JP2562168Y2 - Field emission device - Google Patents

Field emission device

Info

Publication number
JP2562168Y2
JP2562168Y2 JP1990116641U JP11664190U JP2562168Y2 JP 2562168 Y2 JP2562168 Y2 JP 2562168Y2 JP 1990116641 U JP1990116641 U JP 1990116641U JP 11664190 U JP11664190 U JP 11664190U JP 2562168 Y2 JP2562168 Y2 JP 2562168Y2
Authority
JP
Japan
Prior art keywords
emitter
gate
tip
emission device
field emission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990116641U
Other languages
Japanese (ja)
Other versions
JPH0474834U (en
Inventor
茂生 伊藤
行雄 小川
和彦 円谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Futaba Corp
Original Assignee
Futaba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Futaba Corp filed Critical Futaba Corp
Priority to JP1990116641U priority Critical patent/JP2562168Y2/en
Publication of JPH0474834U publication Critical patent/JPH0474834U/ja
Application granted granted Critical
Publication of JP2562168Y2 publication Critical patent/JP2562168Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は電界放出素子(Field Emission Cathodes,以
下FECとも呼ぶ。)に関するものである。本考案の電界
放出素子は、各種表示装置、マイクロ真空管、光源、増
幅素子、高速スイッチング素子、センサー等における電
子源として有用である。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a field emission device (hereinafter, also referred to as FEC). The field emission device of the present invention is useful as an electron source in various display devices, micro vacuum tubes, light sources, amplification devices, high-speed switching devices, sensors, and the like.

〔従来の技術〕[Conventional technology]

第8図は、電界放出素子の一構造例であるいわゆる平
面型(プレーナ型)の構造図である。
FIG. 8 is a so-called planar type (planar type) structure diagram which is an example of the structure of the field emission device.

絶縁性の基板200上には、中央に突端部201を備えたエ
ミッタ202が設けられている。このエミッタ202に隣接し
て、前記突端部201に対応する部分が開口部203とされた
2個1組のゲート204,204が設けられている。ここで、
エミッタ202の突端部201は、2個のゲート204,204を結
ぶ線から一定の距離をおいている。即ち、該突端部201
は開口部203内には位置していない。そして、このゲー
ト204を間にして前記エミッタ202と反対側の基板200上
には、ゲート204と平行にコレクタ205が設けられてい
る。
On an insulating substrate 200, an emitter 202 having a protruding end 201 at the center is provided. Adjacent to the emitter 202, a pair of gates 204, 204 each having an opening 203 at a portion corresponding to the protruding end 201, are provided. here,
The tip 201 of the emitter 202 is at a certain distance from the line connecting the two gates 204,204. That is, the tip 201
Is not located in the opening 203. A collector 205 is provided in parallel with the gate 204 on the substrate 200 opposite to the emitter 202 with the gate 204 therebetween.

ここで、エミッタ202とゲート204の間、及びゲート20
4とコレクタ205との間にそれぞれ所定の電位差を付与す
ると、エミッタ202の突端部201から放出された電子がゲ
ート204の開口部203を経てコレクタ205に到達する。
Here, between the emitter 202 and the gate 204 and the gate 20
When a predetermined potential difference is applied between 4 and the collector 205, electrons emitted from the tip 201 of the emitter 202 reach the collector 205 via the opening 203 of the gate 204.

〔考案が解決しようとする課題〕[Problems to be solved by the invention]

前記平面型の電界放出素子において十分な電子放出を
得るには、エミッタの先端部の電界強度を大きくしなけ
ればならない。そしてそのためにはゲート電極への印加
電圧を大きくする必要があった。
In order to obtain sufficient electron emission in the flat field emission device, the electric field intensity at the tip of the emitter must be increased. For that purpose, it was necessary to increase the voltage applied to the gate electrode.

