WO1985005755A1 - Composition and process for conditioning the surface of plastic substrates prior to metal plating - Google Patents

Composition and process for conditioning the surface of plastic substrates prior to metal plating Download PDF

Info

Publication number
WO1985005755A1
WO1985005755A1 PCT/US1985/000857 US8500857W WO8505755A1 WO 1985005755 A1 WO1985005755 A1 WO 1985005755A1 US 8500857 W US8500857 W US 8500857W WO 8505755 A1 WO8505755 A1 WO 8505755A1
Authority
WO
WIPO (PCT)
Prior art keywords
composition
board
plastic
etchant
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1985/000857
Other languages
English (en)
French (fr)
Inventor
Anthony R. Del Gobbo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Priority to GB08601875A priority Critical patent/GB2175610B/en
Priority to AT85902778T priority patent/ATE69352T1/de
Priority to DE8585902778T priority patent/DE3584623D1/de
Priority to KR1019860700048A priority patent/KR910005532B1/ko
Priority to BR8506711A priority patent/BR8506711A/pt
Publication of WO1985005755A1 publication Critical patent/WO1985005755A1/en
Priority to DK35786A priority patent/DK35786D0/da
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Definitions

  • plastic parts are well-known to be of considerable commercial importance because the desirable characteristics of both the plastic and the metal are combined to offer the technical and aesthetic advantages of each.
  • a part plated with a bright, metallic finish takes advantage of the economies in cost and weight afforded by substituting molded plastic parts for metal and, additionally, the plated finishes are not as susceptible to pitting and corrosion because there is no galvanic reaction between a plastic substrate and a plated metal.
  • a board termed FR-4 which is a fire retardant epoxy resin fiber glass cloth laminate, has demonstrated to be effectively conditioned by the process of the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Liquid Crystal (AREA)
  • Harvesting Machines For Root Crops (AREA)
  • Optical Integrated Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/US1985/000857 1984-05-29 1985-05-08 Composition and process for conditioning the surface of plastic substrates prior to metal plating Ceased WO1985005755A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB08601875A GB2175610B (en) 1984-05-29 1985-05-08 Composition and process for conditioning the surface of plastic substrates prior to metal plating
AT85902778T ATE69352T1 (de) 1984-05-29 1985-05-08 Zusammensetzung und verfahren zur konditionierung der oberflaeche von kunststoffsubstraten vor der metallplattierung.
DE8585902778T DE3584623D1 (de) 1984-05-29 1985-05-08 Zusammensetzung und verfahren zur konditionierung der oberflaeche von kunststoffsubstraten vor der metallplattierung.
KR1019860700048A KR910005532B1 (ko) 1984-05-29 1985-05-08 금속 도금전에 플라스틱 기판의 표면을 상태조절하기 위한 조성물 및 그 방법
BR8506711A BR8506711A (pt) 1984-05-29 1985-05-08 Composicao e processo para condicionamento da superficie de substratos de plastico antes de metalizacao
DK35786A DK35786D0 (da) 1984-05-29 1986-01-23 Praeparat og fremgangsmaade til forbehandling af plastsubstraters overflade

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61491284A 1984-05-29 1984-05-29
US614,912 1984-05-29

Publications (1)

Publication Number Publication Date
WO1985005755A1 true WO1985005755A1 (en) 1985-12-19

Family

ID=24463231

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1985/000857 Ceased WO1985005755A1 (en) 1984-05-29 1985-05-08 Composition and process for conditioning the surface of plastic substrates prior to metal plating

Country Status (13)

Country Link
EP (1) EP0187150B1 (https=)
JP (1) JPS61502262A (https=)
KR (1) KR910005532B1 (https=)
AT (1) ATE69352T1 (https=)
AU (1) AU575953B2 (https=)
BR (1) BR8506711A (https=)
CA (1) CA1237558A (https=)
DE (1) DE3584623D1 (https=)
DK (1) DK35786D0 (https=)
GB (1) GB2175610B (https=)
IL (1) IL75247A (https=)
MX (1) MX166644B (https=)
WO (1) WO1985005755A1 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989010431A1 (en) * 1988-04-25 1989-11-02 Macdermid, Incorporated Process and composition for preparing printed circuit through-holes for metallization
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US5132038A (en) * 1988-04-25 1992-07-21 Macdermid, Incorporated Composition for preparing printed circuit through-holes for metallization
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
US5221418A (en) * 1992-02-11 1993-06-22 Macdermid, Incorporated Method for improving the surface insulation resistance of printed circuits
WO1994001599A1 (de) * 1992-07-02 1994-01-20 Atotech Deutschland Gmbh Metallisierung von kunststoffen
DE4326079A1 (de) * 1993-07-30 1995-02-02 Atotech Deutschland Gmbh Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung
US7578947B2 (en) 2005-10-28 2009-08-25 Enthone Inc. Method for etching non-conductive substrate surfaces

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898136A (en) * 1973-03-19 1975-08-05 Mitsubushi Gas Chemical Compan Process for coating shaped resin articles
US4086128A (en) * 1976-03-04 1978-04-25 Mitsubishi Gas Chemical Company, Inc. Process for roughening surface of epoxy resin
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898136A (en) * 1973-03-19 1975-08-05 Mitsubushi Gas Chemical Compan Process for coating shaped resin articles
US4086128A (en) * 1976-03-04 1978-04-25 Mitsubishi Gas Chemical Company, Inc. Process for roughening surface of epoxy resin
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Circuits Manufacturing, issued March 1983 PETER E. KUKANSKIS, "Improved Smear Removal", pps 73,74 *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989010431A1 (en) * 1988-04-25 1989-11-02 Macdermid, Incorporated Process and composition for preparing printed circuit through-holes for metallization
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
US5132038A (en) * 1988-04-25 1992-07-21 Macdermid, Incorporated Composition for preparing printed circuit through-holes for metallization
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
US5221418A (en) * 1992-02-11 1993-06-22 Macdermid, Incorporated Method for improving the surface insulation resistance of printed circuits
WO1994001599A1 (de) * 1992-07-02 1994-01-20 Atotech Deutschland Gmbh Metallisierung von kunststoffen
DE4326079A1 (de) * 1993-07-30 1995-02-02 Atotech Deutschland Gmbh Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung
US5591488A (en) * 1993-07-30 1997-01-07 Atotech Deutschland Gmbh Process for treating plastic surfaces and swelling solution
US7578947B2 (en) 2005-10-28 2009-08-25 Enthone Inc. Method for etching non-conductive substrate surfaces

Also Published As

Publication number Publication date
GB2175610B (en) 1988-07-20
EP0187150A1 (en) 1986-07-16
DK35786A (da) 1986-01-23
DE3584623D1 (de) 1991-12-12
GB8601875D0 (en) 1986-03-05
KR860700203A (ko) 1986-03-31
GB2175610A (en) 1986-12-03
IL75247A (en) 1988-08-31
AU575953B2 (en) 1988-08-11
JPS61502262A (ja) 1986-10-09
CA1237558A (en) 1988-06-07
MX166644B (es) 1993-01-25
EP0187150A4 (en) 1987-07-23
IL75247A0 (en) 1985-09-29
KR910005532B1 (ko) 1991-07-31
JPH0319301B2 (https=) 1991-03-14
AU4356885A (en) 1985-12-31
ATE69352T1 (de) 1991-11-15
EP0187150B1 (en) 1991-11-06
DK35786D0 (da) 1986-01-23
BR8506711A (pt) 1986-09-23

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