyhexyl vinyl ether, hydroxyethyl 2-butyl hex-1-enyl ether, hydroxy butenyl vinyl ether, hydroxybutynyl vinyl ether, hydroxybutynyl-prop-1-enyl ether, hydroxypropynyl vinyl ether, hydroxybutyl 3-methylprop-l-enyl ether, the vinyl ether of di-hydroxymethyl cyclohexane and alkoxylated vinyl ether derivatives of the above having the formula
- m has a value of from 1 to 20, preferably from 1 to 8 and R lf Y and R 2 are as defined above.
- the mole ratio of silicate to hydroxylated alkenyl ether depends on the number of terminal alkenyl groups desired in the product and the number of halo and or OR groups in the silicate reactant and is as close to stoichiometry as is conveniently maintained; although up to a 10:1 excess of silicate reactant over said stoichiometric amount is within the scope of this invention.
- the reaction is carried out under anhydrous conditions in the presence of from about 0.01 to about 10 wt. %, preferably from about 0.1 to about 5%, of a base catalyst based on the alkenyl ether reactant.
- Catalysts such as sodium or potassium metals, sodium or potassium hydroxides, hydrides, alkoxides or salts of the hydroxy alkenyl ether as well as titanium alkoxide are suitably employed.
- halogenated silicates When halogenated silicates are employed, the addition of a base is required during the reaction to neutralize any hydrogen halide which is generated as by-product.
- Suitable bases include sodium hydroxide, potassium hydroxide, sodium or potassium alkoxides, pyridine or basic pyridine derivatives, ammonia and amines such as trimethyl a ine, tripropylamine and the like.
- the reaction mixture may also be affected in up to 90%, preferably not more than 50% suitable inert solvent such as toluene benzene, methyl ethyl ketone, N-methyl pyrrolidone, tetrahydrofuran, ethyl acetate, acetonitrile, and the like.
- suitable inert solvents are those having a boiling point below that of the desired product.
- the reaction is carried out at a temperature between about 50° and about 200°C. for a period of from about 5 to about- 48 hours under from ambient pressure up to about 500 psi.
- Preferred reaction parameters include a temperature of between about 100° and about 120°C. , a reaction time of from about 10 to 20 hours and a pressure from atmospheric to about 50 psi.
- High conversion to product is achieved in the present reaction although a product mixture of mono and poly substituted silicates is usually obtained.
- Individual products can be separated by fractional distillation if desired. The crude product is separated from base catalyst by usual methods such as extraction and filtration, and from solvent, by evaporation under reduced pressure.
- a major advantage of the present products is that they are rapidly curable at ambient temperatures by UV and visible light or other sources of radiation such as an electron beam, x-ray, laser emissions and the like. They are also reactive diluents for highly viscous coating materials, such as acrylates, vinyl ethers, epoxides, and non-reactive resins, etc., to promote rapid curing and strong bonding to substrate surfaces. From about 1 to about 60 wt. %, preferably from about 1 to about 30 wt. %, of the present alk-1-enyl ether silicates are added to said acrylates, epoxides and/or vinyl ethers to improve their curing properties.
- a radiation curable, cross linkable composition containing (a) from about 0.1 to about 5 wt. % of an initiator containing at least 25% of a cationic initiator, (b) from about 0 to about 60 wt. % of one or more polymerizable components of the group of a vinyl ether, epoxide, acrylate or a vinyloxy alkyl urethane and (c) from about 35 to about 99.9% wt. % of an aliphatic polyfunctional alkenyl ether having the formula (II)
- compositions are those containing between about 20% and about 50% of component (b) and between about 50% and about 80% of component (c) where R is methyl.
- the present polyfunctional alkenyl, preferably propenyl, ether compounds of Formula (II) are homopolymerizable resins independently useful as protective coatings and are also effective cross-linking agents for polymerizable vinyl ethefs having at least 6 carbon atoms or epoxides such as the divinyl ethers of the bis(hydroxyethyl) ether of bisphenol A, the divinyl ether of triethylene glyc ⁇ l the divinyl ether of dimethylolcyclohexane, vinyloxyalkyl urethanes, e.g.
