WO1991002371A1 - Switched anode field emission device - Google Patents
Switched anode field emission device Download PDFInfo
- Publication number
- WO1991002371A1 WO1991002371A1 PCT/US1990/003385 US9003385W WO9102371A1 WO 1991002371 A1 WO1991002371 A1 WO 1991002371A1 US 9003385 W US9003385 W US 9003385W WO 9102371 A1 WO9102371 A1 WO 9102371A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- electrons
- substrate
- field emission
- anode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/304—Field-emissive cathodes
- H01J1/3042—Field-emissive cathodes microengineered, e.g. Spindt-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J21/00—Vacuum tubes
- H01J21/02—Tubes with a single discharge path
- H01J21/06—Tubes with a single discharge path having electrostatic control means only
- H01J21/10—Tubes with a single discharge path having electrostatic control means only with one or more immovable internal control electrodes, e.g. triode, pentode, octode
- H01J21/105—Tubes with a single discharge path having electrostatic control means only with one or more immovable internal control electrodes, e.g. triode, pentode, octode with microengineered cathode and control electrodes, e.g. Spindt-type
Definitions
- This invention relates generally to field emission devices.
- Field emission devices are known in the art. Such prior art devices are constructed in a vertical profile by means of complex deposition, etching, and evaporative metalization processes. Since the device elements are overlayed, the inter-element capacitances become significant and affect the performance of the device.
- Such prior art devices include a cathode, a gate to aid in controlling the emissions of the cathode, and an anode. Provision of only these three electrodes will not allow the resultant device to satisfactorily meet certain application needs.
- the planar field emission device disclosed herein.
- three electrodes of the device are disposed substantially co- planar with respect to one another, and not vertically.
- the device can be constructed in a simpler manner, and inter-element capacitance is minimized due to the improved proximity of the electrodes to a support surface.
- the device includes a fourth electrode, which serves as a secondary anode. Electrons emitted by the cathode are collected by whichever of the two anodes are selectively engaged.
- Fig. 1 comprises a side elevational view of the invention
- Fig. 2 comprises a top plan view of the invention
- Fig. 3 comprises a perspective view of the invention.
- Fig. 4 comprises a top plan view of an alternative embodiment of the invention.
- the device includes generally a substrate (101), a first electrode (102), a second electrode (103), a third electrode (104), and a fourth electrode (110).
- the substrate should generally be comprised of an insulator (a conductor may be used, but the upper surface of the conductor should be coated with an insulating layer).
- the first electrode (102) in this embodiment, comprises an emitter.
- multiple layers of insulating material (106) in this case silicon dioxide
- the conductive layer (107) comprising the first electrode (102) has a pointed portion (108).
- the second electrode (103) forms a gate and is formed by successive depositions of conductive material. Importantly, as visible in Fig. 2, the second electrode (103) includes a notch (109) formed therein for receiving the pointed end (108) of the first electrode (102). The purpose of this configuration will be made more clear below.
- the third electrode (104) comprises a first collector and is formed by successive depositions of conductive material (11 1 ) on the surface of the substrate (101 ).
- the pointed tip (108) of the first electrode (102) is disposed within the notch area (109) formed in the gate (103).
- the insulator (106) and the air gap ensures that the first electrode (102) does not contact the gate (103).
- the fourth electrode (1 10) comprises a second collector and is formed by deposition of conductive material within a notch formed in the substrate (101 ).
- This notch can either be formed through an etching process, or the conductive material can be added during a substrate building material deposition process.
- appropriate field induced electron emission can be selectively achieved in at least two modes of operation.
- the required field is applied as a voltage to the gate (103) that is in sufficiently close proximity to the emitter (102) to induce electron emission.
- the emitted electrons are then transported from the emitter (102) to one of the collectors (104 and 1 10) in vacuum or atmosphere, as appropriate to the application.