しかし、ゲート電圧を一定値以上に大きくすると、放
電や局所的なゲートの加熱によるガス放出等が生じ、エ
ミッタの先端部が破損してしまうという問題があった。
However, when the gate voltage is increased to a certain value or more, there is a problem that gas discharge occurs due to discharge or local heating of the gate, and the tip of the emitter is damaged.

また、高耐圧トランジスタ等の高電圧駆動素子は高価
なので、製品としての低価格化を図るとともに十分な電
子放出を得るためには、ゲート電圧を低くしながらエミ
ッタの先端部のみに効果的な電界を作り出すことが必要
とされていたが、従来の電界放出素子はこのような条件
を満足するものではなかった。
Also, since high-voltage driving elements such as high-voltage transistors are expensive, in order to reduce the price of the product and obtain sufficient electron emission, an effective electric field is applied only to the tip of the emitter while lowering the gate voltage. However, the conventional field emission device did not satisfy such a condition.

〔課題を解決するための手段〕[Means for solving the problem]

本考案の電界放出素子は、基板の表面と平行に基板の
表面に密着して設けられ、その先端が実質的に一直線状
に並んだ複数の先端部を有する板状のエミッタと、前記
基板の表面と平行に基板の表面に密着して設けられ、前
記エミッタの各先端部の両側と前方を囲む複数の凹部を
有し、前記エミッタの先端部における電界強度を高める
とともに前記先端部の並ぶ方向に実質的に平行な電位分
布を前記エミッタの前方に生じさせる板状のゲートとを
有している。
The field emission device of the present invention is provided in close contact with the surface of the substrate in parallel with the surface of the substrate, and has a plate-like emitter having a plurality of tips whose tips are substantially linearly arranged; A plurality of recesses are provided in close contact with the surface of the substrate in parallel with the surface and surround both sides and the front of each of the tips of the emitter. The direction in which the tips are arranged while increasing the electric field strength at the tip of the emitter And a plate-like gate for generating a potential distribution substantially parallel to the front of the emitter.

〔作用〕[Action]

エミッタの先端部がゲートによって囲まれていると、
他の条件が同じであれば、囲まれていない場合に比べて
エミッタの先端部に発生する電界強度は大きくなる。ま
た、前記先端部の並ぶ方向に実質的に平行な電位分布が
前記エミッタの前方に生じる。従ってエミッタからの電
子の放出量が増大し、これをエミッタの前方に効率的に
送りだすことができる。
When the tip of the emitter is surrounded by the gate,
If the other conditions are the same, the intensity of the electric field generated at the tip of the emitter is larger than in the case where the emitter is not enclosed. Further, a potential distribution substantially parallel to the direction in which the tips are arranged is generated in front of the emitter. Therefore, the amount of electrons emitted from the emitter increases, and this can be efficiently sent to the front of the emitter.

〔実施例〕〔Example〕

本考案の実施例を第1図から第7図によって説明す
る。
An embodiment of the present invention will be described with reference to FIGS.

第1図〜第7図はプレーナ型の電界放出素子である。 1 to 7 show a planar type field emission device.

第1図に示す電界放出素子30は、基板31上に厚さのほ
ぼ等しいエミッタ32とゲート33を並設したものである。
矩形のエミッタ32の一縁辺には3角形状の先端部34が設
けられている。この先端部34に対応するゲート33の一縁
辺には凹部35が設けられており、エミッタ32の前記先端
部34を囲んでいる。
The field emission device 30 shown in FIG. 1 has an emitter 32 and a gate 33 having substantially the same thickness arranged on a substrate 31 side by side.
At one edge of the rectangular emitter 32, a triangular tip portion 34 is provided. A recess 35 is provided at one edge of the gate 33 corresponding to the tip 34, and surrounds the tip 34 of the emitter 32.