- divinyloxybutyl urethane oligomers the diglycidyl ether of bisphenol A and its oligomers, bisphenol A epoxy acrylate and its oligomers, 3,4-eppxycyclohexyl methyl-3 ' ,4'-epoxycyclohexane cairb ⁇ xylate, the ethers disclosed in U.S. patents 4,388,450; 4,749,807; 4,775,732 and 4,751,271 and corresponding alkoxylated compounds and similar comonomers in monomeric or oligomeric form having a number average molecular weight up to about 5,000 or mixtures of said comonomers and/or copolymers.
- Such monomeric or polymeric vinyl ethers, epoxides, acrylates or urethanes can be reacted with the polyfunctional alkenyl ethers of this invention to form a cross-linked copolymeric product having a high cross-linked density and extremely high resistance to abrasion and chemical attack.
- the present polyfunctional alkenyl ethers are homopolymerizable forming an exceedingly branched structure.
- these agents can be used as rigid coatings on substrates which require an exceptionally high strength, resistance to abrasion and solvent attack.
- Substrates on which the copolymerized or homopolymerized agent is suitably coated include metal, wood, ceramic, plastic, leather, paper, glass and the like.
- the present composition is coated on the substrate by any convenient and conventional technique in the desired thickness, usually in a thickness of between about 0.1 to about 5 mils.
- the alkenyl ethers of this invention can be admixed with the above acrylate, urethane, epoxide or vinyl ether monomers or their oligomeric counterparts to effect cross-linking in the presence of a cationic initiator, such as a triphenyl sulfonium salt of phosphorous hexafluoride, diphenyl iodonium salt, a mixture of aromatic complex salts of butyrolactone, a phenyl ; ⁇ nium salt or an aryl alkyl oniu salt, etc.
- a cationic initiator such as a triphenyl sulfonium salt of phosphorous hexafluoride, diphenyl iodonium salt, a mixture of aromatic complex salts of butyrolactone, a phenyl ; ⁇ nium salt or an aryl alkyl oniu salt, etc.
- the initiators suitable to effect polymerization reactions of the present invention include the above named cationic initiators which can be employed alone or in admixture with a free radical initiator to provide a hybrid system.
- Suitable free radical initiators include 1-hydrocyclohexyl phenyl ketone, 2-hydroxy-2-methyl-l-phen ⁇ l-l-propan-l-one, 2,2-dichloro- ⁇ -(4-phenoxy- phenyl) ethanone and the like.
- the free radical component can comprise up to 75%, preferably between about 30 and about 70%, of the cationic initiator component.
- a particularly pre erred initiator mixture includes between about 30 wt. % and about "40 wt.
- the present initiator mixtures are recommended for blends of (b) and (c) where component (b) contains an acrylate.
- the total amount of initiator employed is generally between about 0.l and about 5 wt. % with respect to reactant or reactants.
- one or more of the present aliphatic alkenyl ethers can be employed or blended with one or more of the polymerizable epoxides, vinyl ethers, acrylates dr vinyloxy alkyl urethanes, thus benefiting from the properties cff 'each monomer in the blend.
- blends of the present propenyl ether and the divinyl ether of dimethylol cyclohexane enhance solub ' flizafcifn of the cationic initiator.
- Such blends may contain up to about 60%, preferably from about 20 to about 50% of component (b) .
- the propenyl ether of component (c) in the present composition serves not only as a reactant, but also as an essential diluent for the vinyl ether and/or epoxide which compounds are highly viscous and difficult to apply as coatings.
- the propenyl ether provides a coatable composition without the need for extraneous diluents which in many cases can cause blisters and non-uniformity in the coating product.
- the compositions of the present invention are cured within a period of up to one second by exposure to a source of radiation, e.g. UV light, electron beam, laser emissions, gamma rays etc. Radiation curing in the present cationic system takes place at a fast rate, e.g.
