USRE37585E1 - Method for controlling configuration of laser induced breakdown and ablation - Google Patents
Method for controlling configuration of laser induced breakdown and ablation Download PDFInfo
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- USRE37585E1 USRE37585E1 US09/366,685 US36668599A USRE37585E US RE37585 E1 USRE37585 E1 US RE37585E1 US 36668599 A US36668599 A US 36668599A US RE37585 E USRE37585 E US RE37585E
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
- A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F9/00—Methods or devices for treatment of the eyes; Devices for putting-in contact lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
- A61F9/007—Methods or devices for eye surgery
- A61F9/008—Methods or devices for eye surgery using laser
- A61F9/00825—Methods or devices for eye surgery using laser for photodisruption
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Definitions
- the reissue applications are application numbers 09 / 366 , 685 ( the present application ) , which has divisional applications 09 / 775 , 069 and 09 / 775 , 106 .
- This invention relates generally to methods utilizing lasers for modifying internal and external surfaces of material such as by ablation or changing properties in structure of materials. This invention may be used for a variety of materials.
- Laser induced breakdown of a material causes chemical and physical changes, chemical and physical breakdown, disintegration, ablation, and vaporization. Lasers provide good control for procedures which require precision such as inscribing a micro pattern. Pulsed rather than continuous beams are more effective for many procedures, including medical procedures.
- a pulsed laser beam comprises bursts or pulses of light which are of very short duration, for example, on the order of 10 nanoseconds in duration or less. Typically, these pulses are separated by periods of quiescence.
- the peak power of each pulse is relatively high often on the order of gigawatts and capable of intensity on the order of 10 13 w/cm 2 .
- the laser beam is focused onto an area having a selected diameter
- the effect of the beam extends beyond the focused area or spot to adversely affect peripheral areas adjacent to the spot.
- the peripheral area affected is several times greater than the spot itself. This presents a problem, particularly where tissue is affected in a medical procedure.
- current lasers using nanosecond pulses cannot produce features with a high degree of precision and control, particularly when nonabsorptive wavelengths are used.
- the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (F th ) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value.
- the method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value.
- the beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired.
- the invention may be understood by further defining the predetermined laser pulse width as follows: the relationship between fluence breakdown threshold and laser pulse defines a curve having a first portion spanning a range of relatively long (high) pulse width where fluence breakdown threshold (F th ) varies with the square root of pulse width (T 1/2 ). The curve has a second portion spanning a range of short (low) pulse width relative to the first portion.
- the proportionality between fluence breakdown threshold and pulse width differ in the first and second portions of the curve and the predetermined pulse width is that point along the curve between its first and second portions.
- the predetermined pulse width is the point where the F th versus ⁇ p relationship no longer applies, and, of course, it does not apply for pulse widths shorter than the predetermined pulse width.
- F th fluence breakdown threshold
- T 1/2 pulse width
- the invention provides methods for operating in pulse widths to the picosecond and femtosecond regime where we have found that the breakdown threshold (Fth) does not vary with the square root of pulse width (T 1/2 ).
- Pulse width duration from nanosecond down to the femtosecond range is accomplished by generating a short optical pulse having a predetermined duration from an optical oscillator. Next the short optical pulse is stretched in time by a factor of between about 500 and 10,000 to produce a timed stretched optical pulse to be amplified. Then, the time stretched optical pulse is amplified in a solid state amplifying media. This includes combining the time stretched optical pulse with an optical pulse generated by a second laser used to pump the solid state amplifying media. The amplified pulse is then recompressed back to its original pulse duration.
- a laser oscillator generates a very short pulse on the order of 10 to 100 femtoseconds at a relatively low energy, on the order of 0.001 to 10 nanojoules. Then, it is stretched to approximately 100 picoseconds to 1 nanosecond and 0.001 to 10 nanojoules. Then, it is amplified to typically on the order of 0.001 to 1.000 millijoules and 100 picoseconds to 1 nanosecond and then recompressed. In its final state it is 10 to 200 femtoseconds and 0.001 to 1.000 millijoules.