- the dominant collector will be determined as a function primarily of the voltage applied thereto. In general, a somewhat stronger potential needs to be applied to the first collector (104) to compensate for the distance between the first collector (104) and the emitter (102). Conversely, a lesser voltage is required for the second collector (110) to achieve the same result.
- Energization, and off-device coupling, of the two collectors (anodes) can be selected as appropriate to a particular application.
- each device is formed substantially as described above, with the process replicated numerous times to achieve multiple parallel connected devices.
Landscapes
- Cold Cathode And The Manufacture (AREA)
- Electron Sources, Ion Sources (AREA)
- Discharge Heating (AREA)
Abstract
A field emission device wherein two collecting electrodes (104 and 106) are provided to selectively collect electrons that are emitted from an emitting electrode (108) as induced by a gate electrode (103).
Description
SWITCHED ANODE FIELD EMISSION DEVICE
Technical Field
This invention relates generally to field emission devices.
Background Art
Field emission devices are known in the art. Such prior art devices are constructed in a vertical profile by means of complex deposition, etching, and evaporative metalization processes. Since the device elements are overlayed, the inter-element capacitances become significant and affect the performance of the device.
Typically, such prior art devices include a cathode, a gate to aid in controlling the emissions of the cathode, and an anode. Provision of only these three electrodes will not allow the resultant device to satisfactorily meet certain application needs.
There therefore exists a need for a field emission device that can be constructed in a simpler manner, that minimizes inter-element capacitance, and that meets appications needs not currently satisfied.
Summary of the Invention
These needs and other needs are substantially met through provision of the planar field emission device disclosed herein. According to the invention, three electrodes of the device are disposed substantially co- planar with respect to one another, and not vertically. As a result, the device can be constructed in a simpler manner, and inter-element capacitance is minimized due to the improved proximity of the electrodes to a support surface. In addition, in one embodiment, the device includes a fourth electrode, which serves as a secondary anode. Electrons emitted by the cathode are collected by whichever of the two anodes are selectively engaged.
Brief Description of the Drawings
Fig. 1 comprises a side elevational view of the invention;
Fig. 2 comprises a top plan view of the invention;
Fig. 3 comprises a perspective view of the invention; and
Fig. 4 comprises a top plan view of an alternative embodiment of the invention.
Best Mode For Carrying Out The Invention
Referring to Fig. 1 , the invention can be seen as depicted generally by the numeral 100. The device includes generally a substrate (101), a first electrode (102), a
second electrode (103), a third electrode (104), and a fourth electrode (110). The substrate should generally be comprised of an insulator (a conductor may be used, but the upper surface of the conductor should be coated with an insulating layer). The first electrode (102), in this embodiment, comprises an emitter. To form the emitter, multiple layers of insulating material (106) (in this case silicon dioxide) are deposited on the substrate (101 ) and a conductive layer (107) deposited thereon. With momentary reference to Fig. 2, the conductive layer (107) comprising the first electrode (102) has a pointed portion (108). This wedge shaped portion functions, when the device is operational, to source electrons as explained in more detail below. The second electrode (103) forms a gate and is formed by successive depositions of conductive material. Importantly, as visible in Fig. 2, the second electrode (103) includes a notch (109) formed therein for receiving the pointed end (108) of the first electrode (102). The purpose of this configuration will be made more clear below.
The third electrode (104) comprises a first collector and is formed by successive depositions of conductive material (11 1 ) on the surface of the substrate (101 ). With reference to Fig. 3, it can be more clearly seen that the pointed tip (108) of the first electrode (102) is disposed within the notch area (109) formed in the gate (103). At the same time, the insulator (106) and the air gap ensures that the first electrode (102) does not contact the gate (103). Lastly, the fourth electrode (1 10) comprises a second collector and is formed by deposition of conductive
material within a notch formed in the substrate (101 ). (This notch can either be formed through an etching process, or the conductive material can be added during a substrate building material deposition process.) So configured, appropriate field induced electron emission can be selectively achieved in at least two modes of operation. The required field is applied as a voltage to the gate (103) that is in sufficiently close proximity to the emitter (102) to induce electron emission. The emitted electrons are then transported from the emitter (102) to one of the collectors (104 and 1 10) in vacuum or atmosphere, as appropriate to the application. The dominant collector will be determined as a function primarily of the voltage applied thereto. In general, a somewhat stronger potential needs to be applied to the first collector (104) to compensate for the distance between the first collector (104) and the emitter (102). Conversely, a lesser voltage is required for the second collector (110) to achieve the same result. Energization, and off-device coupling, of the two collectors (anodes) can be selected as appropriate to a particular application.
