WO1990003044A1 - Protected piezoelectric polymer bimorph - Google Patents

Protected piezoelectric polymer bimorph Download PDF

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Publication number
WO1990003044A1
WO1990003044A1 PCT/US1989/003930 US8903930W WO9003044A1 WO 1990003044 A1 WO1990003044 A1 WO 1990003044A1 US 8903930 W US8903930 W US 8903930W WO 9003044 A1 WO9003044 A1 WO 9003044A1
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WO
WIPO (PCT)
Prior art keywords
layers
conducting
layer
accordance
bimorph
Prior art date
Application number
PCT/US1989/003930
Other languages
French (fr)
Inventor
David L. Heiserman
Original Assignee
Microflex Technology, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microflex Technology, Inc. filed Critical Microflex Technology, Inc.
Publication of WO1990003044A1 publication Critical patent/WO1990003044A1/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end

Definitions

  • This invention relates generally to piezoelectri polymer devices used as motive power devices or sensors an more particularly relates to improvements of such device which are particularly useful as micromanipulators.
  • Piezoelectric polymers have been utilized for a variet of devices such as oscillating or vibrating transducers o the type described in U.S. Patent 4,400,642 and the patent cited in that patent.
  • An important use of piezoelectri polymers is to form electrical/mechanical an mechanical/electrical transducers such as described in U.S Patent 4,342,936.
  • Piezoelectric polymers have also found importan application in micromanipulators such as illustrated in U.S Patents 3,835,338 and Soviet Patents 867-646 and 867-647.
  • Micromanipulators are utilized for grasping otherwise moving small parts such as semiconductor device
  • the electric field required to operate a piezoelectr polymer micromanipulator is obtained by applying a volta to conductive layers to obtain a charge redistributi similar to that in a capacitor.
  • the oppositely charg conductive layers create the opportunity for undesirab electrical discharges which can be destructive or prese fire hazards. For example, a discharge from the surface a micromanipulator through a semi-conductor device c destroy the device. If the micromanipulator is utilized an environment having potentially flammable chemicals in t air or dust particles on the surface, a spark caused by su a discharge could cause ignition and therefore present explosion or fire hazard.
  • the electric field also attrac dust and can attract a small part thereby manipulating t part in an unintended manner.
  • any application of a str externally generated electrical field to the polymer alter the operation or performance characteristics of piezoelectric polymer device.
  • the invention is a flexing piezoelectric bimorph of th type having a pair of piezoelectric polymer layers arrange with substantially similarly oriented polarization an having a conducting layer bonded intermediate the polyme layers.
  • Outer conducting layers are bonded on the opposite outwardly facing sides of the polymer layer.
  • the oute conducting layers extend peripherally outwardly beyond th outer edges of the intermediate conducting layer to fo protective lips which are electrically connected to a syste common ground.
  • Fig. 1 is a schematic diagram in transverse sectio through the bimorph of an embodiment of the invention.
  • Fig. 2 is an exploded view of two components forming laminate in accordance with the present invention.
  • Fig. 3 is a plan view of one face of the uppe component illustrated in Fig. 2.
  • Fig. 4 is a plan view of the opposite face of the uppe component illustrated in Fig. 2.
  • Fig. 5 is a view in vertical section of the laminate o Fig. 2 after they have been combined and the electrica connecting terminals have been connected to them.
  • specific terminolog will be resorted to for the sake of clarity.
  • eac specific term includes all technical equivalents whic operate in a similar manner to accomplish a similar purpos
  • the word connected or terms similar thereto a often used. They are not limited to direct connection b include connection through other circuit elements where su connection is recognized as being equivalent by tho skilled in the art.
  • Fig. 1 illustrates a flexing piezoelectric bimor apparatus having a laminate 10 and a control circuit mea 12.
  • the laminate 10 has a pair of piezoelectric polym layers 14 and' 16 which are arranged with substantial similarly oriented polarization.
  • the lamina is formed from a stock material which is a piezoelectr polymer layer having its two opposite, major surfac metallized to form conducting layers.
  • An ⁇ intermedia conducting layer 18 can conveniently be formed in bimorph laminate 10 by bonding together and electrical connecting together two such metallized surfaces 19 and 2 The remaining two metallized surfaces form outer conduct layers 22 and 24 bonded on the oppositely facing sides the polymer layers 14 and 16.
  • a jaw member 25 or other working gripper tip or t may be formed on an elongated laminate bimorph 10 so that may be used as a micromanipulator.