- UV light radiation dosages at room temperature of from about 100 to about 1500 milli J/cm 2 are effective and dosages of from about 200 to about 600 milli J/cm 2 are preferred.
- Equivalent dosages for curing are employed when using alternative sources of radiation.
- curing with electron beam radiation can be carried out at between about 0.5 and about 20 Mrads, preferably between about 1 and about 10 Mrads. Specific techniques for radiation curing are well known, thus further amplification is not required.
- the present propenyl ethers are normally liquid, they can be directly mixed with the polymerizable vinyl ether, epoxide or vinyloxy alkyl urethane monomer or oligomer without further conditioning; however, in certain cases where dilution is desired, as in cases where higher molecular weight alkenyl ethers of this invention are employed as component (c) or where the blend provides a highly viscous mixtue, the alkenyl ether can be dissolved in an inert organic solvent such as methyl ethyl ketone, toluene, a hydrocarbon, acetone, an ether or a halogenated compound such as methylene chloride. However, dilution with the above solvents should not exceed 50% when highly resistant coatings are required.
- the alkenyl ether monomer or oligomer in the absence of a comonomer can be applied directly to any of the above substrates and subjected to radiation for curing under the above conditions to form a more highly cross-linked homopolymeric protective coating.
- the present compositions can optionally contain minor amounts of conventional adjuvants such as a surfactant e.g. a fluorocarbon surfactant such as a mixture of fluoroaliphatic polymeric esters or a silicane copolymer surfactant or others.
- a surfactant e.g. a fluorocarbon surfactant such as a mixture of fluoroaliphatic polymeric esters or a silicane copolymer surfactant or others.
- the present compositions can be cured thermally or by radiation induced free radical polymerization; however, an advantage of this invention is the ability to cure the compositions by cationically induced radiation which avoids the disadvantages discussed in the foregoing disclosure.
- component (b) of the composition is an acrylate, e.g. bisphenol A epoxyacrylate.
- the flask was heated to 55-60°C. for 4 hours, during which time 40 g. of ethanol by-product was taken off.
- the vacuum was then removed and nitrogen gas was introduced.
- the flask was then heated to 110°C. under ambient pressure. After 12 hours an additional 78 g. of ethanol by-product was removed.
- the crude reaction product (463 g.) was flash distilled.
- the main fraction (292 g.) distilling at 100-200°C. under 3 mm Hg was found to contain 85% tris (vinyl oxybutyl) ethyl orthosilicate and 15% bis (vinyl oxybutyl) ethyl orthosilicate.
- B. A separate 50 g. portion of the crude reaction product was flash distilled at 210°C. , 1 mm Hg. Analysis of 47 g.
- a 3-necked 100 ml round bottomed flask, equipped with a magnetic stirrer, vertical water condenser connected to vacuum via a trap and nitrogen gas inlet was charged with 25 g. of the above main fraction (Example IA) , 40 g. of hydroxybutyl vinyl ether and 0.5 g. of KOH.
- the flask was heated to 100°C. under a blanket of nitrogen for a period of 5 hours after which the mixture was flash distilled, unreacted material removed at 100°C. under 3 mm Hg and the remaining distillate collected.
- the collected distillate was found to be a mixture of 87% tris (vinyl oxybutyl ethyl) orthosilicate and 10% tetra (vinyl oxybutyl ethyl) orthosilicate.
- Example 1 The main fraction of Example 1 (Part A) was mixed with an equal weight amount of the diglycidyl ether of bisphenol A (EPON-828, Shell), 1 part per hundred parts of resin of a fluorochemical surfactant (FC-430) , and 4 parts per hundred parts of resin of a cationic photoinitiator FX-512 at 50°C. until a homogeneous low viscosity liquid was obtained.