Referring to Fig. 4, it can be seen that a plurality of such three electrode devices can be formed on a substrate (101 ) in a parallel manner, to achieve improved power capabilities. In this embodiment, each device is formed substantially as described above, with the process replicated numerous times to achieve multiple parallel connected devices.
What is claimed is:
Claims
1 . A field emission device, comprising: A) an emitter for emitting electrons; B) a first anode disposed substantially coplanar with resepct to the emitter for collecting at least some of the electrons;
C) a second anode for selectively collecting at least some of the electrons, such that when the second anode collects electrons, the first anode does not collect electrons.
2. The field emission device of claim 1 , wherein the device further includes a gate that acts to induce electron emission from the emitter.
3. A field emission device, comprising:
A) a substrate;
B) emitter means formed on the substrate for emitting electrons; C) first anode means formed on the substrate and disposed substantially coplanar with respect to the emitter means for collecting at least some of the electrons;
D) second anode means formed on the substrate for selectively collecting at least some of the electrons, such that when the second anode means collects electrons, the first anode means does not collect electrons.
4. The field emission device of claim 1 , wherein the device further includes a gate that acts to induce electron emission from the emitter.
5. A method of forming a field emission device, comprising:
A) providing a substrate;
B) forming a first electrode on the substrate, which first electrode acts as an electron source;
C) forming a second electrode on the substrate substantially co-planar with the first electrode, which second electrode acts to induce electron emission from the first electrode; D) forming a third electrode on the substrate substantially co-planar with the first electrode, which third electrode acts to collect at least some of the electrons sourced by the first electrode;
E) forming a fourth electrode on the substrate, which fourth electrode acts to collect at least some of the electrons sourced by the first electrode, such that when the fourth electrode collects electrons, the third electrode does not collect electrons.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR909006876A BR9006876A (en) | 1989-08-08 | 1990-06-18 | FIELD EMISSION DEVICE AND PROCESS FOR ITS FORMATION |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US391,211 | 1989-08-08 | ||
US07/391,211 US4956574A (en) | 1989-08-08 | 1989-08-08 | Switched anode field emission device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1991002371A1 true WO1991002371A1 (en) | 1991-02-21 |
Family
ID=23545730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1990/003385 WO1991002371A1 (en) | 1989-08-08 | 1990-06-18 | Switched anode field emission device |
Country Status (7)
Country | Link |
---|---|
US (1) | US4956574A (en) |
EP (1) | EP0452425A1 (en) |
JP (1) | JPH04502229A (en) |
AU (1) | AU621001B2 (en) |
BR (1) | BR9006876A (en) |
HU (1) | HUT57944A (en) |
WO (1) | WO1991002371A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0513777A2 (en) * | 1991-05-13 | 1992-11-19 | Seiko Epson Corporation | Multiple electrode field electron emission device and process for manufacturing it |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0364964B1 (en) * | 1988-10-17 | 1996-03-27 | Matsushita Electric Industrial Co., Ltd. | Field emission cathodes |