  • the outer conducting layers 22 and 24 ext beyond the edges of the intermediate conducting layer 18 provide protective lips 26 and 28.
  • such protective lip is provided entirely around or nea entirely surrounding the outer peripheral edges of bimorph 10.
  • the outer conducting layer may also ext beyond the edges of the polymer layers 14 and 16, illustrated in Fig. 1, or the polymer edges may extend cl to the edge of the outer conducting layers in the manner be described in connection with Fig. 2.
  • a conductive rim 30 may be connected to bridge across the gap between the facing outer edges of the outer conducting layer 22 and 24 around the peripheral lips 26 and 28. Such a bridge provides a shielded, conductive enclosure around the polymer layers and extending between the conducting outer layers 22 and 24 to provide complete electrical isolation of the entire exterior surface of the bimorph.
  • the control circuit means 12 further includes a variable potential source 34 which is connected by suitable conductors from the system ground to the intermediate conducting - layer.
  • a variable potential source 34 which is connected by suitable conductors from the system ground to the intermediate conducting - layer.
  • a pair of single pole, double throw switches 36 and 38 are connected to alternatively apply the potential of the source 34 to the bimorph 10 with either a positiv ground or a negative ground. This allows the bimorph 10 t be flexed in either the up or down direction in Fig. 1.
  • a permanent ground connection can be made and a single pole, single throw switch utilized.
  • two separate potential sources could be utilized having opposite poles connected to ground and switched to be alternatively selected.
  • FIGs. 2-5 illustrate a preferred embodiment of the invention.
  • a sheet stock of piezoelectric polymer having metallized layers on both of its major surfaces has peripheral paths respectively etched away to form two, non ⁇ conducting, edge paths 40 and 42 of substantially the same dimensions and preferably mirror images formed entirely around the periphery of the respective polymer layers 44 and 46.
  • the conductive layers 48 and 50 within the edge pa 40 and 42 may then be bonded together to form a bimo having an intermediate conducting layer formed by interfacing metallization layers 48 and 50 within the n conducting edge paths 40 and 42 and having the ou conductive layers 52 and 54 formed by the opposi outwardly facing metallized layers.
  • Electrical connections to the intermediate layer may made directly to the edge of the intermediate layer, such illustrated in Fig. 1, or the intermediate layer may provided with a tab or terminal extending beyond the edge the bimorph at one end. However, it is desirable to prov a more simple, compact structure having mechanica stronger electrical bonds. Electrical connection is preferably made by conductive fastener terminal 62 extending through a fi hole extending transversely through the bimorph. The fi hole 62 extends through the intermediate conducting la formed by metallized layers 48 and 50.
  • a metallization 64 is formed by removing, such as by etching away, a por of the outer conductive metallized layer 52 around the f hole 62 and forming a similar metallization gap around first hole 62 by removing a portion of the o metallization layer 54.
  • a conductive fastener terminal fo like a rivet or other fastener, to extend through the 62 and yet have a head member at each end for securin mechanically strong connection to the layers of the lami while preventing electrical connection between the members and the outer conducting layers 52 and
  • small metallized circles 66 and 68 immedia bounding the hole 62 are formed to provide a washer- foundation for a secure mechanical bond without provi electrical connection to the functioning portion of outer conductive layers 52 and 54.
  • Electrical connection to the outer conducting layers 5 and 54 may be accomplished by forming the intermediat metallization layers 48 and 50 in a mirror image an providing a second hole 70 transversely through the bimorph Metallization gaps 72 and 74 are similarly formed i each of the intermediate conducting metallized surfaces 4 and 50 around the second hole 70. Desirably washer-lik rims of metal 76 and 78 may be formed immediately adjacen the second hole 70 to form spacing rings in order that th positioning and tightening of a second fastener terminal 8 through the hole 70 will not compress and mechanicall distort the bimorph.
  • a bimorph is easil constructed in accordance with the present invention b appropriately etching away the metallized surfaces in th shapes described and then connecting the component portion together.
  • the outer two conducting layers provide a shield and conductor by which any static charge will be drained t ground rather than accumulate on the exterior surface of th bimorph. More importantly, the protective lip assures tha all exposed surfaces of the bimorph, including the edges are at the same ground potential as workpieces or othe devices and therefore discharge or arcing through the cannot occur. Safety is enhanced because no high voltag conductor is accessible to human contact.