- the system for generating the pulse may vary, it is preferred that the laser medium be sapphire which includes a titanium impurity responsible for the lasing action.
- the method of the invention provides a laser beam which defines a spot that has a lateral gaussian profile characterized in that fluence at or near the center of the beam spot is greater than the threshold fluence whereby the laser induced breakdown is ablation of an area within the spot.
- the maximum intensity is at the very center of the beam waist.
- the pulse width duration be in the femtosecond range although pulse duration of higher value may be used so long as the value is less than the pulse width defined by an abrupt or discernable change in slope of fluence breakdown threshold versus laser beam pulse width.
- a diaphragm, disk, or mask is placed in the path of the beam to block at least a portion of the beam to cause the beam to assume a desired geometric configuration.
- desired beam configurations are achieved by varying beam spot size or through Fourier Transform (FT) pulse shaping to cause a special frequency distribution to provide a geometric shape.
- FT Fourier Transform
- the beam have an energy in the range of 10 nJ (nanojoules) to 1 millijoule and that the beam have a fluence in the range of 0.1 J/cm 2 to 100 J/cm 2 (joules per centimeter square). It is preferred that the wavelength be in a range of 200 nm (nanometer) to 1 ⁇ m (micron).
- the invention provides a new method for determining the optimum pulse width duration regime for a specific material and a procedure for using such regime to produce a precisely configured cut or void in or on a material.
- the regime is reproducible by the method of the invention.
- very high intensity results from the method with a modest amount of energy and the spot size can be very small. Damage to adjoining area is minimized which is particularly important to human and animal tissue.
- FIG. 1 is a schematic representation of a laser induced breakdown experimental system which includes a chirped pulse amplification laser system and means for detecting scattered and transmitted energy. If the sample is transparent, then transmitted energy can also be measured.
- FIG. 2 is a plot of scattered energy versus incident fluence obtained for an opaque (gold) sample using the system in FIG. 1 operated for 150 femtoseconds (fs) pulse duration.
- FIG. 3 is a plot of calculated and experimental values of threshold fluence versus pulse width for gold, with experimental values obtained for the gold sample using the system of FIG. 1 operated at 800 nm wavelength.
- the arrow shows the point on the plot where the F th proportional to T 1/2 no longer applies, as this relationship only holds for pulse widths down to a certain level as shown by the solid line.
- FIG. 4 is a graphical representation of sub-spot size ablation/machining in gold based on arbitrary units and showing F th the threshold fluence needed to initiate material removal; Rs the spot size of the incident beam and Ra the radius of the ablated hole in the x-y plane.
- FIG. 5 is a schematic illustration of a beam intensity profile showing that for laser micro-machining with ultrafast pulse according to the invention, only the peak of the beam intensity profile exceeds the threshold intensity for ablation/machining.
- FIG. 6A and B are schematic illustrations of a beam showing the placement of a disk-shaped mask in the beam path.
- FIG. 7 is a plot of scattered plasma emission and transmitted laser pulse as a function of incident laser pulse energy for a transparent glass sample, SiO 2 .
- FIG. 8 is a plot of fluence threshold (F th ) versus pulse width (T) for the transparent glass sample of FIG. 7 showing that F th varying with T 1/2 only holds for pulse widths down to a certain level as shown by the solid line. Previous work of others is shown in the long pulse width regime (Squares, Smith Optical Eng 17, 1978 and Triangles. Stokowski, NBS Spec Bul 541, 1978).
- FIG. 9 is a plot of fluence threshold versus pulse width for corneal tissue, again showing that the proportionality between F th and pulse width follows the T 1/2 relationship only for pulse widths which are relatively long.