JP2745814B2 (en) * | 1989-09-29 | 1998-04-28 | モトローラ・インコーポレイテッド | Flat panel display using field emission device |
US5079476A (en) * | 1990-02-09 | 1992-01-07 | Motorola, Inc. | Encapsulated field emission device |
US5136764A (en) * | 1990-09-27 | 1992-08-11 | Motorola, Inc. | Method for forming a field emission device |
JP2613669B2 (en) * | 1990-09-27 | 1997-05-28 | 工業技術院長 | Field emission device and method of manufacturing the same |
JP2562168Y2 (en) * | 1990-11-08 | 1998-02-10 | 双葉電子工業株式会社 | Field emission device |
US5173634A (en) * | 1990-11-30 | 1992-12-22 | Motorola, Inc. | Current regulated field-emission device |
CA2058504C (en) * | 1990-12-28 | 1998-10-06 | Naoto Nakamura | Image forming apparatus |
EP0498254B1 (en) * | 1991-01-28 | 1996-03-27 | Sony Corporation | Microelectronic ballistic transistor and process of manufacturing the same |
US5140219A (en) * | 1991-02-28 | 1992-08-18 | Motorola, Inc. | Field emission display device employing an integral planar field emission control device |
US5660570A (en) * | 1991-04-09 | 1997-08-26 | Northeastern University | Micro emitter based low contact force interconnection device |
US5220725A (en) * | 1991-04-09 | 1993-06-22 | Northeastern University | Micro-emitter-based low-contact-force interconnection device |
US5245248A (en) * | 1991-04-09 | 1993-09-14 | Northeastern University | Micro-emitter-based low-contact-force interconnection device |
US5144191A (en) * | 1991-06-12 | 1992-09-01 | Mcnc | Horizontal microelectronic field emission devices |
US5384509A (en) * | 1991-07-18 | 1995-01-24 | Motorola, Inc. | Field emission device with horizontal emitter |
US5382867A (en) * | 1991-10-02 | 1995-01-17 | Sharp Kabushiki Kaisha | Field-emission type electronic device |
US5272411A (en) * | 1992-01-28 | 1993-12-21 | Itt Corporation | Coaxial triode apparatus |
US5543684A (en) | 1992-03-16 | 1996-08-06 | Microelectronics And Computer Technology Corporation | Flat panel display based on diamond thin films |
US6127773A (en) * | 1992-03-16 | 2000-10-03 | Si Diamond Technology, Inc. | Amorphic diamond film flat field emission cathode |
US5686791A (en) * | 1992-03-16 | 1997-11-11 | Microelectronics And Computer Technology Corp. | Amorphic diamond film flat field emission cathode |
US5675216A (en) * | 1992-03-16 | 1997-10-07 | Microelectronics And Computer Technololgy Corp. | Amorphic diamond film flat field emission cathode |
US5424605A (en) * | 1992-04-10 | 1995-06-13 | Silicon Video Corporation | Self supporting flat video display |
US5477105A (en) * | 1992-04-10 | 1995-12-19 | Silicon Video Corporation | Structure of light-emitting device with raised black matrix for use in optical devices such as flat-panel cathode-ray tubes |
US5359256A (en) * | 1992-07-30 | 1994-10-25 | The United States Of America As Represented By The Secretary Of The Navy | Regulatable field emitter device and method of production thereof |
US5312777A (en) * | 1992-09-25 | 1994-05-17 | International Business Machines Corporation | Fabrication methods for bidirectional field emission devices and storage structures |
KR100307384B1 (en) * | 1993-01-19 | 2001-12-17 | 레오니드 다니로비치 카르포브 | Field emitter |
US5686790A (en) * | 1993-06-22 | 1997-11-11 | Candescent Technologies Corporation | Flat panel device with ceramic backplate |
WO1995012835A1 (en) * | 1993-11-04 | 1995-05-11 | Microelectronics And Computer Technology Corporation | Methods for fabricating flat panel display systems and components |