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Abstract

A flexing piezoelectric bimorph (10) is formed, preferably from piezoelectric polymers (14, 16) having two metallized surfaces (19, 20), by bonding together two metallized surfaces (19, 20) to provide a pair of piezoelectric polymer layers (14, 16) arranged with substantially similarly oriented polarization. The outwardly facing metallized layers (22, 24) bonded on the opposite facing surfaces from the other two conducting layers of the bimorph. The control circuit (12) is connected so that applied potential and the outwardly facing two conducting layers (22, 24) are connected to ground in order to drain away static charge and shield the polymers (14, 16) from extraneous electric fields. The control potential (34) is electrically connected to the interposed central metallized layers (19, 20) which are bonded together and form the second electrode (18) for applying the appropriate electric fields to the bimorph (10).

Description

TITLE: PROTECTED PIEZOELECTRIC POLYMER BIMORPH Technical Field
This invention relates generally to piezoelectri polymer devices used as motive power devices or sensors an more particularly relates to improvements of such device which are particularly useful as micromanipulators.
Background Art
Piezoelectric polymers have been utilized for a variet of devices such as oscillating or vibrating transducers o the type described in U.S. Patent 4,400,642 and the patent cited in that patent. An important use of piezoelectri polymers is to form electrical/mechanical an mechanical/electrical transducers such as described in U.S Patent 4,342,936.
Piezoelectric polymers have also found importan application in micromanipulators such as illustrated in U.S Patents 3,835,338 and Soviet Patents 867-646 and 867-647.
Further, the basic concepts and use o micromanipulators is discussed further in my prior paten 4,610,475 and 4,666,198.
In the typical operation of a piezoelectric polyme bimorph, an electric field is applied to each of the ■tw layers of piezoelectric polymer which are bonded together i a laminate. By applying an electric field to one polyme layer in a direction which tends to elongate that layer a applying an electric field to the other polymer layer in direction which tends to contract that layer, the bimor may be caused to bend or strain in one direction. Revers of both fields can reverse the direction of strain. T result is a transducing effect between the application electrical energy as an electric ield and mechanical ener in the form of motion of mass.
Micromanipulators are utilized for grasping otherwise moving small parts such as semiconductor device The electric field required to operate a piezoelectr polymer micromanipulator is obtained by applying a volta to conductive layers to obtain a charge redistributi similar to that in a capacitor. The oppositely charg conductive layers create the opportunity for undesirab electrical discharges which can be destructive or prese fire hazards. For example, a discharge from the surface a micromanipulator through a semi-conductor device c destroy the device. If the micromanipulator is utilized an environment having potentially flammable chemicals in t air or dust particles on the surface, a spark caused by su a discharge could cause ignition and therefore present explosion or fire hazard. The electric field also attrac dust and can attract a small part thereby manipulating t part in an unintended manner.
Further,* because a piezoelectric polymer device controlled by an electric field, any application of a str externally generated electrical field to the polymer alter the operation or performance characteristics of piezoelectric polymer device.
There is, therefore, a need to prevent the possibil of discharge or sparks resulting from contact with piezoelectric polymer device. There is further a need fo means to prevent the application of a foreign or externa generated field to the bimorph in a manner which co effect its operation.
Brief Disclosure Of Invention
The invention is a flexing piezoelectric bimorph of th type having a pair of piezoelectric polymer layers arrange with substantially similarly oriented polarization an having a conducting layer bonded intermediate the polyme layers. Outer conducting layers are bonded on the opposite outwardly facing sides of the polymer layer. The oute conducting layers extend peripherally outwardly beyond th outer edges of the intermediate conducting layer to fo protective lips which are electrically connected to a syste common ground. As a result, only grounded surfaces ar exposed at a surface of the bimorph and yet the oppositel directed electric fields cause the similarly polarize polymer layers to strain in opposing directions#.
Brief Description Of Drawings
Fig. 1 is a schematic diagram in transverse sectio through the bimorph of an embodiment of the invention.
Fig. 2 is an exploded view of two components forming laminate in accordance with the present invention.
Fig. 3 is a plan view of one face of the uppe component illustrated in Fig. 2. Fig. 4 is a plan view of the opposite face of the uppe component illustrated in Fig. 2.
Fig. 5 is a view in vertical section of the laminate o Fig. 2 after they have been combined and the electrica connecting terminals have been connected to them. In describing the preferred embodiment of the inventio which is illustrated in the drawings, specific terminolog will be resorted to for the sake of clarity. However, it i not intended that the invention be limited to the specifi terms so selected and it is to be understood that eac specific term includes all technical equivalents whic operate in a similar manner to accomplish a similar purpos For example, the word connected or terms similar thereto a often used. They are not limited to direct connection b include connection through other circuit elements where su connection is recognized as being equivalent by tho skilled in the art.
Detailed Description
