USRE30348E - Solder preform - Google Patents
Solder preform Download PDFInfo
- Publication number
- USRE30348E USRE30348E US06/002,325 US232579A USRE30348E US RE30348 E USRE30348 E US RE30348E US 232579 A US232579 A US 232579A US RE30348 E USRE30348 E US RE30348E
- Authority
- US
- United States
- Prior art keywords
- tin
- silver
- solder preform
- alloy
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 34
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 18
- 239000000956 alloy Substances 0.000 claims abstract description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 239000004332 silver Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 230000003647 oxidation Effects 0.000 claims abstract description 6
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 6
- 239000012530 fluid Substances 0.000 claims abstract description 5
- 239000008240 homogeneous mixture Substances 0.000 claims abstract description 5
- 239000013078 crystal Substances 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 description 9
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12687—Pb- and Sn-base components: alternative to or next to each other
Definitions
- solder preform of the present invention is useful, inter alia, in the fabrication of a hermetically sealed container for a semiconductor device as described and claimed in Applicant's Pat. No. 3,823,468, issued July 16, 1974, and entitled "Method of Fabricating an Hermetically Sealed Container".
- solder preform of the present invention is of particular utility in hermetically sealing a container for a semiconductor device such as an integrated circuit which must be protected from exposure to ambient atmosphere.
- solder preform formed of an eutectic alloy comprising substantially 80% gold and 20% tin, which has the advantages that it has a desirably high melting point of about 280° C. and it has a high tensile strength, ensuring against breaking of the seal due to shocks or rough handling of the semiconductor package. While such solder preforms are eminently satisfactory in use, the recent extreme increase in the price of gold has made them very costly.
- solder alloys made from tin, silver, antimony, and other elements have been used to a limited extent but it has been found that they have severe functional limitations in that the melting point of the solder is undesirably low and the tensile strength of the solder joint is low compared to one made of a gold-tin eutectic alloy.
- a solder preform .[.for hermetically sealing a cover to a container for a semiconductor package.]. comprises a relatively thick flat ring of an alloy .[.consisting of 90-97% lead, 1-4% tin, and 1-4% silver.]. .Iadd.comprising preponderantly lead and tin .Iaddend.and having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of 92-98% tin and 2-8% silver.
- FIG. 1 is a perspective view of a portion of a strip of metallic ribbon from which a solder preform of the invention may be punched;
- FIG. 2 is a perspective view of a solder preform embodying the invention.
- a composite metallic strip 10 comprising a central, relatively thick core 11 of an alloy having the characteristic that it solidifies from the fluid state as a homogeneous mixture, for example an alloy consisting of 90-97% lead, 1-4% tin, and 1-4% silver, preferably consisting of substantially 95% lead, 2.5% tin, and 2.5% silver.
- the core 11 has relatively thin coatings 12, 13 on its upper and lower surfaces respectively, these coatings being of an oxidation-resistant alloy, for example, an alloy consisting of 92-98% tin and 2-8% silver, preferably consisting of substantially 96.5% tin and 3.5% silver.
- the coatings 12, 13 may be formed on the core 11 by cladding, electroplating, or equivalent process.
- solder preform rings such as the ring 14 shown in dashed outline in FIG. 1.
- the resultant punched solder preform ring 14 is shown in FIG. 2 comprising a central, relatively thick flat ring 15 and upper and lower coatings 16,17 respectively.
- the function of the tin-silver coatings 16,17 on each surface of the lead core or ring 15 is to resist oxidation. Without such a coating, the lead alloy core would oxidize readily and the exposed oxidized surface would inhibit wetting of the solder to the metal cover and to the sealing ring of the semiconductor container. Fluxes to dissolve the oxide cannot be used because such a flux would contaminate the inside of the cavity of the semiconductor container and adversely affect the operation of the semiconductor device in the container.
- the central ring 15 is relatively thick, for example 0.0016 inch, while each of the coatings 16,17 is relatively thin, for example 0.0002 inch.
- the solder preform ring 14 melts, it wets the cover and the surface of the sealing ring of a semiconductor container and alloying of the outer portions of the tin-alloy coatings 16,17 with the central core 15 of lead alloy takes place.