- FIGS. 10 and 11 are plots of plasma emission versus laser fluence showing that at 170 (FIG. 10) pulse width the F th is very clearly defined compared to 7 nm (FIG. 11) pulse width where it is very unclear.
- FIG. 12 is a plot of impact ionization rate per unit distance determined by experiment and theoretical calculation.
- FIGS. 13A and B are schematic illustrations of beam profile along the longitudinal Z axis and sharing precise control of damage—dimension along the Z axis.
- FIG. 1 there is shown an apparatus for performing tests to determine the laser induced breakdown threshold as a function of laser pulse width in the nanosecond to femtosecond range using a chirped-pulse amplification (CPA) laser system.
- CPA chirped-pulse amplification
- CPA systems can be roughly divided into four categories. The first includes the high energy low repetition systems such as ND glass lasers with outputs of several joules but they may fire less than 1 shot per minute. A second category are lasers that have an output of approximately 1 joule and repetition rates from 1 to 20 hertz. The third group consists of millijoule level lasers that operate at rates ranging from 1 to 10 kilohertz. A fourth group of lasers operates at 250 to 350 kilohertz and produces a 1 to 2 microjoules per pulse.
- high energy low repetition systems such as ND glass lasers with outputs of several joules but they may fire less than 1 shot per minute.
- a second category are lasers that have an output of approximately 1 joule and repetition rates from 1 to 20 hertz.
- the third group consists of millijoule level lasers that operate at rates ranging from 1 to 10 kilohertz.
- a fourth group of lasers operates at 250 to 350 kilohertz and produces a 1 to 2 micro
- the illustrative examples described below generally pertain to pulse energies less than a microjoule and often in the nanojoule range with pulse duration in the range of hundreds of picoseconds or less and the frequency on the order of 1 kilohertz. But these examples are merely illustrative and the invention is not limited thereby.
- a short pulse is generated.
- the pulse from the oscillator is sufficiently short so that further pulse compression is not necessary.
- the pulse is stretched by a grating pair arranged to provide positive group velocity dispersion.
- the amount the pulse is stretched depends on the amount of amplification. Below a millijoule, tens of picoseconds are usually sufficient.
- a first stage of amplification typically takes place in either a regenerative or a multipass amplifier. In one configuration this consists of an optical resonator that contains the gain media, a Pockels cell, and a thin film polarizer. After the regenerative amplification stage the pulse can either be recompressed or further amplified.
- the compressor consists of a grating or grating pair arranged to provide negative group velocity dispersion. Gratings are used in the compressor to correspond to those in the stretching stage. More particulars of a typical system are described in U.S. Pat. No. 5,235,606, previously incorporated herein by reference.
- An important aspect of the invention is the development of a characteristic curve of fluence breakdown threshold F th as a function of laser pulse width specific to a material. Then identify on such curve, the point at which there is an abrupt, or distinct and rapid change or at least a discernable change in slope characteristic of the material. In general it is more desirable to operate past this point because of the more precise control of the laser induced breakdown (LIB) or ablation threshold.
- LIB laser induced breakdown
- FIG. 1 shows an experimental setup for determining threshold fluence by determining scattered energy versus incident fluence and by determining threshold fluence versus pulse width.
- the system includes means for generating a pulsed laser beam as described earlier, and means, typically a lens, for collecting emission from the target to a photomultiplier tube. Change of transmission through a transparent sample is measured with an energy meter.
- FIG. 2 shows a plot of data obtained from an absorbing medium which is gold using 150 fs pulse and FIG. 3 shows threshold fluence versus pulse width.
- the arrow in FIG. 3 identifies the point at which the relationship between the threshold fluence and pulse width varies dramatically.
- the electron thermalization time for laser deposited energy in gold is on the order of, or less than, 500 fs and the electron-lattice interaction time is 1 ps.
- the consequences of this four ultrafast laser pulses is that the energy is contained within the beam spot. In fact for energies at or near the threshold for ablation, the spatial profile of the laser beam will determine the size and shape of the region being ablated (FIGS. 4 and 5 ).