US5445550A (en) * | 1993-12-22 | 1995-08-29 | Xie; Chenggang | Lateral field emitter device and method of manufacturing same |
EP1186079B1 (en) * | 1999-05-25 | 2005-02-02 | NaWoTec GmbH | Miniaturized terahertz radiation source |
US7622562B2 (en) * | 2002-06-26 | 2009-11-24 | Zimmer Orthobiologics, Inc. | Rapid isolation of osteoinductive protein mixtures from mammalian bone tissue |
CA2533191C (en) * | 2003-07-22 | 2012-11-13 | Yeda Research And Development Company Ltd. | Electron emission device |
JP3907667B2 (en) * | 2004-05-18 | 2007-04-18 | キヤノン株式会社 | ELECTRON EMITTING ELEMENT, ELECTRON EMITTING DEVICE, ELECTRON SOURCE USING SAME, IMAGE DISPLAY DEVICE AND INFORMATION DISPLAY REPRODUCING DEVICE |
CN110875165A (en) * | 2018-08-30 | 2020-03-10 | 中国科学院微电子研究所 | Field emission cathode electron source and array thereof |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4578614A (en) * | 1982-07-23 | 1986-03-25 | The United States Of America As Represented By The Secretary Of The Navy | Ultra-fast field emitter array vacuum integrated circuit switching device |
US4663559A (en) * | 1982-09-17 | 1987-05-05 | Christensen Alton O | Field emission device |
US4721885A (en) * | 1987-02-11 | 1988-01-26 | Sri International | Very high speed integrated microelectronic tubes |
US4728851A (en) * | 1982-01-08 | 1988-03-01 | Ford Motor Company | Field emitter device with gated memory |
US4827177A (en) * | 1986-09-08 | 1989-05-02 | The General Electric Company, P.L.C. | Field emission vacuum devices |
US4855636A (en) * | 1987-10-08 | 1989-08-08 | Busta Heinz H | Micromachined cold cathode vacuum tube device and method of making |
US4904895A (en) * | 1987-05-06 | 1990-02-27 | Canon Kabushiki Kaisha | Electron emission device |
US4940916A (en) * | 1987-11-06 | 1990-07-10 | Commissariat A L'energie Atomique | Electron source with micropoint emissive cathodes and display means by cathodoluminescence excited by field emission using said source |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3789471A (en) * | 1970-02-06 | 1974-02-05 | Stanford Research Inst | Field emission cathode structures, devices utilizing such structures, and methods of producing such structures |
US3755704A (en) * | 1970-02-06 | 1973-08-28 | Stanford Research Inst | Field emission cathode structures and devices utilizing such structures |
US3812559A (en) * | 1970-07-13 | 1974-05-28 | Stanford Research Inst | Methods of producing field ionizer and field emission cathode structures |
US3894332A (en) * | 1972-02-11 | 1975-07-15 | Westinghouse Electric Corp | Solid state radiation sensitive field electron emitter and methods of fabrication thereof |
JPS5325632B2 (en) * | 1973-03-22 | 1978-07-27 | ||
US3970887A (en) * | 1974-06-19 | 1976-07-20 | Micro-Bit Corporation | Micro-structure field emission electron source |
JPS5436828B2 (en) * | 1974-08-16 | 1979-11-12 | ||
US3921022A (en) * | 1974-09-03 | 1975-11-18 | Rca Corp | Field emitting device and method of making same |
US4178531A (en) * | 1977-06-15 | 1979-12-11 | Rca Corporation | CRT with field-emission cathode |
SU855782A1 (en) * | 1977-06-28 | 1981-08-15 | Предприятие П/Я Г-4468 | Electron emitter |
US4307507A (en) * | 1980-09-10 | 1981-12-29 | The United States Of America As Represented By The Secretary Of The Navy | Method of manufacturing a field-emission cathode structure |
US4513308A (en) * | 1982-09-23 | 1985-04-23 | The United States Of America As Represented By The Secretary Of The Navy | p-n Junction controlled field emitter array cathode |