- This mixture was then coated on an aluminum substrate at a thickness of 1.2 mil. The coated surface was exposed for less than 1 second to 400 millijoules/cm 2 from a mercury vapor lamp. A tack free, film was produced. Coating properties reported in the following table were determined immediately after UV exposure and after a post cure at 177°C. for 15 minutes. - 11 -
- Example 3 The mixture described in Example 3 was coated on a polyester substrate at a thickness of 0.5 mil. The coated surface was exposed to 400 millijoules/cm 2 UV light for less than 1 second and post cured for 2 hours at 50°C. Chemical resistance was tested by the covered spot test (ASTM D 1308) . No attack was observed after 24 hours exposure to 1% H 2 S0 4 , 1% NaOH, 10% acetic acid, or distilled water.
- Example 3 The mixture described in Example 3 was coated on an aluminum panel at a thickness of 0.25 mil. The coated surface was exposed to an electron beam dosage of 3 Mrads for less than 1 second to produce a tack free film. Coating properties reported in the following Table were determined immediately after electron beam exposure and after a post cure at 150°C. for 15 minutes. TABLE
- Example 1 part A The main fraction of Example 1 part A (25.0 gm) was mixed with the divinyl ether of triethylene glycol (25.0 gm) a bisphenol A epoxy acrylate oligomer (EBECRYL-3700, Radcure Specialties, 50.0 gm) , 2 phr* cationic photoinitiator (FX 512) , 2 phr* free radical photoinitiator (IRGACURE-184) and 1 phr* fluorochemical surfactant (FC-430) at 50°C. until a homogeneous low viscosity liquid was obtained, this mixture was then coated on a polyester substrate at a thickness of 0.5 mil. The coated surface was exposed to 400 millijoules/cm 2 from a mercury vapor lamp for less than 1 second. A tack free coating with the following properties was produced.
- Example l part A The main fraction from Example l part A (6.20 gm) was mixed with the divinyl ether of triethylene glycol (18.8 gm) and a divinyl ether urethane oligomer (prepared as described in the Degree Thesis of Lennart Carlsson, Dept. of Polymer Technology, The Royal Institute of Technology, Sweden, 1987; 25.0 gm) ; 4 phr cationic photoinitiator (FX-512) , and 1 phr fluorochemical surfactant (FC.-430) at 50°C. until a homogeneous low viscosity liquid was obtained.
- This mixture was then coated on a aluminum panel (0.25 mil) and exposed to 400 millijoules/cm 2 from a mercury vapor lamp for less than 1 second. A tack free coating with the following properties was produced
- the coated substrate was then exposed for less than one second at room temperature to 400 milli J/cirr radiation from a medium pressure mercury vapor lamp; after which the substrate having a highly crosslinked strongly adhesive coating* was removed.
- the coating is resistant to attack by methyl ethyl ketone and is abrasion resistant.
- a two mil thick layer of a mixture of 98 wt. % of the tetraprop-1-enyl ether of pentaerythritol and 2.0 wt. % of the triphenyl sulfonium salt of hexafluorophosphate is applied to a polyester substrate.
- the coated layer is then crosslinked by exposure for about one second at room temperature to electron beam radiation at a dosage of 3 Mrad.
- the resulting highly crosslinked polymer exhibits strong adhesion, is highly resistant to chemical attack and has superior abrasion resistant properties.
- Example 8 Each of the samples A, B, and C were coated in a thickness of 0.11-0.15 mil on an aluminum panel and then cured by exposure to UV light as described in Example 8. The cured coatings were evaluated and the results are reported in the following Table.
- Example 10 also demonstrates the high cure speed of the di-propenyl ethers as compared to the di-epoxy compound.
- This example illustrates the necessity of the cationic photoinitiator and the superior solvent resistance obtained using a cationic and free radical initiator.
- Example 11A is repeated except that the 50 grams of cis,cis- dipropenyl ether of triethylene glycol is replaced with 50 grams of a 1 to l wt. % blend of cis,cis- dipropenyl ether of triethylene glycol and the divinyl ether of 1,4-cyclohexane dimethanol.
- Example 11A is repeated except that the 50 grams of cis,cis- dipropenyl ether of triethylene glycol is replaced with 50 grams of the divinyl ether of 1,4-cyclohexane dimethanol.
