UST869009I4 - Defensive publication - Google Patents
Defensive publication Download PDFInfo
- Publication number
- UST869009I4 UST869009I4 US869009DH UST869009I4 US T869009 I4 UST869009 I4 US T869009I4 US 869009D H US869009D H US 869009DH US T869009 I4 UST869009 I4 US T869009I4
- Authority
- US
- United States
- Prior art keywords
- curing agent
- defensive publication
- high temperature
- temperature curing
- epoxy resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/243—Two or more independent types of crosslinking for one or more polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Definitions
- Molded articles of epoxy resins readily removable from the most detailed molds can be prepared by mixing 100 parts of the epoxy resin with 10 to 30 parts of a curing agent composition consisting essentially of 30 to 70% by weight of a low temperature curing agent and 70 to 30% by weight of a high temperature curing agent, casting said mixture into a mold, curing said mixture at a temperature below the reaction temperature of the high temperature curing agent to provide a flexible, solid article, removing the article from the mold and curing the article to a rigid solid by heating at the elevated reaction temperature of the high temperature curing agent.
- a preferred curing agent composition consists essentially of 50% by weight of the low and the high temperature curing agent.
- the epoxy resins to which the process of the invention pertains comprise glycidyl polyethers of polyhydric aromatic and aliphatic alcohols. Particularly preferred epoxy resins are the reaction products of epichlorohydrin and bis(4-hydroxyphenyl)-2,2-propane. Diethylene triamine, triethylene triamine. triethylene tetramine, Epon Curing Agent U and Epon Curing Agent T-l are illustrative low temperature curing agents. Diaminodiphenyl sulfone, BF -monethylaminetrifluoride, diethylaminoethanol, methylenediamine and methylenedianiline are illustrative high temperature curing agents.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Insulating Bodies (AREA)
- Details Of Resistors (AREA)
- Epoxy Resins (AREA)
Description
DEFENSIVE PUBLICATION UNITED STATES PATENT OFFICE Published at the request of the applicant or owner in accordance with the Notice of Dec. 16, 1969, 869 O.G. 687. The abstracts of Defensive Publication applications are identified by distinctly numbered series and are arranged chronologically. The heading of each abstract indicates the number of pages of specification, including claims and sheets of drawings contained in the application as originally filed. The files of these applications are available to the public for inspection and reproduction may be purchased for 30 cents a sheet.
Defensive Publication applications have not been examined as to the merits of alleged invention. The Patent Ofiice makes no assertion as to the novelty of the disclosed subject matter.
PUBLISHED DECEMBER 16, 1969 T869,009 DOUBLE HARDENING 0F EPOXY RESINS Lee F. Frank, Kodak Park Works, Rochester, N.Y. 14650 Filed Apr. 18, 1969, Ser. No. 817,546 Int. Cl. B29c 25/00 US. Cl. 264236 No Drawing. 9 Pages Specification Molded articles of epoxy resins readily removable from the most detailed molds can be prepared by mixing 100 parts of the epoxy resin with 10 to 30 parts of a curing agent composition consisting essentially of 30 to 70% by weight of a low temperature curing agent and 70 to 30% by weight of a high temperature curing agent, casting said mixture into a mold, curing said mixture at a temperature below the reaction temperature of the high temperature curing agent to provide a flexible, solid article, removing the article from the mold and curing the article to a rigid solid by heating at the elevated reaction temperature of the high temperature curing agent. A preferred curing agent composition consists essentially of 50% by weight of the low and the high temperature curing agent. The epoxy resins to which the process of the invention pertains comprise glycidyl polyethers of polyhydric aromatic and aliphatic alcohols. Particularly preferred epoxy resins are the reaction products of epichlorohydrin and bis(4-hydroxyphenyl)-2,2-propane. Diethylene triamine, triethylene triamine. triethylene tetramine, Epon Curing Agent U and Epon Curing Agent T-l are illustrative low temperature curing agents. Diaminodiphenyl sulfone, BF -monethylaminetrifluoride, diethylaminoethanol, methylenediamine and methylenedianiline are illustrative high temperature curing agents.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81754669A | 1969-04-18 | 1969-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| UST869009I4 true UST869009I4 (en) | 1969-12-16 |
Family
ID=25223321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US869009D Pending UST869009I4 (en) | 1969-04-18 | 1969-04-18 | Defensive publication |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | UST869009I4 (en) |
| FR (1) | FR2041977A5 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5512372A (en) * | 1992-01-15 | 1996-04-30 | Brochier, S.A. | Epoxy resin composition and applications, in particular in composite structures, using imidazole/polyamine mixture |
-
1969
- 1969-04-18 US US869009D patent/UST869009I4/en active Pending
- 1969-12-05 FR FR6942061A patent/FR2041977A5/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5512372A (en) * | 1992-01-15 | 1996-04-30 | Brochier, S.A. | Epoxy resin composition and applications, in particular in composite structures, using imidazole/polyamine mixture |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2041977A5 (en) | 1971-02-05 |
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