FR2568394B1 (en) * | 1984-07-27 | 1988-02-12 | Commissariat Energie Atomique | DEVICE FOR VIEWING BY CATHODOLUMINESCENCE EXCITED BY FIELD EMISSION |
FR2604823B1 (en) * | 1986-10-02 | 1995-04-07 | Etude Surfaces Lab | ELECTRON EMITTING DEVICE AND ITS APPLICATION IN PARTICULAR TO THE PRODUCTION OF FLAT TELEVISION SCREENS |
US4685996A (en) * | 1986-10-14 | 1987-08-11 | Busta Heinz H | Method of making micromachined refractory metal field emitters |
GB2204991B (en) * | 1987-05-18 | 1991-10-02 | Gen Electric Plc | Vacuum electronic devices |
US4874981A (en) * | 1988-05-10 | 1989-10-17 | Sri International | Automatically focusing field emission electrode |
-
1989
- 1989-08-08 US US07/391,211 patent/US4956574A/en not_active Expired - Lifetime
-
1990
- 1990-06-18 WO PCT/US1990/003385 patent/WO1991002371A1/en not_active Application Discontinuation
- 1990-06-18 HU HU8653A patent/HUT57944A/en unknown
- 1990-06-18 JP JP2509887A patent/JPH04502229A/en active Pending
- 1990-06-18 EP EP90909883A patent/EP0452425A1/en not_active Withdrawn
- 1990-06-18 BR BR909006876A patent/BR9006876A/en not_active Application Discontinuation
- 1990-06-18 AU AU59263/90A patent/AU621001B2/en not_active Ceased
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728851A (en) * | 1982-01-08 | 1988-03-01 | Ford Motor Company | Field emitter device with gated memory |
US4578614A (en) * | 1982-07-23 | 1986-03-25 | The United States Of America As Represented By The Secretary Of The Navy | Ultra-fast field emitter array vacuum integrated circuit switching device |
US4663559A (en) * | 1982-09-17 | 1987-05-05 | Christensen Alton O | Field emission device |
US4827177A (en) * | 1986-09-08 | 1989-05-02 | The General Electric Company, P.L.C. | Field emission vacuum devices |
US4721885A (en) * | 1987-02-11 | 1988-01-26 | Sri International | Very high speed integrated microelectronic tubes |
US4904895A (en) * | 1987-05-06 | 1990-02-27 | Canon Kabushiki Kaisha | Electron emission device |
US4855636A (en) * | 1987-10-08 | 1989-08-08 | Busta Heinz H | Micromachined cold cathode vacuum tube device and method of making |
US4940916A (en) * | 1987-11-06 | 1990-07-10 | Commissariat A L'energie Atomique | Electron source with micropoint emissive cathodes and display means by cathodoluminescence excited by field emission using said source |
US4940916B1 (en) * | 1987-11-06 | 1996-11-26 | Commissariat Energie Atomique | Electron source with micropoint emissive cathodes and display means by cathodoluminescence excited by field emission using said source |
Non-Patent Citations (1)
Title |
---|
See also references of EP0452425A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0513777A2 (en) * | 1991-05-13 | 1992-11-19 | Seiko Epson Corporation | Multiple electrode field electron emission device and process for manufacturing it |
EP0513777A3 (en) * | 1991-05-13 | 1993-10-20 | Seiko Epson Corp | Multiple electrode field electron emission device and process for manufacturing it |
US5386172A (en) * | 1991-05-13 | 1995-01-31 | Seiko Epson Corporation | Multiple electrode field electron emission device and method of manufacture |
Also Published As
Publication number | Publication date |
---|---|
HUT57944A (en) | 1991-12-30 |
AU5926390A (en) | 1991-03-11 |
HU905386D0 (en) | 1991-07-29 |
BR9006876A (en) | 1991-08-27 |
US4956574A (en) | 1990-09-11 |
JPH04502229A (en) | 1992-04-16 |
AU621001B2 (en) | 1992-02-27 |
EP0452425A1 (en) | 1991-10-23 |
EP0452425A4 (en) | 1991-07-24 |
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