- the cationic initiator failed to dissolve in the absence ' of the propenyl ether and an in compatible mixture was formed.
- This example illustrates that coating hardness can be significantly improved by adding the divinyl ether of 1,4-cyclohexane dimethanol; and that, the dipropenyl ether of triethylene glycol is needed to insure compatibility.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Silicates d'éther alk-1-ényle de la formule (I): [X]4-nSi[OR1OCH=CH-R2]n, et procédé de production desdits silicates, X étant un halogène ou -OR, R étant un alkyle inférieur ou un mélange d'halogène et d'OR, un mélange d'OR et d'hydrogéne ou un mélange d'halogène et d'hydrogène; R1 contenant 1 à 8 atomes de carbone et étant un alkylène, un alkénylène, un alkynylène, optionnellement alkoxylés avec jusqu'à 20 unités de α, Y étant de l'hydrogène ou du méthyle et R2 étant chacun de l'hydrogène ou un alkle inférieur et n ayant une valeur de 1 à 4; et éther alkényle polyfonctionnel de la formule (II): A[(CH2O)m(Z)zCH=CHR]n, A étant un atome de carbone, un -OCH=CHR ou un [aklyle C1 à C10]4-n; R étant un alkyle C1 à C6; Z étant un alkylènéoxy C2 à C8; r ayant une valeur de 0 à 6; m ayant une valeur de 0 à 1 et l'un des deux au moins, de r et m, ayant une valeur positive; n ayant une valeur de 1 à 4, à condition que m soit égal à 0 et que n soit égal à 1 lorsque A est un -OCH=CHR, que n ait une valeur de 2 ou 3 lorsque A est un [alkyle C1 à C10]4-n et que n ait une valeur de 4 lorsque A est du carbone. La présente invention décrit également des compositions réticulables, polymérisables par radiation contenant (a) de 0,1 à environ 5 % en poids d'un initiateur contenant au moins 25 % d'initiateur cationique, (b) d'environ 0 à environ 60 % en poids d'un éther vinylique, d'un époxyde, d'un uréthane ou d'un acrylate vinyloxy alkyl polymérisables et (c) d'environ 35 à environ 99,9 % en poids d'un éther de la formule (II).
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US470,489 | 1990-01-26 | ||
US07/470,487 US5045572A (en) | 1990-01-26 | 1990-01-26 | Radiation curable cross linkable compositions containing an aliphatic polyfunctional alkenyl ether |
US07/470,489 US5039716A (en) | 1990-01-26 | 1990-01-26 | Alk-1-enyl ether silicates and radiation curable composition containing alk-1-enyl ether silicates |
US470,487 | 1990-01-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1991011467A1 true WO1991011467A1 (fr) | 1991-08-08 |
Family
ID=27043096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1990/006758 WO1991011467A1 (fr) | 1990-01-26 | 1990-11-23 | Ethers alkenyles et compositions polymerisables par radiation |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU6893691A (fr) |
CA (1) | CA2031114A1 (fr) |
WO (1) | WO1991011467A1 (fr) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992022609A1 (fr) * | 1991-06-13 | 1992-12-23 | Teroson Gmbh | Produit d'etancheite et adhesifs a base de prepolymeres modifies par des silanes |
US5384342A (en) * | 1993-08-30 | 1995-01-24 | Dsm Desotech, Inc. | Vinyl ether urethane silanes |
DE19500241A1 (de) * | 1995-01-05 | 1996-07-11 | Thera Ges Fuer Patente | Radikalisch polymerisierbare Zubereitungen und ihre Verwendung |