- the resultant solder, after sealing, is very high in lead content and results in a relatively high sealing temperature, typically 275° C.
- the high-lead-content solder ring 15 has excellent tensile strength characteristics and compares favorably with the currently accepted gold-tin eutectic solder.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating With Molten Metal (AREA)
Abstract
A solder preform for hermetically sealing a cover to a container for a semiconductor package comprises a relatively thick flat ring of an alloy consisting of substantially 95% lead, 2.5% tin, and 2.5% silver, which alloy has the characteristic that it solidifies from the fluid state as a homogeneous mixture without substantial separation of the minority element crystals. The solder preform further comprises a relatively thin coating clad on each surface of the flat ring of an oxidation-resistant alloy, preferably an alloy consisting of substantially 96.5% tin and 3.5% silver.
Description
The solder preform of the present invention is useful, inter alia, in the fabrication of a hermetically sealed container for a semiconductor device as described and claimed in Applicant's Pat. No. 3,823,468, issued July 16, 1974, and entitled "Method of Fabricating an Hermetically Sealed Container".
1. Field of the Invention
The solder preform of the present invention is of particular utility in hermetically sealing a container for a semiconductor device such as an integrated circuit which must be protected from exposure to ambient atmosphere.
2. Description of the Prior Art
In the manufacture of semiconductor devices, there has been a requirement for hermetically sealing the container in which the active semiconductor device is housed, usually a cavity in a metallic or ceramic body. For this purpose, a metallic cover and a solder preform ring have been used. Initially, the cover, the solder preform, and the container were individually assembled and heated to fuse the solder to the cover and to the container as illustrated and described in U.S. Pat. No. 3,340,602 to Hontz. More recently, the solder preform ring has been preattached to the sealing cover and the resulting unit disposed over the container of the semiconductor device and heated to fuse the solder preform to the cover and to the container as illustrated and described in Applicant's U.S. Pat. Nos. 3,823,468 and 3,874,549. This latter method has the advantage that it permits the use of automatic machines for assembling the combination cover-solder preform units and the semiconductor container for fusing the solder unit as described.
In each of the foregoing methods of fabricating hermetically sealed semiconductor packages, it has been customary to use a solder preform formed of an eutectic alloy comprising substantially 80% gold and 20% tin, which has the advantages that it has a desirably high melting point of about 280° C. and it has a high tensile strength, ensuring against breaking of the seal due to shocks or rough handling of the semiconductor package. While such solder preforms are eminently satisfactory in use, the recent extreme increase in the price of gold has made them very costly. In an effort to reduce the cost of such gold-tin solder preforms, solder alloys made from tin, silver, antimony, and other elements have been used to a limited extent but it has been found that they have severe functional limitations in that the melting point of the solder is undesirably low and the tensile strength of the solder joint is low compared to one made of a gold-tin eutectic alloy.
It is an object of the invention, therefore, to provide a new and improved solder preform .[.for use in hermetically sealing a container for a semiconductor device.]. which has the desirable characteristics of the gold-tin eutectic solder preform described above but which is must lower in cost.
In accordance with the invention, a solder preform .[.for hermetically sealing a cover to a container for a semiconductor package.]. comprises a relatively thick flat ring of an alloy .[.consisting of 90-97% lead, 1-4% tin, and 1-4% silver.]. .Iadd.comprising preponderantly lead and tin .Iaddend.and having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of 92-98% tin and 2-8% silver.
For a better understanding of the present invention, together with other and further objects thereof, reference is had to the following description, taken in connection with the accompanying drawing, while its scope will be pointed out in the appended claims.
FIG. 1 is a perspective view of a portion of a strip of metallic ribbon from which a solder preform of the invention may be punched; while
FIG. 2 is a perspective view of a solder preform embodying the invention.