- the ablated spot or hole can in principle be smaller than the spot size, R s .
- This concept is shown schematically in FIG. 5 .
- the data for a 150 fs pulse is shown in FIG. 4, this threshold behavior is exhibited in a wide range of pulse widths.
- sub spot size ablation is not possible in the longer pulse regimes, due to the dominance of thermal diffusion as will be described below.
- the spatial resolution of the ablation/machining process can be considerably less than the wavelength of the laser radiation used to produce it.
- the ablated holes have an area or diameter less than the area or diameter of the spot size.
- the ablated hole has a size (diameter) less than the fundamental wavelength size.
- the basic method of the invention may be utilized in alternative embodiments depending on the desired configurations of the induced breakdown. Examples include, but are not limited to using a mask in the beam path, varying spot size, adjusting focus position by moving the lens, adjusting laser cavity design, Fourier Transform (FT) shaping, using a laser operating mode other than TEMoo, and adjusting the Rayleigh range, the depth of focus or beam waist.
- FT Fourier Transform
- FIG. 6A and B The use of a mask is illustrated in FIG. 6A and B.
- the basic method consists of placing a mask in the beam path or on the target itself. If it is desired to block a portion of the beam, the mask should be made of an opaque material and be suspended in the beam path (FIG. 6) alternatively, the mask may be placed on the target and be absorptive so as to contour the target to the shape of the mask (FIG. 6 B).
- the varying spot size is accomplished by varying the laster f/#, varying the focal length of the lens or input beam size to the lens as by adjustable diaphragm.
- Operation in other than the TEMoo mode means that higher order transverse modes could be used. This affects the beam and material as follows: the beam need not be circular or gaussian in intensity. The material will be ablated corresponding to the beam shape.
- the Rayleigh range (Z axis) may be adjusted by varying the beam diameter, where the focal plane is in the x-y axis.
- the short pulse laser used was a 10 Hz Ti:Sapphire oscillator amplifier system based on the CPA technique.
- the Rayleigh length of the focused beam is ⁇ 2 mm.
- the focused spot size was measured in-situ by a microscope objective lens.
- the measured spot size FWHM full width at half max
- the fused silica samples were made from Corning 7940, with a thickness of 0.15 mm. They were optically polished on both sides with a scratch/dig of 20-10. Each sample was cleaned by methanol before the experiment. Thin samples were used in order to avoid the complications of self-focusing of the laser pulses in the bulk.
- the SiO 2 sample was mounted on a computer controlled motorized X-Y translation stage. Each location on the sample was illuminated by the laser only once.
- the decrease in transmitted light is due to the reflection, scattering, and absorption by the plasma.
- FIG. 8 shows the fluence breakdown threshold F th as a function of laser pulse width. From 7 ns to about 10 ps, the breakdown threshold follows the scaling in the relatively long pulse width regime (triangles and squares) are also shown as a comparison—it can be seen that the present data is consistent with earlier work only in the higher pulse width portion of the curve. When the pulse width becomes shorter than a few picoseconds, the threshold starts to increase. As noted earlier with respect to opaque material (metal), this increased precision at shorter pulse widths is surprising. A large increase in damage threshold accuracy is observed, consistent with the multiphoton avalanche breakdown theory. (See FIGS. 8 and 9 ). It is possible to make features smaller than spot size in the x-y focal plane and smaller than the Rayleigh range (depth of focus) in the longitudinal direction or Z axis. These elements are essential to making features smaller than spot size or Rayleigh range.
- a series of experiments was performed to determine the breakdown threshold of cornea as a function of laser pulse width between 150 fs-7 ns, using a CPA laser system.
- laser pulse width can be varied while all other experimental parameters (spot size, wavelength, energy, etc.) remain unchanged.
- the laser was focused to a spot size (FWHM) of 26 ⁇ m in diameter.