EP0826718A2 (fr) * | 1996-09-03 | 1998-03-04 | Dow Corning Corporation | Fibres SiCO amorphes et fibres SiC cristallins à partir de résines de polysiloxanes durcissables ayant des groupes alk-1-ényléther |
EP0979233A1 (fr) * | 1997-04-21 | 2000-02-16 | NeXstar Pharmaceuticals, Inc. | Synthese d'oligonucleotides en solution |
EP1004602A1 (fr) * | 1998-11-25 | 2000-05-31 | Dow Corning Corporation | Polyisobutylènes fonctionnalisés d'éthers alcényliques et leur procédé de préparation |
US6187834B1 (en) * | 1999-09-08 | 2001-02-13 | Dow Corning Corporation | Radiation curable silicone compositions |
JP2019011296A (ja) * | 2017-06-30 | 2019-01-24 | 協立化学産業株式会社 | 新規重合性化合物及び柔軟性樹脂組成物 |
CN113755046A (zh) * | 2020-06-03 | 2021-12-07 | 三星Sdi株式会社 | 用于封装有机发光二极管的组合物和包括由其形成的有机层的有机发光二极管显示器 |
CN117601456A (zh) * | 2024-01-22 | 2024-02-27 | 四川省宜宾普什建材有限责任公司 | 一种大口径的电热熔式塑料管件的加工工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3804795A (en) * | 1972-11-06 | 1974-04-16 | Dow Chemical Co | High molecular weight resins having low solution viscosities |
US3842019A (en) * | 1969-04-04 | 1974-10-15 | Minnesota Mining & Mfg | Use of sulfonic acid salts in cationic polymerization |
US4654379A (en) * | 1985-12-05 | 1987-03-31 | Allied Corporation | Semi-interpenetrating polymer networks |
JPS6429450A (en) * | 1987-07-24 | 1989-01-31 | Dainippon Ink & Chemicals | Curable resin composition |
US4885319A (en) * | 1988-02-29 | 1989-12-05 | Gaf Corporation | Solvent resistant irradiation curable coatings |
-
1990
- 1990-11-23 WO PCT/US1990/006758 patent/WO1991011467A1/fr unknown
- 1990-11-23 AU AU68936/91A patent/AU6893691A/en not_active Abandoned
- 1990-11-29 CA CA002031114A patent/CA2031114A1/fr not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3842019A (en) * | 1969-04-04 | 1974-10-15 | Minnesota Mining & Mfg | Use of sulfonic acid salts in cationic polymerization |
US3804795A (en) * | 1972-11-06 | 1974-04-16 | Dow Chemical Co | High molecular weight resins having low solution viscosities |
US4654379A (en) * | 1985-12-05 | 1987-03-31 | Allied Corporation | Semi-interpenetrating polymer networks |
JPS6429450A (en) * | 1987-07-24 | 1989-01-31 | Dainippon Ink & Chemicals | Curable resin composition |
US4885319A (en) * | 1988-02-29 | 1989-12-05 | Gaf Corporation | Solvent resistant irradiation curable coatings |
Non-Patent Citations (1)
Title |
---|
CHEMICAL ABSTRACTS, Vol. 79, 1973, Abstract No. 5702W. * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992022609A1 (fr) * | 1991-06-13 | 1992-12-23 | Teroson Gmbh | Produit d'etancheite et adhesifs a base de prepolymeres modifies par des silanes |
US5384342A (en) * | 1993-08-30 | 1995-01-24 | Dsm Desotech, Inc. | Vinyl ether urethane silanes |
DE19500241A1 (de) * | 1995-01-05 | 1996-07-11 | Thera Ges Fuer Patente | Radikalisch polymerisierbare Zubereitungen und ihre Verwendung |
EP0826718A2 (fr) * | 1996-09-03 | 1998-03-04 | Dow Corning Corporation | Fibres SiCO amorphes et fibres SiC cristallins à partir de résines de polysiloxanes durcissables ayant des groupes alk-1-ényléther |
EP0826718A3 (fr) * | 1996-09-03 | 1998-09-16 | Dow Corning Corporation | Fibres SiCO amorphes et fibres SiC cristallins à partir de résines de polysiloxanes durcissables ayant des groupes alk-1-ényléther |
