Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/02—Details
  • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
  • H01J37/08—Ion sources; Ion guns
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J27/00—Ion beam tubes
  • H01J27/02—Ion sources; Ion guns
  • H01J27/022—Details
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J27/00—Ion beam tubes
  • H01J27/02—Ion sources; Ion guns
  • H01J27/26—Ion sources; Ion guns using surface ionisation, e.g. field effect ion sources, thermionic ion sources

Definitions

• the present invention relates to a liquid metal ion source capable of efficiently and stably extracting a high melting point element such as B, Si, P, As as a single element ion for a long time as a single element ion. .
• liquid metal ion-source In addition to high performance in the fields of micro-dry process (ion beam exposure, dry development, microphone dropping, etc.) and sub-micron surface analysis, high brightness development of liquid metal ion-source is a demand strongly recommend] ?, 'in the device field of, de one Buion species: etc.' especially d Lek collected by filtration. ⁇ 'Ji is important 3 ⁇ 4 b, P, S i, Attempts have been made to dope s and the like directly into semiconductor materials using a liquid metal ion source.
• the operation principle of this liquid metal ion source is as follows. First, an ionizer material consisting of W, T a, force-bond, etc.
• ion-ion material melted by resistance heating or electron beam heating, and a strong electric field is applied to the tip of the chip. Pull on. Therefore, it is important for the ion source to be able to extract the desired ion beam for a long time and stably.
• this ion-type material has a melting point of 400-: L 000 C
• An object of the present invention is to provide an ion source material of an ion source capable of extracting a high melting point ion beam such as ⁇ , Si, ⁇ , or As, which is stable and has a long life.
• LaBs-based material family did not react with it at all, or at least little, and had good wettability.
• the inventors attempted to obtain a zion-type material (alloy) and arrived at the present invention. .
• the present inventors first thought that the Ni element was
• the melting point is further increased by adding various kinds of additional elements to these Ni-based binary alloys near the eutectic alloy composition. lowering, vapor pressure at that temperature, the viscosity was low, (glass La scan carbon was primarily carbides, L a B 6, etc.) E Mi Ttachippu material to reduce the reaction with better wettability Tried that.
• the result is a group consisting of B, Si, P, C, and As.]
• the general formula is expressed by NiaXb.
• the liquid ion type alloy of the present invention is a group consisting of at least three elements including N i 3 ⁇ 4] ?, B, S i, P, C and As.
• the total amount of the selected two or more elements is 32 to 70 at,
• At least two of the elements other than Ni are 1 at
• the preferred additive elements are S i, ⁇ '- 'no,', ⁇ :?
• the liquid metal ion type alloy of the present invention configured as described above has a melting point of about 1000 C or less and satisfies each of the above-mentioned target characteristics.]? Good 3 ⁇ 4Characteristic and long ion source Successfully obtained.
• the sensitivity is high, and it is preferable.
• the total concentration of B and S i is 35 to 70, especially in a Ni-based alloy containing both B and S i simultaneously. It has been found that, of course, at has a melting point of less than 1000C, has little reaction with the emitter chip material, has good wettability, and dramatically improves the ion source's shunlung. . In this case, the addition of 20% or less of P and / or C to this alloy system further lowers the melting point and viscosity of the alloy and increases the wettability with the chip material. When P and / or C exceeds 20 at, the melting point of the alloy increases, and the required amount of ions and other elements decreases!? Ion radiation efficiency preferably in terms of.
• the total amount of the above elements (P, B, C and / or S i) other than Ni is 35 at 5 ⁇ or more, It should be less than 50 at ⁇ ]? Desirably, by doing so, it was found that a long-life ion source could be obtained.
• T is a group consisting of B, C and S i].
• M is a group consisting of B, Si, C, and P.
• Has the composition indicated by single-ended Ni kAs Mm, and must be 5 5 ⁇ k ⁇ 65, 35 ⁇ £ ⁇ 45 50 m ⁇ 20, k + Z + m l 0 0 It is desirable.
• B, S i, C and / or P be 1 at or more.
• Ni of the above Ni-based alloy is partially replaced with an element such as Cu, Ru, Rh, Pd, Ag, Au, Pt (10 atomic percent or less)