- the plasma emission was recorded as a function of pulse energy in order to determine the tissue damage threshold. Histologic damage was also assessed.
- Breakdown thresholds calculated from plasma emission data revealed deviations from the scaling law. F th ⁇ T 1/2 , as in the case of metals and glass. As shown in FIG. 9, the scaling law of the fluence threshold is true to about 10 ps, and fail when the pulse shortens to less than a few picoseconds. As shown in FIGS. 10 and 11, the ablation or LIB threshold varies dramatically at high (long) pulse width. It is very precise at short pulse width. These results were obtained at 770 nm wavelength. The standard deviation of breakdown threshold measurements decreased markedly with shorter pulses. Analysis also revealed less adjacent histological damage with pulses less than 10 ps.
- the breakdown threshold for ultrashort pulses ( ⁇ 10 ps) is less than longer pulses and has smaller standard deviations. Reduced adjacent histological damage to tissue results from the ultrashort laser pulses.
- sub-wavelength holes can be machined into metal surfaces using femtosecond laser pulses.
- the effect is physically understood in terms of the thermal diffusion length, over the time period of the pulse deposition, being less than the absorption depth of the incident radiation.
- the interpretation is further based on the hole diameter being determined by the lateral gaussian distribution of the pulse in relation to the threshold for vaporization and ablation.
- Laser induced optical breakdown dielectrics consists of three general steps: free electron generation and multiplication, plasma heating and material deformation or breakdown. Avalanche ionization and multiphoton ionization are the two processes responsible for the breakdown.
- the invention takes advantage of the heretofore unknown regime where breakdown threshold does not follow the scaling law when suitably short laser pulses are used, such as shorter than 7 picoseconds for gold and 10 picoseconds for SiO 2 .
- n e (t) is the free electron (plasma) density
- ⁇ (E) is the avalanche coefficient
- E is the electric field strength.
- the second term on the right hand side is the photoionization contribution
- the third term is the loss due to electron diffusion, recombination, etc.
- Photoionization contribution can be estimated by the tunneling rate.
- E ⁇ 10 8 V/cm the tunneling rate is estimated to be w ⁇ 4 ⁇ 10 9 sec ⁇ 1 , which is small compared to that of avalanche, which is derived below.
- photoionization can provide the initial electrons needed for the avalanche processes at short pulse widths.
- the data shows at 1 ps, the rms field threshold is about 5 ⁇ 10 7 V/cm. The field will reach a value of 3.5 ⁇ 10 7 V/cm (ms) at 0.5 ps before the peak of the pulse, and w ⁇ 100 sec ⁇ 1 .
- the electron density can reach n e ⁇ n t [1 ⁇ exp( ⁇ w ⁇ t)] ⁇ 10 11 cm ⁇ 3 , where n t ⁇ 10 22 is the total initial valence band electron density.
- the applied electric field is on the order of a few tens of MV/cm and higher.
- the electrons have an average energy of ⁇ 5 eV, and the electron collision time is less than 0.4 fs for electrons with energy U ⁇ 5-6 eV.
- Electrons will make more than one collision during one period of the electric oscillation.
- the electric field is essentially a dc field to those high energy electrons.
- ⁇ the ionization rate per unit length
- P(E) the probability of the electron has an energy ⁇ U i
- ⁇ (E) (eE/U i )P(E).
- the dashed line is corrected by a factor of 1.7, which results in an excellent fit with the experimental data.
- This factor of 1.7 is of relatively minor importance, as it can be due to a systematic correction, or because breakdown occurred on the surface first, which could have a lower threshold.
- the uncertainty of the saturation value of v drift also can be a factor.
- the most important aspect is that the shape (slope) of the curve given by the equation provides excellent agreement with the experimental data.
- the mechanism of laser induced breakdown in fused silica (Example 2), using pulses as short as 150 fs and wavelength at 780 nm, is likely still dominated by the avalanche process.