Referring to FIG. 1, there is illustrated a composite metallic strip 10 comprising a central, relatively thick core 11 of an alloy having the characteristic that it solidifies from the fluid state as a homogeneous mixture, for example an alloy consisting of 90-97% lead, 1-4% tin, and 1-4% silver, preferably consisting of substantially 95% lead, 2.5% tin, and 2.5% silver. The core 11 has relatively thin coatings 12, 13 on its upper and lower surfaces respectively, these coatings being of an oxidation-resistant alloy, for example, an alloy consisting of 92-98% tin and 2-8% silver, preferably consisting of substantially 96.5% tin and 3.5% silver. The coatings 12, 13 may be formed on the core 11 by cladding, electroplating, or equivalent process.
From the strip 10 may be punched a series of solder preform rings such as the ring 14 shown in dashed outline in FIG. 1. The resultant punched solder preform ring 14 is shown in FIG. 2 comprising a central, relatively thick flat ring 15 and upper and lower coatings 16,17 respectively.
As stated, the function of the tin- silver coatings 16,17 on each surface of the lead core or ring 15 is to resist oxidation. Without such a coating, the lead alloy core would oxidize readily and the exposed oxidized surface would inhibit wetting of the solder to the metal cover and to the sealing ring of the semiconductor container. Fluxes to dissolve the oxide cannot be used because such a flux would contaminate the inside of the cavity of the semiconductor container and adversely affect the operation of the semiconductor device in the container.
As stated, the central ring 15 is relatively thick, for example 0.0016 inch, while each of the coatings 16,17 is relatively thin, for example 0.0002 inch.
In the hermetic sealing of a cover to a semiconductor container, as the solder preform ring 14 melts, it wets the cover and the surface of the sealing ring of a semiconductor container and alloying of the outer portions of the tin- alloy coatings 16,17 with the central core 15 of lead alloy takes place. In addition, the tin- alloy coatings 16,17 alloy with the metal plating, usually gold or silver, on the cover and the sealing ring of the container. The resultant solder, after sealing, is very high in lead content and results in a relatively high sealing temperature, typically 275° C. In addition, the high-lead-content solder ring 15 has excellent tensile strength characteristics and compares favorably with the currently accepted gold-tin eutectic solder.
While there has been described what is, at present, considered to be the preferred embodiment of the invention, it will be obvious to those skilled in the art that various changes and modifications may be made therein, without departing from the invention, and it is, therefore, aimed in the appended claims to cover all such changes and modifications as fall within the true spirit and scope of the invention.
Claims (3)
1. A solder preform .[.for hermetically sealing a cover to a container for a semiconductor package.]. comprising a relatively thick flat ring of an alloy consisting of 90-97% lead, 1-4% tin, and 1-4% silver and having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of 92-98% tin and 2-8% silver.
2. A solder preform in accordance with claim 1 in which said ring is an alloy consisting of substantially 95% lead, 2.5% tin, and 2.5% silver.
3. A solder preform in accordance with claim 1 in which said coating is an alloy consisting of substantially 96.5% tin and 3.5% silver. .Iadd. 4. A solder preform comprising a relatively thick flat ring of an alloy comprising preponderantly lead and tin and having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin coating clad on each surface thereof of an oxidation-resistant alloy consisting of 92-98% tin and 2-8% silver..Iaddend.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/002,325 USRE30348E (en) | 1979-01-10 | 1979-01-10 | Solder preform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/002,325 USRE30348E (en) | 1979-01-10 | 1979-01-10 | Solder preform |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US05/615,545 Reissue US4020987A (en) | 1975-09-22 | 1975-09-22 | Solder preform for use in hermetically sealing a container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USRE30348E true USRE30348E (en) | 1980-07-29 |