このような構成によると、駆動条件が同じでもエミッ
タ32の先端部34での電界強度を従来のプレーナ型の電界
放出素子に比べて大きくすることができる。即ち、ゲー
ト33への印加電圧を大きくすることなくエミッタ32の先
端部34の電界強度を大きくして電子の放出量を増大させ
ることができる。
According to such a configuration, the electric field strength at the distal end portion 34 of the emitter 32 can be increased as compared with the conventional planar type field emission device even under the same driving conditions. That is, without increasing the voltage applied to the gate 33, the electric field strength at the tip portion 34 of the emitter 32 can be increased to increase the amount of emitted electrons.

第2図はプレーナ型の電界放出素子の他の実施例であ
る。この電界放出素子40のように、エミッタ32の先端部
34を囲むゲート41の凹部42を矩形状にしても、第1図の
実施例と同様の作用効果が得られる。
FIG. 2 shows another embodiment of the planar type field emission device. Like the field emission device 40, the tip of the emitter 32
Even if the recess 42 of the gate 41 surrounding the gate 34 is rectangular, the same operation and effect as the embodiment of FIG. 1 can be obtained.

第3図はプレーナ型の他の実施例の電界放出素子50で
ある。このように、エミッタ51の先端部52をコ字形のゲ
ートで囲むようにしてもよい。
FIG. 3 shows a planar type field emission device 50 according to another embodiment. As described above, the tip 52 of the emitter 51 may be surrounded by the U-shaped gate.

第4図はプレーナ型の他の実施例である。この電界放
出素子60では、エミッタ及びゲート本体のパターンは第
1図のものとほぼ同じであるが、ゲート61はエミッタ62
よりも薄く、ゲート61の凹部63を囲むように円柱形のピ
ン64が立設されている。このように、エミッタ62の先端
部65をゲート61の凹部63及びピン64で囲むようにしても
プレーナ型の前記各実施例と同様の作用効果が得られ
る。
FIG. 4 shows another embodiment of the planar type. In this field emission device 60, the pattern of the emitter and the gate body is almost the same as that of FIG.
It is thinner, and a columnar pin 64 is erected so as to surround the recess 63 of the gate 61. As described above, even when the distal end portion 65 of the emitter 62 is surrounded by the concave portion 63 of the gate 61 and the pin 64, the same operation and effect as those of the above-mentioned respective embodiments of the planar type can be obtained.

第5図はプレーナ型の他の実施例である。この電界放
出素子70では、エミッタ62よりも薄形のゲート71には台
形状の凹部72が設けられ、各凹部72の両側には一対の円
柱形のピン73が立設されている。本実施例によっても第
4図の実施例と同様の作用効果を得ることができる。
FIG. 5 shows another embodiment of the planar type. In the field emission device 70, a trapezoidal concave portion 72 is provided in a gate 71 thinner than the emitter 62, and a pair of cylindrical pins 73 are provided upright on both sides of each concave portion 72. According to this embodiment, the same operation and effect as the embodiment of FIG. 4 can be obtained.

第6図はプレーナ型の他の実施例である。この電界放
出素子80のエミッタ62の構造はプレーナ型の前記各実施
例と同じである。エミッタ62に並んで基板31上に設けら
れたゲート81はエミッタ62よりも薄く、このゲート81に
は、エミッタ62の各先端部65を囲むようにゲート部材82
が所定間隔で設けられている。本実施例によってもプレ
ーナ型の前記各実施例と同様の作用効果を得ることがで
きる。なお、図中83はコレクタである。
FIG. 6 shows another embodiment of the planar type. The structure of the emitter 62 of the field emission device 80 is the same as that of each of the above-mentioned planar type embodiments. The gate 81 provided on the substrate 31 alongside the emitter 62 is thinner than the emitter 62, and the gate 81 has a gate member 82 surrounding each tip 65 of the emitter 62.
Are provided at predetermined intervals. According to this embodiment, the same operation and effect as those of the above-described planar embodiments can be obtained. In the figure, reference numeral 83 denotes a collector.