- Opaque and transparent materials have common characteristics in the curves of FIGS. 3, 8 , and 9 each begins with F th versus T 1/2 behavior but then distinct change from that behavior is evident. From the point of deviation, each curve is not necessarily the same since the materials differ. The physical characteristics of each material differ requiring a material specific analysis.
- the energy deposition mechanism is by dielectric breakdown.
- the optical radiation is releasing electrons by multiphoton ionization (M PI) that are tightly bound and then accelerating them to higher energies by high field of the laser. It is thought that only a small amount of relatively high energy electrons exist prior to the laser action. The electrons in turn collide with other bound electrons and release them in the avalanching process.
- M PI multiphoton ionization
- the threshold is precisely defined it is possible to damage the material precisely at the waist and have a damaged volume representing only a fraction of the waist in the R direction or in the Z direction. It is very important to control precisely the damage threshold or the laser intensity fluctuation.
- the damage would be much smaller than the beam waist in the R direction.
- Small cavities, holes, or damage can have dimensions smaller than the Rayleigh range (Z R ) in the volume of the transparent, dielectric material.
- the lens can be moved to increase the size of the hole or cavity in the Z direction. In this case, the focal point is essentially moved along the Z axis to increase the longitudinal dimension of the hole or cavity.
- the invention identifies the regime where breakdown threshold fluence does not follow the scaling law and makes use of such regime to provide greater precision of laser induced breakdown, and to induce breakdown in a preselected pattern in a material or on a material.
- the invention makes it possible to operate the laser where the breakdown or ablation threshold becomes essentially accurate. The accuracy can be clearly seen by the I-bars along the curves of FIGS. 8 and 9. The I-bars consistently show lesser deviation and correspondingly greater accuracy in the regime at or below the predetermined pulse width.
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Abstract
Description
Claims (54)
Priority Applications (1)
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US09/366,685 USRE37585E1 (en) | 1994-04-08 | 1999-08-04 | Method for controlling configuration of laser induced breakdown and ablation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/224,961 US5656186A (en) | 1994-04-08 | 1994-04-08 | Method for controlling configuration of laser induced breakdown and ablation |
US09/366,685 USRE37585E1 (en) | 1994-04-08 | 1999-08-04 | Method for controlling configuration of laser induced breakdown and ablation |
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US08/224,961 Reissue US5656186A (en) | 1994-04-08 | 1994-04-08 | Method for controlling configuration of laser induced breakdown and ablation |
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USRE37585E1 true USRE37585E1 (en) | 2002-03-19 |
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US09/366,685 Expired - Lifetime USRE37585E1 (en) | 1994-04-08 | 1999-08-04 | Method for controlling configuration of laser induced breakdown and ablation |
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US08/224,961 Ceased US5656186A (en) | 1994-04-08 | 1994-04-08 | Method for controlling configuration of laser induced breakdown and ablation |
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EP (1) | EP0754103B1 (en) |
JP (2) | JP3283265B2 (en) |
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CA (1) | CA2186451C (en) |
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WO (1) | WO1995027587A1 (en) |
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US5656186A (en) | 1997-08-12 |
EP0754103B1 (en) | 1997-11-05 |
JP3283265B2 (en) | 2002-05-20 |
ATE159880T1 (en) | 1997-11-15 |
CA2186451C (en) | 2009-06-02 |
EP0754103A1 (en) | 1997-01-22 |
WO1995027587A1 (en) | 1995-10-19 |
AU684633B2 (en) | 1997-12-18 |
DE69500997D1 (en) | 1997-12-11 |
AU2274195A (en) | 1995-10-30 |
DE69500997T2 (en) | 1998-04-30 |
JP3824522B2 (en) | 2006-09-20 |
CA2186451A1 (en) | 1995-10-19 |
JPH09511688A (en) | 1997-11-25 |
JP2002205179A (en) | 2002-07-23 |
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