USD986840S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD986840S1
USD986840S1 US29/758,000 US202029758000F USD986840S US D986840 S1 USD986840 S1 US D986840S1 US 202029758000 F US202029758000 F US 202029758000F US D986840 S USD986840 S US D986840S
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US
United States
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semiconductor device
perspective
taken along
along line
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US29/758,000
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English (en)
Inventor
Toshifumi Ishida
Kensuke Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Nuvoton Technology Corp Japan
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Panasonic Intellectual Property Management Co Ltd
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Assigned to NUVOTON TECHNOLOGY CORPORATION JAPAN reassignment NUVOTON TECHNOLOGY CORPORATION JAPAN ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKAHASHI, KENSUKE, ISHIDA, TOSHIFUMI
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US29/758,000 2020-05-13 2020-11-11 Semiconductor device Active USD986840S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202030216324 2020-05-13
CN202030216324.5 2020-05-13

Publications (1)

Publication Number Publication Date
USD986840S1 true USD986840S1 (en) 2023-05-23

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ID=76084296

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US29/758,000 Active USD986840S1 (en) 2020-05-13 2020-11-11 Semiconductor device

Country Status (2)

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US (1) USD986840S1 (enrdf_load_stackoverflow)
JP (1) JP1686546S (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1016017S1 (en) * 2021-05-13 2024-02-27 Mississippi State University Electrical enclosure with magnetic cable spooling management
USD1022711S1 (en) * 2019-12-03 2024-04-16 Jelly Drops Ltd. Packaging for foodstuffs
USD1054389S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1054390S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687553A (en) * 1985-05-30 1987-08-18 Eltech Systems Corporation Unitized electrode-intercell connector module
USD345963S (en) * 1991-10-30 1994-04-12 Sanyo Electric Co., Ltd. Hybrid integrated circuit
US5777387A (en) * 1995-09-29 1998-07-07 Nec Corporation Semiconductor device constructed by mounting a semiconductor chip on a film carrier tape
US6288445B1 (en) * 1998-08-04 2001-09-11 Nec Corporation Semiconductor device
USD455751S1 (en) * 2001-08-14 2002-04-16 Intec, Inc. Electronic memory card
US6788541B1 (en) * 2003-05-07 2004-09-07 Bear Hsiung LED matrix moldule
US20050098885A1 (en) * 2003-10-10 2005-05-12 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
USD522975S1 (en) * 2004-10-14 2006-06-13 Toshiba Lighting & Technology Corporation Light emitting diode module
US20070035009A1 (en) * 2005-08-12 2007-02-15 Sung-Wook Hwang Printed circuit board, semiconductor package and multi-stack semiconductor package using the same
USD539943S1 (en) * 2005-02-28 2007-04-03 Toshiba Lighting & Technology Corporation Light emitting diode lamp
US7323218B2 (en) * 2002-12-30 2008-01-29 Industrial Technology Research Institute Synthesis of composite nanofibers for applications in lithium batteries
US20080156369A1 (en) * 2006-12-29 2008-07-03 Industrial Technology Research Institute Active layers utilized in solar cells and fabrication method thereof
US20090014871A1 (en) * 2007-07-13 2009-01-15 Infineon Technologies Ag Semiconductor device
US20090135567A1 (en) * 2007-11-23 2009-05-28 Industrial Technology Research Institute Metal thermal interface material and thermal module and packaged microelectronic component containing the material
US20090321912A1 (en) * 2008-06-25 2009-12-31 Elpida Memory, Inc. Semiconductor device and method of manufacturing the same
US20100176509A1 (en) * 2009-01-15 2010-07-15 Sony Corporation Semiconductor device and method of fabricating the same
US20110117700A1 (en) * 2009-11-18 2011-05-19 Advanced Semiconductor Engineering, Inc. Stackable semiconductor device packages
US20110171777A1 (en) * 2010-01-08 2011-07-14 Renesas Electronics Corporation Method of manufacturing semiconductor device
USD709323S1 (en) * 2013-03-28 2014-07-22 Bbm Technology Ltd Preserving block
US20200260577A1 (en) * 2019-02-12 2020-08-13 Samsung Electronics Co., Ltd. Printed circuit board and semiconductor package including the same
US20210174779A1 (en) * 2019-12-05 2021-06-10 Industrial Technology Research Institute Soundproof member
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD937232S1 (en) * 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687553A (en) * 1985-05-30 1987-08-18 Eltech Systems Corporation Unitized electrode-intercell connector module
USD345963S (en) * 1991-10-30 1994-04-12 Sanyo Electric Co., Ltd. Hybrid integrated circuit
US5777387A (en) * 1995-09-29 1998-07-07 Nec Corporation Semiconductor device constructed by mounting a semiconductor chip on a film carrier tape
US6288445B1 (en) * 1998-08-04 2001-09-11 Nec Corporation Semiconductor device
USD455751S1 (en) * 2001-08-14 2002-04-16 Intec, Inc. Electronic memory card
US7323218B2 (en) * 2002-12-30 2008-01-29 Industrial Technology Research Institute Synthesis of composite nanofibers for applications in lithium batteries
US6788541B1 (en) * 2003-05-07 2004-09-07 Bear Hsiung LED matrix moldule
US20050098885A1 (en) * 2003-10-10 2005-05-12 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
USD522975S1 (en) * 2004-10-14 2006-06-13 Toshiba Lighting & Technology Corporation Light emitting diode module
USD539943S1 (en) * 2005-02-28 2007-04-03 Toshiba Lighting & Technology Corporation Light emitting diode lamp
US20070035009A1 (en) * 2005-08-12 2007-02-15 Sung-Wook Hwang Printed circuit board, semiconductor package and multi-stack semiconductor package using the same
US20080156369A1 (en) * 2006-12-29 2008-07-03 Industrial Technology Research Institute Active layers utilized in solar cells and fabrication method thereof
US20090014871A1 (en) * 2007-07-13 2009-01-15 Infineon Technologies Ag Semiconductor device
US20090135567A1 (en) * 2007-11-23 2009-05-28 Industrial Technology Research Institute Metal thermal interface material and thermal module and packaged microelectronic component containing the material
US20090321912A1 (en) * 2008-06-25 2009-12-31 Elpida Memory, Inc. Semiconductor device and method of manufacturing the same
US20100176509A1 (en) * 2009-01-15 2010-07-15 Sony Corporation Semiconductor device and method of fabricating the same
US20110117700A1 (en) * 2009-11-18 2011-05-19 Advanced Semiconductor Engineering, Inc. Stackable semiconductor device packages
US20110171777A1 (en) * 2010-01-08 2011-07-14 Renesas Electronics Corporation Method of manufacturing semiconductor device
USD709323S1 (en) * 2013-03-28 2014-07-22 Bbm Technology Ltd Preserving block
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
US20200260577A1 (en) * 2019-02-12 2020-08-13 Samsung Electronics Co., Ltd. Printed circuit board and semiconductor package including the same
USD937232S1 (en) * 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
US20210174779A1 (en) * 2019-12-05 2021-06-10 Industrial Technology Research Institute Soundproof member

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1022711S1 (en) * 2019-12-03 2024-04-16 Jelly Drops Ltd. Packaging for foodstuffs
USD1016017S1 (en) * 2021-05-13 2024-02-27 Mississippi State University Electrical enclosure with magnetic cable spooling management
USD1054389S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1054390S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device

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JP1686546S (enrdf_load_stackoverflow) 2021-05-31

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