Fig. 1 illustrates a flexing piezoelectric bimor apparatus having a laminate 10 and a control circuit mea 12. The laminate 10 has a pair of piezoelectric polym layers 14 and' 16 which are arranged with substantial similarly oriented polarization. Preferably, .the lamina is formed from a stock material which is a piezoelectr polymer layer having its two opposite, major surfac metallized to form conducting layers. Anβ intermedia conducting layer 18 can conveniently be formed in bimorph laminate 10 by bonding together and electrical connecting together two such metallized surfaces 19 and 2 The remaining two metallized surfaces form outer conduct layers 22 and 24 bonded on the oppositely facing sides the polymer layers 14 and 16.
A jaw member 25 or other working gripper tip or t may be formed on an elongated laminate bimorph 10 so that may be used as a micromanipulator.
Desirably, the outer conducting layers 22 and 24 ext beyond the edges of the intermediate conducting layer 18 provide protective lips 26 and 28. Preferably, such protective lip is provided entirely around or nea entirely surrounding the outer peripheral edges of bimorph 10. The outer conducting layer may also ext beyond the edges of the polymer layers 14 and 16, illustrated in Fig. 1, or the polymer edges may extend cl to the edge of the outer conducting layers in the manner be described in connection with Fig. 2. Advantageously a conductive rim 30 may be connected to bridge across the gap between the facing outer edges of the outer conducting layer 22 and 24 around the peripheral lips 26 and 28. Such a bridge provides a shielded, conductive enclosure around the polymer layers and extending between the conducting outer layers 22 and 24 to provide complete electrical isolation of the entire exterior surface of the bimorph.
This allows the control circuit means 12 to connect the outer conducting surfaces to a system ground by any convenient conductor 32. Of course, even without the conducting bridge 30, the recessed position of the intermediate conducting layer 18 provides substantial protection from unwanted electrical discharge. The control circuit means further includes a variable potential source 34 which is connected by suitable conductors from the system ground to the intermediate conducting - layer. One such connection schematic i illustrated. A pair of single pole, double throw switches 36 and 38 are connected to alternatively apply the potential of the source 34 to the bimorph 10 with either a positiv ground or a negative ground. This allows the bimorph 10 t be flexed in either the up or down direction in Fig. 1. Of course, a permanent ground connection can be made and a single pole, single throw switch utilized. Alternatively, two separate potential sources could be utilized having opposite poles connected to ground and switched to be alternatively selected.
Figs. 2-5 illustrate a preferred embodiment of the invention. A sheet stock of piezoelectric polymer having metallized layers on both of its major surfaces has peripheral paths respectively etched away to form two, non¬ conducting, edge paths 40 and 42 of substantially the same dimensions and preferably mirror images formed entirely around the periphery of the respective polymer layers 44 and 46. The conductive layers 48 and 50 within the edge pa 40 and 42 may then be bonded together to form a bimo having an intermediate conducting layer formed by interfacing metallization layers 48 and 50 within the n conducting edge paths 40 and 42 and having the ou conductive layers 52 and 54 formed by the opposi outwardly facing metallized layers.
Electrical connections to the intermediate layer may made directly to the edge of the intermediate layer, such illustrated in Fig. 1, or the intermediate layer may provided with a tab or terminal extending beyond the edge the bimorph at one end. However, it is desirable to prov a more simple, compact structure having mechanica stronger electrical bonds. Electrical connection is preferably made by conductive fastener terminal 62 extending through a fi hole extending transversely through the bimorph. The fi hole 62 extends through the intermediate conducting la formed by metallized layers 48 and 50. A metallization 64 is formed by removing, such as by etching away, a por of the outer conductive metallized layer 52 around the f hole 62 and forming a similar metallization gap around first hole 62 by removing a portion of the o metallization layer 54. This permits a conductive fastener terminal, fo like a rivet or other fastener, to extend through the 62 and yet have a head member at each end for securin mechanically strong connection to the layers of the lami while preventing electrical connection between the members and the outer conducting layers 52 and Preferably, small metallized circles 66 and 68 immedia bounding the hole 62 are formed to provide a washer- foundation for a secure mechanical bond without provi electrical connection to the functioning portion of outer conductive layers 52 and 54. Electrical connection to the outer conducting layers 5 and 54 may be accomplished by forming the intermediat metallization layers 48 and 50 in a mirror image an providing a second hole 70 transversely through the bimorph Metallization gaps 72 and 74 are similarly formed i each of the intermediate conducting metallized surfaces 4 and 50 around the second hole 70. Desirably washer-lik rims of metal 76 and 78 may be formed immediately adjacen the second hole 70 to form spacing rings in order that th positioning and tightening of a second fastener terminal 8 through the hole 70 will not compress and mechanicall distort the bimorph.
Thus, it may be seen that a bimorph is easil constructed in accordance with the present invention b appropriately etching away the metallized surfaces in th shapes described and then connecting the component portion together.
The outer two conducting layers provide a shield and conductor by which any static charge will be drained t ground rather than accumulate on the exterior surface of th bimorph. More importantly, the protective lip assures tha all exposed surfaces of the bimorph, including the edges are at the same ground potential as workpieces or othe devices and therefore discharge or arcing through the cannot occur. Safety is enhanced because no high voltag conductor is accessible to human contact.
While certain preferred embodiments of the presen invention have been disclosed in detail, it is to b understood that various modifications may be adopted withou departing from the spirit of the invention or scope of th following claims.