第7図(a)は、開口部301を有する矩形状のゲート3
02とエミッタ303とから成るプレーナ型の従来の電界放
出素子300と、その電界解析結果とを示している。ま
た、同図(b)は、プレーナ型の実施例の電界放出素子
90と、その電界解析結果とを示すものである。第7図
(b)の実施例におけるゲート91は、同図(a)のゲー
ト302に、エミッタ92の側に向けた矩形の突出部93を付
加した略T字形のゲートであり、エミッタ92の先端部94
とゲート91の間隔は従来例とかわらない。
FIG. 7A shows a rectangular gate 3 having an opening 301.
13 shows a conventional planar-type field emission device 300 composed of a semiconductor device 02 and an emitter 303, and an electric field analysis result thereof. FIG. 1B shows a field emission device according to a planar type embodiment.
90 shows the result of the electric field analysis. The gate 91 in the embodiment of FIG. 7B is a substantially T-shaped gate obtained by adding a rectangular projection 93 toward the emitter 92 to the gate 302 of FIG. Tip 94
And the distance between the gate 91 and the conventional example are not different.

本実施例によれば、エミッタ92の先端部94をゲート91
が囲むことになるので、図の比較からわかるようにエミ
ッタ92の先端部94における電界強度は従来例よりも約10
%大きくなっている。このため、電界放出素子を作製す
る上でエミッタの先端部とゲートの最短距離を小さくす
ることが難しい場合、低いゲート電圧で十分な電子放出
を得るために、本実施例の構造は有効である。
According to the present embodiment, the tip 94 of the emitter 92 is connected to the gate 91.
, The electric field strength at the tip 94 of the emitter 92 is about 10 times lower than that of the conventional example, as can be seen from the comparison of the figures.
% Has increased. Therefore, when it is difficult to reduce the shortest distance between the tip of the emitter and the gate in manufacturing the field emission device, the structure of this embodiment is effective to obtain sufficient electron emission at a low gate voltage. .

〔考案の効果〕[Effect of the invention]

本考案の平面型の電界放出素子は、エミッタの先端の
両側と前方がゲートの凹部で囲まれているので、先端部
の並ぶ方向に実質的に平行な電位分布が前記エミッタの
前方に生じ、同先端部における電界強度が大きくなる。
従って、ゲート電圧を低くしながら、エミッタ先端部の
みに効果的な電界を発生させて十分な電子放出を得、こ
れをエミッタの前方に向けて効率的に送りだすことがで
きる。
In the planar field emission device of the present invention, since both sides and the front of the tip of the emitter are surrounded by the concave portion of the gate, a potential distribution substantially parallel to the direction in which the tips are arranged occurs in front of the emitter, The electric field strength at the tip increases.
Therefore, while reducing the gate voltage, an effective electric field is generated only at the tip of the emitter to obtain sufficient electron emission, which can be efficiently sent toward the front of the emitter.

【図面の簡単な説明】[Brief description of the drawings]

第1図及び第2図は、それぞれ本考案に係るプレーナ型
の電界放出素子の実施例を示す斜視図、第3図は同じく
プレーナ型の実施例の要部拡大図、第4図、第5図及び
第6図は、それぞれ本考案に係るプレーナ型の電界放出
素子の実施例を示す斜視図、第7図(a)は従来のプレ
ーナ型の電界放出素子とその電界解析結果を示す図、第
7図(b)は実施例のプレーナ型の電界放出素子とその
電界解析結果を示す図、第8図は従来のプレーナ型の電
界放出素子の斜視図である。 30,40,50,60,70,80,90……電界放出素子 33,41,53,61,71,81,91……ゲート 32,51,62,92……エミッタ 34,52,65,94……先端部
1 and 2 are perspective views showing an embodiment of a planar type field emission device according to the present invention, respectively. FIG. 3 is an enlarged view of a main part of the planar type embodiment, and FIGS. FIGS. 6 and 7 are perspective views showing an embodiment of the planar type field emission device according to the present invention, respectively. FIG. 7 (a) is a diagram showing a conventional planar type field emission device and its electric field analysis result. FIG. 7B is a diagram showing a planar type field emission device of the embodiment and the results of an electric field analysis thereof, and FIG. 8 is a perspective view of a conventional planar type field emission device. 30,40,50,60,70,80,90 …… Field emission device 33,41,53,61,71,81,91 …… Gate 32,51,62,92 …… Emitter 34,52,65, 94 ... Tip