Family
ID=21700257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US06/002,325 Expired - Lifetime USRE30348E (en) | 1979-01-10 | 1979-01-10 | Solder preform |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USRE30348E (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4331258A (en) | 1981-03-05 | 1982-05-25 | Raychem Corporation | Sealing cover for an hermetically sealed container |
| US4524241A (en) | 1979-12-18 | 1985-06-18 | Thomson-Brandt | Insulated multiwire electric cable having protected solderable and non-heat-sealing conductors |
| US4746055A (en) | 1984-12-21 | 1988-05-24 | Brown, Boveri & Cie Ag | Method and connecting material for the metallic joining of parts |
| US5086966A (en) * | 1990-11-05 | 1992-02-11 | Motorola Inc. | Palladium-coated solder ball |
| US5476726A (en) * | 1992-01-22 | 1995-12-19 | Hitachi, Ltd. | Circuit board with metal layer for solder bonding and electronic circuit device employing the same |
| US5957364A (en) | 1996-06-10 | 1999-09-28 | Indium Corporation Of America | Integrated solder preform array having a tin outer coating |
| US6186390B1 (en) * | 1997-12-26 | 2001-02-13 | Kabushiki Kaisha Toshiba | Solder material and method of manufacturing solder material |
| US6253986B1 (en) * | 1997-07-09 | 2001-07-03 | International Business Machines Corporation | Solder disc connection |
| US20050265669A1 (en) * | 2003-09-05 | 2005-12-01 | Trebor Heminway | Solder preform for low heat stress laser solder attachment |
| US20060204177A1 (en) * | 2005-03-14 | 2006-09-14 | Matsushita Electric Industrial Co., Ltd. | Low cost, high precision multi-point optical component attachment |
| US7140783B2 (en) | 2004-02-06 | 2006-11-28 | Matsushita Electric Industrial Co., Ltd. | Diamond 2D scan for aligning an optical fiber to an optical output port |
| US20110220704A1 (en) * | 2010-03-09 | 2011-09-15 | Weiping Liu | Composite solder alloy preform |
| US20120074210A1 (en) * | 2009-04-09 | 2012-03-29 | Abb Technology Ag | Soldering preform |
| US9802274B2 (en) * | 2016-03-21 | 2017-10-31 | Indium Corporation | Hybrid lead-free solder wire |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US150623A (en) * | 1874-05-05 | Improvement in compound metals and alloys for solder | ||
| US2151302A (en) * | 1936-06-26 | 1939-03-21 | Reynolds Metals Co | Tin alloy |
| US3305389A (en) * | 1963-11-12 | 1967-02-21 | M & T Chemicals Inc | Process of coating lead with tin |
| US3465943A (en) * | 1965-03-16 | 1969-09-09 | Bell Telephone Labor Inc | Apparatus for making encapsulations |
| US3639218A (en) * | 1969-10-08 | 1972-02-01 | Ibm | Shelf life improvement of electroplated solder |
-
1979
- 1979-01-10 US US06/002,325 patent/USRE30348E/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US150623A (en) * | 1874-05-05 | Improvement in compound metals and alloys for solder | ||
| US2151302A (en) * | 1936-06-26 | 1939-03-21 | Reynolds Metals Co | Tin alloy |
| US3305389A (en) * | 1963-11-12 | 1967-02-21 | M & T Chemicals Inc | Process of coating lead with tin |
| US3465943A (en) * | 1965-03-16 | 1969-09-09 | Bell Telephone Labor Inc | Apparatus for making encapsulations |
| US3639218A (en) * | 1969-10-08 | 1972-02-01 | Ibm | Shelf life improvement of electroplated solder |
Non-Patent Citations (1)
| Title |
|---|
| "Brazing and Soldering Alloys-Part I" Mar. 27, 1962 Semi-Alloys Inc., Mt. Vernon, N.Y. * |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4524241A (en) | 1979-12-18 | 1985-06-18 | Thomson-Brandt | Insulated multiwire electric cable having protected solderable and non-heat-sealing conductors |
| US4331258A (en) | 1981-03-05 | 1982-05-25 | Raychem Corporation | Sealing cover for an hermetically sealed container |