• an element such as Cu, Ru, Rh, Pd, Ag, Au, Pt (10 atomic percent or less)
• the melting point of the alloy could be further reduced, and that the source of the ion source could be further improved.
• heavy metals since heavy metals have the effect of deteriorating the characteristics of semiconductor materials, they should be kept at 10 atomic percent or less as a seed material in order to prevent contamination during ion doping. Is preferred.
• the N i Moti sign species material above Symbol invention obtained by the good Unishi, especially glass La's forces - Bonn, carbides (S i C, WC), and E Mi Ttachippu material L a B 6, etc. When used as an ion source, longevity over 100 hours can be achieved.
• Ni-based alloy of the present invention part or all of Ni is Fe
• the ion seed material of the present invention overcomes the shortcoming shortcoming of the conventional liquid metal ion source, B, S i, P, A s. It has been found that this material is extremely excellent as a material that can be extracted stably for a long period of time as a single element ion with a high element, such as a high-point element. '
• FIG. 1 is a longitudinal sectional view of a liquid metal ion source
• FIG. 2 is an ion beam when an Ni 45 B 45 S i 10 alloy according to one embodiment of the present invention is used as a seed material.
• FIG. 1 is a longitudinal sectional view of a liquid metal ion source
• FIG. 2 is an ion beam when an Ni 45 B 45 S i 10 alloy according to one embodiment of the present invention is used as a seed material.
• FIG. 2 is an ion beam when an Ni 45 B 45 S i 10 alloy according to one embodiment of the present invention is used as a seed material.
• FIG. 1 shows a schematic diagram of the structure of a source of iron using the ion seed material of the present invention.
• the ion source is a 2 to 3 mm wide, 20 m long, 200 m thick sintering plate with a resistance heating heater 1 from 200 m thick, a heat-generating material 2, a current introduction terminal 3, setscrews 4, ion-extraction electrode 5, the two - dollar shaped Emi Ttachippu (carbides or L a B 6 such as S i C, WC is glass carbon) 6, a support 8, the heating power supply 9, Drawer power supply 10 ⁇ Consists of acceleration power supply 1 1. 7 indicates the ion beam
• Ni 4oPd 5 Si 4s Bio alloy as an ion species material of As ion
• N i so As 40 S i 10 , N i 5 o A s 4 ⁇ ⁇ ⁇ o, N i 45 As 40 Bio C 5 alloy ⁇ off La Zuma dissolved, by the high-frequency heating]? was prepared.
• the alloy system containing P or As was sintered, vacuum-sealed in a quartz tube, and then heated and melted.
• Table 1 shows the measured melting points of these alloys.
• the table shows Ni 5 QB 5 for comparison. , N i so S i so, ⁇ i 75 ⁇ 25,
• the melting point of the Ni 6oAs 40 alloy is also shown.
• the table shows that the addition of B, P, C, Si-, Cu, Pd, etc. to the binary system further reduced the j melting point.
• an ion species sample having a diameter of 1 to 2 OT was prepared, placed on a resistance heating heater 1 shown in FIG. Lun considered.
• a resistance heating heater 1 shown in FIG. Lun considered.
• any of the samples has good wettability with the chip and little reaction with the chip. It was confirmed that the ion beam could be extracted for more than 100 hours.
• FIG. 2 shows an example of a typical mass spectrometry spectrum of the Ni 45 B45 Sioio seed material of the present invention at a temperature of several mrad. At this time, the extraction voltage is 10.5 kV, and the entire current
• the melting point it is possible to lower the melting point, and it is possible to achieve a longevity when ionizing. Wear.
• longevity could be achieved in a two-element alloy using only one of B, P, Si, C, and As without using a three-element alloy.
• X is one of B, P, Si, C, and As

Landscapes

• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Combustion & Propulsion (AREA)
• Analytical Chemistry (AREA)
• Electron Sources, Ion Sources (AREA)

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=13286735

Family Applications (1)

Country Status (5)

Families Citing this family (4)

Citations (2)

• 1983
  • 1983-04-15 JP JP58065426A patent/JPS59191225A/ja active Granted
• 1984
  • 1984-04-13 DE DE8484901430T patent/DE3484167D1/de not_active Expired - Lifetime
  • 1984-04-13 WO PCT/JP1984/000188 patent/WO1984004202A1/ja not_active Ceased
  • 1984-04-13 EP EP19840901430 patent/EP0140979B1/en not_active Expired
  • 1984-04-16 CA CA000452060A patent/CA1225229A/en not_active Expired

Patent Citations (2)

Non-Patent Citations (1)

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