EP0979233A4 (fr) * | 1997-04-21 | 2001-03-21 | Proligo L L C | Synthese d'oligonucleotides en solution |
EP0979233A1 (fr) * | 1997-04-21 | 2000-02-16 | NeXstar Pharmaceuticals, Inc. | Synthese d'oligonucleotides en solution |
EP1004602A1 (fr) * | 1998-11-25 | 2000-05-31 | Dow Corning Corporation | Polyisobutylènes fonctionnalisés d'éthers alcényliques et leur procédé de préparation |
US6187834B1 (en) * | 1999-09-08 | 2001-02-13 | Dow Corning Corporation | Radiation curable silicone compositions |
JP2019011296A (ja) * | 2017-06-30 | 2019-01-24 | 協立化学産業株式会社 | 新規重合性化合物及び柔軟性樹脂組成物 |
CN113755046A (zh) * | 2020-06-03 | 2021-12-07 | 三星Sdi株式会社 | 用于封装有机发光二极管的组合物和包括由其形成的有机层的有机发光二极管显示器 |
CN115678326A (zh) * | 2020-06-03 | 2023-02-03 | 三星Sdi株式会社 | 用于封装有机发光二极管的组合物和包括由其形成的有机层的有机发光二极管显示器 |
CN117601456A (zh) * | 2024-01-22 | 2024-02-27 | 四川省宜宾普什建材有限责任公司 | 一种大口径的电热熔式塑料管件的加工工艺 |
CN117601456B (zh) * | 2024-01-22 | 2024-03-26 | 四川省宜宾普什建材有限责任公司 | 一种大口径的电热熔式塑料管件的加工工艺 |
Also Published As
Publication number | Publication date |
---|---|
AU6893691A (en) | 1991-08-21 |
CA2031114A1 (fr) | 1991-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5045572A (en) | Radiation curable cross linkable compositions containing an aliphatic polyfunctional alkenyl ether | |
AU599453B2 (en) | Carbon michael cure activated by tertiary amines and epoxides | |
KR970021135A (ko) | 폴리알콕시실록산 및 그의 제조 방법 | |
WO1991011467A1 (fr) | Ethers alkenyles et compositions polymerisables par radiation | |
EP2787017A2 (fr) | Produits d'addition de résine époxy et leurs produits thermodurcis | |
EP0458296B1 (fr) | Résines époxydes modifiées contenant de l'insaturation acétylénique | |
US5039716A (en) | Alk-1-enyl ether silicates and radiation curable composition containing alk-1-enyl ether silicates | |
US5055357A (en) | Radiation curable cross linkable compositions | |
JP4214591B2 (ja) | 含フッ素オキセタン化合物、当該重合体、当該組成物および当該製造方法 | |
US5276174A (en) | Alk-1-enyloxy carbonates | |
JP3047800B2 (ja) | 側鎖にオキセタニル基を含有する重合体の製造方法 | |
AU639312B2 (en) | Vinyl ether compounds | |
CA1340725C (fr) | Methode pour preparer une resine epoxyde modifiee | |
JP3657720B2 (ja) | 高分子エポキシ樹脂の製造方法 | |
US3673275A (en) | Acrylic polymers containing epoxy radicals | |
US4980428A (en) | Epoxy vinyl ethers and synthesis of an epoxy vinyl ether from a hydroxylated vinyl ether and a polyepoxide | |
CA1105042A (fr) | Resines d'epoxyde, et methode de production connexe | |
US5096783A (en) | Substrate coated with epoxy vinyl ether | |
US4980430A (en) | Epoxy vinyl ethers and synthesis of an epoxy vinyl ether from a hydroxylated vinyl ether and a diepoxide | |
US5094917A (en) | Alk-1-enyl ether silicates | |
AU646824B2 (en) | Vinyl ethers synthesized from hydroxylated vinyl ethers and polyepoxides | |
US5254710A (en) | Alkenyl ether polycarbonates | |
US5200437A (en) | Coating compositions containing alk-1-enyl ethers | |
US5358978A (en) | Alkenyl ether polycarbonates | |
US5243089A (en) | Alk-1-enyl ethers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AU |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FR GB GR IT LU NL SE |