| US4746055A (en) | 1984-12-21 | 1988-05-24 | Brown, Boveri & Cie Ag | Method and connecting material for the metallic joining of parts |
| US5086966A (en) * | 1990-11-05 | 1992-02-11 | Motorola Inc. | Palladium-coated solder ball |
| US5476726A (en) * | 1992-01-22 | 1995-12-19 | Hitachi, Ltd. | Circuit board with metal layer for solder bonding and electronic circuit device employing the same |
| US5957364A (en) | 1996-06-10 | 1999-09-28 | Indium Corporation Of America | Integrated solder preform array having a tin outer coating |
| US6253986B1 (en) * | 1997-07-09 | 2001-07-03 | International Business Machines Corporation | Solder disc connection |
| US6186390B1 (en) * | 1997-12-26 | 2001-02-13 | Kabushiki Kaisha Toshiba | Solder material and method of manufacturing solder material |
| US20050265669A1 (en) * | 2003-09-05 | 2005-12-01 | Trebor Heminway | Solder preform for low heat stress laser solder attachment |
| US7410088B2 (en) | 2003-09-05 | 2008-08-12 | Matsushita Electric Industrial, Co., Ltd. | Solder preform for low heat stress laser solder attachment |
| US7140783B2 (en) | 2004-02-06 | 2006-11-28 | Matsushita Electric Industrial Co., Ltd. | Diamond 2D scan for aligning an optical fiber to an optical output port |
| US7201519B2 (en) | 2004-02-06 | 2007-04-10 | Matsushita Electric Industrial Co., Ltd. | Diamond 2D scan for aligning an optical fiber to an optical output port |
| US20060204177A1 (en) * | 2005-03-14 | 2006-09-14 | Matsushita Electric Industrial Co., Ltd. | Low cost, high precision multi-point optical component attachment |
| US7263260B2 (en) | 2005-03-14 | 2007-08-28 | Matsushita Electric Industrial Co., Ltd. | Low cost, high precision multi-point optical component attachment |
| US20120074210A1 (en) * | 2009-04-09 | 2012-03-29 | Abb Technology Ag | Soldering preform |
| US20110220704A1 (en) * | 2010-03-09 | 2011-09-15 | Weiping Liu | Composite solder alloy preform |
| US8348139B2 (en) * | 2010-03-09 | 2013-01-08 | Indium Corporation | Composite solder alloy preform |
| US9802274B2 (en) * | 2016-03-21 | 2017-10-31 | Indium Corporation | Hybrid lead-free solder wire |
| US10328533B2 (en) | 2016-03-21 | 2019-06-25 | Indium Corporation | Hybrid lead-free solder wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: ALLIED CORPORATION COLUMBIA ROAD AND PARK AVE.MORR Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:SEMI-ALLOYS,INC.;REEL/FRAME:004101/0624 Effective date: 19830329 |
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| AS | Assignment |
Owner name: SEMI-ALLOYS INC., 888 SOUTH COLUMBUS AVENUE, MOUNT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:ALLIED CORPORATION, A CORP. OF NY;REEL/FRAME:004747/0240 Effective date: 19870717 |
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| AS | Assignment |
Owner name: WELLS FARGO BANK NATIONAL ASSOCIATION Free format text: SECURITY INTEREST;ASSIGNORS:HENLEY MANUFACTURING HOLDING COMPANY, INC.;GENERAL CHEMICAL CORPORATION;PRESTOLITE WIRE CORPORATION;AND OTHERS;REEL/FRAME:005133/0534 Effective date: 19890703 |
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| AS | Assignment |
Owner name: FLEET PRECIOUS METALS INC. A RI CORPORATION Free format text: SECURITY INTEREST;ASSIGNOR:SEMI-ALLOYS COMPANY, A LIMITED LIABILITY COMPANY;REEL/FRAME:005909/0478 Effective date: 19910926 Owner name: FLEET NATIONAL BANK A NATIONAL BANKING ASSOCIATIO Free format text: SECURITY INTEREST;ASSIGNOR:SEMI-ALLOYS COMPANY, A LIMITED LIABILITY COMPANY;REEL/FRAME:005909/0478 Effective date: 19910926 |
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Owner name: SEMI-ALLOYS INC., NEW YORK Free format text: CHANGE OF NAME;ASSIGNOR:HENLEY MANUFACTURING HOLDING COMPANY, INC.;REEL/FRAME:007022/0621 Effective date: 19901011 Owner name: HENLEY MANUFACTURING HOLDING COMPANY, INC., NEW YO Free format text: MERGER;ASSIGNOR:SEMI-ALLOYS INC.;REEL/FRAME:007022/0544 Effective date: 19900930 |
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Owner name: SEMI-ALLOYS COMPANY, NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SEMI-ALLOYS INC.;REEL/FRAME:007194/0720 Effective date: 19941101 |