Claims

1. A flexing piezoelectric bimorph laminate of the t having a pair of piezoelectric polymer layers arranged w substantially similarly oriented polarization; a conduct layer bonded intermediate the polymer layers; and ou conducting layers bonded on the oppositely facing sides the polymer layers
wherein the improvement comprises the outer conduct layers extending peripherally outwardly beyond the edges the intermediate conducting layer to form protective l which are electrically connected to a common system groun
2. An apparatus in accordance with claim 1 wherein polymer layers extend beyond the outer edges of the in conducting layer to form a nonconducting edge path outwar of the intermediate conducting layer.
3. An apparatus in accordance with claim 2 wherein outer conducting layers also extend beyond edges of polymer layers.
4. An apparatus in accordance with claim 3 wherei conductive rim is bridged across the gap between fac outer edges of the outer conducting layers to provid shielded conductive enclosure around the polymer layers the intermediate conducting layer.
5. An apparatus in accordance with claim 1 or 2 or 3 or wherein more particularly each polymer layer has its t major opposite surfaces metallized and the intermedia conductive layer comprises two interfacing metalliz surfaces bonded together and electrically connect together.
6. A micromanipulator in accordance with claim 1 or 2 or or 4 having a control circuit and at least one worki member and is formed as an elongated laminate in accordan with claim 1 or 2 or 3 or 4.
7. A micromanipulator in accordance with claim 6 a including a control circuit comprising:
(i) conductor means for electrically connecting the outer conducting layers to a system ground; and
(ii) a controllable potential source electrically connected between the system ground and the intermediate conducting layer.
8. A method for forming a piezoelectric bimorph from she stock of piezoelectric polymer having a metallized layer both of its major surfaces, the method comprising:
(a) etching away an outer edge path of metallization layer from each of two portions of sheet stock to form two nonconducting edge paths of substantially the same dimensions; and
(b) bonding together the conductive regions within the edge paths to form a bimorph having an intermediate conducting layer formed by the interfacing metallization layers within the non- conducting edge path and having outer conducting layers formed by the outer two metallization layers.
9. A method in accordance with claim 8 wherein the met further comprises etching away the metallization la around corresponding, mirror image first regions of metallization layers which are etched to form the n conducting edge paths, to form transversely, aligned n conducting regions and forming a hole through the alig non-conducting regions for receipt of a fastener termi after the conductive regions are bonded together.
10. A method in accordance with claim 9 further compris etching away the metallization layer around correspon mirror image regions of the metallization layers which not etched to form the non-conducting edge paths, transverse alignment with a second region of the o metallization layers and forming a hole through the se region for receipt of a fastener terminal after conductive regions are bonded together.
PCT/US1989/003930 1988-09-12 1989-09-11 Protected piezoelectric polymer bimorph WO1990003044A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24249688A 1988-09-12 1988-09-12
US242,496 1988-09-12