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平4−126332(JP,A) 特開 平3−295130(JP,A) 特開 平4−28138(JP,A) 特開 平3−190034(JP,A) 特開 平1−154426(JP,A) 特開 昭63−274048(JP,A) 米国特許4956574(US,A) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-126332 (JP, A) JP-A-3-295130 (JP, A) JP-A-4-28138 (JP, A) JP-A-3-28130 190034 (JP, A) JP-A-1-154426 (JP, A) JP-A-63-274048 (JP, A) US Pat.

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】基板の表面と平行に基板の表面に密着して
設けられ、その先端が実質的に一直線状に並んだ複数の
先端部を有する板状のエミッタと、 前記基板の表面と平行に基板の表面に密着して設けら
れ、前記エミッタの各先端部の両側と前方を囲む複数の
凹部を有し、前記エミッタの先端部における電界強度を
高めるとともに前記先端部の並ぶ方向に実質的に平行な
電位分布を前記エミッタの前方に生じさせる板状のゲー
トと、 を有する電界放出素子。
A plate-shaped emitter provided in close contact with the surface of the substrate in parallel with the surface of the substrate and having a plurality of tips whose tips are aligned substantially in a straight line; A plurality of recesses that are provided in close contact with the surface of the substrate and surround both sides and the front of each tip of the emitter, to increase the electric field strength at the tip of the emitter and to substantially extend in the direction in which the tips are lined up. A plate-shaped gate for generating a potential distribution parallel to the emitter in front of the emitter.
JP1990116641U 1990-11-08 1990-11-08 Field emission device Expired - Fee Related JP2562168Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116641U JP2562168Y2 (en) 1990-11-08 1990-11-08 Field emission device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116641U JP2562168Y2 (en) 1990-11-08 1990-11-08 Field emission device

Publications (2)

Publication Number Publication Date
JPH0474834U JPH0474834U (en) 1992-06-30
JP2562168Y2 true JP2562168Y2 (en) 1998-02-10

Family

ID=31864474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116641U Expired - Fee Related JP2562168Y2 (en) 1990-11-08 1990-11-08 Field emission device

Country Status (1)

Country Link
JP (1) JP2562168Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956574A (en) 1989-08-08 1990-09-11 Motorola, Inc. Switched anode field emission device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2654013B2 (en) * 1987-05-06 1997-09-17 キヤノン株式会社 Electron emitting device and method of manufacturing the same
FR2623013A1 (en) * 1987-11-06 1989-05-12 Commissariat Energie Atomique ELECTRO SOURCE WITH EMISSIVE MICROPOINT CATHODES AND FIELD EMISSION-INDUCED CATHODOLUMINESCENCE VISUALIZATION DEVICE USING THE SOURCE
JPH0787074B2 (en) * 1990-05-23 1995-09-20 松下電器産業株式会社 Electron-emitting device and manufacturing method thereof
JPH0793097B2 (en) * 1989-12-19 1995-10-09 松下電器産業株式会社 Electron-emitting device and manufacturing method thereof
JPH03295130A (en) * 1990-04-11 1991-12-26 Matsushita Electric Ind Co Ltd Electron emission device
JPH04126332A (en) * 1990-06-22 1992-04-27 Yokogawa Electric Corp Micro-vacuum device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956574A (en) 1989-08-08 1990-09-11 Motorola, Inc. Switched anode field emission device

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JPH0474834U (en) 1992-06-30

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