WO1987004317A1 - Boitier d'emetteur-recepteur radio-portatif contenant une batterie faisant partie integrante de sa structure - Google Patents
Boitier d'emetteur-recepteur radio-portatif contenant une batterie faisant partie integrante de sa structure Download PDFInfo
- Publication number
- WO1987004317A1 WO1987004317A1 PCT/US1986/002758 US8602758W WO8704317A1 WO 1987004317 A1 WO1987004317 A1 WO 1987004317A1 US 8602758 W US8602758 W US 8602758W WO 8704317 A1 WO8704317 A1 WO 8704317A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- panel
- battery
- panels
- housing
- circuitry
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/202—Casings or frames around the primary casing of a single cell or a single battery
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/3883—Arrangements for mounting batteries or battery chargers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Boîtier (104 et 600) d'un émetteur-récepteur radio-portatif (100) exploitant les caractéristiques structurales, de dissipation thermique et de blindage électrique d'une batterie. Le boîtier de circuit électronique (104 et 600) comprend une batterie constituant un élément structural solidaire. Dans le boîtier ci-décrit (104), une batterie en forme de tige (210) est fixée sur le côté d'une carte de circuit imprimé d'émetteur (213). Une carte du circuit imprimé logique (212) et une carte de circuit imprimé de récepteur (214) sont positionnées respectivement au-dessus et au-dessous de la carte du circuit imprimé d'émetteur (213), et sont maintenues ensemble par des rails latéraux à emboîtement (206, 207). Dans un deuxième boîtier illustré (600), une batterie plate (602) est fixée sur les côtés d'une première carte du circuit imprimé en U (604). Une deuxième carte du circuit imprimé en U (606) est disposée entre la batterie et la première carte (604). La chaleur dissipée par les composants électriques sur la deuxième carte (606) est absorbée et éloignée par la batterie plate (602). Le boîtier de circuit électronique ci-décrit peut être utilisé avantageusement dans une variété d'applications où des cicuits électroniques sont alimentés par une batterie.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US819,957 | 1977-07-28 | ||
US81602286A | 1986-01-03 | 1986-01-03 | |
US81602486A | 1986-01-03 | 1986-01-03 | |
US816,022 | 1986-01-03 | ||
US816,024 | 1986-01-03 | ||
US06/819,957 US4648125A (en) | 1986-01-03 | 1986-01-21 | Portable radio transceiver |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1987004317A1 true WO1987004317A1 (fr) | 1987-07-16 |
Family
ID=27420108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1986/002758 WO1987004317A1 (fr) | 1986-01-03 | 1986-12-09 | Boitier d'emetteur-recepteur radio-portatif contenant une batterie faisant partie integrante de sa structure |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0258274A1 (fr) |
CA (1) | CA1267693A (fr) |
IL (1) | IL80613A0 (fr) |
WO (1) | WO1987004317A1 (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0371708A2 (fr) * | 1988-11-30 | 1990-06-06 | Nokia Mobile Phones Ltd. | Châssis intermédiaire pour combiné de téléphone mobile |
EP2262354A1 (fr) * | 2009-06-05 | 2010-12-15 | Laird Technologies, Inc. | Ensembles et procédés pour la dissipation de chaleur de dispositifs électroniques portables |
US9258928B2 (en) | 2009-06-05 | 2016-02-09 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
EP2472833B1 (fr) * | 2006-03-29 | 2019-12-18 | Nokia Technologies Oy | Dispositif électronique portable |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US391762A (en) * | 1888-10-23 | Telephone-exchange system | ||
US1641395A (en) * | 1924-09-15 | 1927-09-06 | Moore Tom | Rectifying radio shield |
US2619589A (en) * | 1950-07-29 | 1952-11-25 | Aircall Inc | Radio receiver |
US2692944A (en) * | 1951-02-09 | 1954-10-26 | Rca Corp | Battery mounting means |
US3345568A (en) * | 1964-01-13 | 1967-10-03 | Motorola Inc | Transistorized portable radio transmitter-receiver structure |
US4083011A (en) * | 1976-07-26 | 1978-04-04 | General Electric Company | Battery holder and connector for a radio receiver or the like |
US4191917A (en) * | 1977-08-25 | 1980-03-04 | Disston, Inc. | Battery pack rechargeable in recessed or flush-type receptacles |
-
1986
- 1986-11-12 IL IL80613A patent/IL80613A0/xx not_active IP Right Cessation
- 1986-11-14 CA CA000523056A patent/CA1267693A/fr not_active Expired - Lifetime
- 1986-12-09 EP EP87900574A patent/EP0258274A1/fr not_active Withdrawn
- 1986-12-09 WO PCT/US1986/002758 patent/WO1987004317A1/fr unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US391762A (en) * | 1888-10-23 | Telephone-exchange system | ||
US1641395A (en) * | 1924-09-15 | 1927-09-06 | Moore Tom | Rectifying radio shield |
US2619589A (en) * | 1950-07-29 | 1952-11-25 | Aircall Inc | Radio receiver |
US2692944A (en) * | 1951-02-09 | 1954-10-26 | Rca Corp | Battery mounting means |
US3345568A (en) * | 1964-01-13 | 1967-10-03 | Motorola Inc | Transistorized portable radio transmitter-receiver structure |
US4083011A (en) * | 1976-07-26 | 1978-04-04 | General Electric Company | Battery holder and connector for a radio receiver or the like |
US4191917A (en) * | 1977-08-25 | 1980-03-04 | Disston, Inc. | Battery pack rechargeable in recessed or flush-type receptacles |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0371708A2 (fr) * | 1988-11-30 | 1990-06-06 | Nokia Mobile Phones Ltd. | Châssis intermédiaire pour combiné de téléphone mobile |
EP0371708A3 (fr) * | 1988-11-30 | 1992-01-15 | Nokia Mobile Phones Ltd. | Châssis intermédiaire pour combiné de téléphone mobile |
EP2472833B1 (fr) * | 2006-03-29 | 2019-12-18 | Nokia Technologies Oy | Dispositif électronique portable |
EP2262354A1 (fr) * | 2009-06-05 | 2010-12-15 | Laird Technologies, Inc. | Ensembles et procédés pour la dissipation de chaleur de dispositifs électroniques portables |
US9258928B2 (en) | 2009-06-05 | 2016-02-09 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
Also Published As
Publication number | Publication date |
---|---|
CA1267693A (fr) | 1990-04-10 |
IL80613A0 (en) | 1987-02-27 |
EP0258274A1 (fr) | 1988-03-09 |
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