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10149840A1 (en) * 2001-10-10 2003-05-08 Festo Ag & Co Piezoceramic bending transducer and use of the piezoceramic bending transducer
FR2845026A1 (en) * 2002-09-26 2004-04-02 Ecole Nale Sup Artes Metiers PIEZOELECTRIC MICROMANIPULATOR, ESPECIALLY FOR MICROROBOTICS
CN116171097A (en) * 2023-04-25 2023-05-26 常州威图流体科技有限公司 Piezoelectric bimorph structure

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940974A (en) * 1974-05-06 1976-03-02 Minnesota Mining And Manufacturing Company Electrically compensated sensor
US4093883A (en) * 1975-06-23 1978-06-06 Yujiro Yamamoto Piezoelectric multimorph switches
US4612083A (en) * 1984-07-20 1986-09-16 Nec Corporation Process of fabricating three-dimensional semiconductor device
US4666198A (en) * 1984-09-06 1987-05-19 Microflex Technology, Inc. Piezoelectric polymer microgripper
US4667997A (en) * 1984-10-31 1987-05-26 Hitachi, Ltd. Grip device
US4670074A (en) * 1981-12-31 1987-06-02 Thomson-Csf Piezoelectric polymer transducer and process of manufacturing the same
US4675959A (en) * 1976-09-24 1987-06-30 Pennwalt Corporation Production of piezoelectric dielectric films by poling in stack form
US4715928A (en) * 1985-09-27 1987-12-29 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
US4742264A (en) * 1985-03-08 1988-05-03 Murata Manufacturing Co., Ltd. Piezoelectric sound generator
US4759107A (en) * 1984-12-10 1988-07-26 Murata Manufacturing Co., Ltd. Monolithic piezoelectric element and method of adjusting the resonant frequency thereof

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940974A (en) * 1974-05-06 1976-03-02 Minnesota Mining And Manufacturing Company Electrically compensated sensor
US4093883A (en) * 1975-06-23 1978-06-06 Yujiro Yamamoto Piezoelectric multimorph switches
US4675959A (en) * 1976-09-24 1987-06-30 Pennwalt Corporation Production of piezoelectric dielectric films by poling in stack form
US4670074A (en) * 1981-12-31 1987-06-02 Thomson-Csf Piezoelectric polymer transducer and process of manufacturing the same
US4612083A (en) * 1984-07-20 1986-09-16 Nec Corporation Process of fabricating three-dimensional semiconductor device
US4666198A (en) * 1984-09-06 1987-05-19 Microflex Technology, Inc. Piezoelectric polymer microgripper
US4667997A (en) * 1984-10-31 1987-05-26 Hitachi, Ltd. Grip device
US4759107A (en) * 1984-12-10 1988-07-26 Murata Manufacturing Co., Ltd. Monolithic piezoelectric element and method of adjusting the resonant frequency thereof
US4742264A (en) * 1985-03-08 1988-05-03 Murata Manufacturing Co., Ltd. Piezoelectric sound generator
US4715928A (en) * 1985-09-27 1987-12-29 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10149840A1 (en) * 2001-10-10 2003-05-08 Festo Ag & Co Piezoceramic bending transducer and use of the piezoceramic bending transducer
FR2845026A1 (en) * 2002-09-26 2004-04-02 Ecole Nale Sup Artes Metiers PIEZOELECTRIC MICROMANIPULATOR, ESPECIALLY FOR MICROROBOTICS
WO2004028756A2 (en) * 2002-09-26 2004-04-08 Ensmm Ecole Nationale Supérieure De Mécanique Et Des Microtechniques Piezoelectric micromanipulator which is especially intended for microbotics and method of implementing same
WO2004028756A3 (en) * 2002-09-26 2004-05-06 Ensmm Ecole Nationale Superieu Piezoelectric micromanipulator which is especially intended for microbotics and method of implementing same
CN116171097A (en) * 2023-04-25 2023-05-26 常州威图流体科技有限公司 Piezoelectric bimorph structure

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