USD962879S1 - Heat-dissipation unit - Google Patents

Heat-dissipation unit Download PDF

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Publication number
USD962879S1
USD962879S1 US29/741,641 US202029741641F USD962879S US D962879 S1 USD962879 S1 US D962879S1 US 202029741641 F US202029741641 F US 202029741641F US D962879 S USD962879 S US D962879S
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United States
Prior art keywords
heat
dissipation unit
view
design
boundary
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/741,641
Inventor
Shu-Hao KUO
Wen-Neng Liao
Cheng-Wen Hsieh
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Acer Inc
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Acer Inc
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Publication date
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Assigned to ACER INCORPORATED reassignment ACER INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSIEH, CHENG-WEN, KUO, SHU-HAO, LIAO, WEN-NENG
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FIG. 1 is a perspective view of a heat dissipation unit showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is an enlarged view of the portion, labeled ‘8’ in FIG. 1; and,
FIG. 9 is a perspective view thereof, shown in use with an environmental fan module thereon.
The ornamental design which is claimed is shown in the drawings as solid lines and surfaces having surface shading. The broken lines in FIG. 9 showing the additional fan module depict environmental structure only and form no part of the claim design. The broken lines consisting of a long dash and two short dashes depict reference to the enlargements shown in FIGS. 1 and 8 and form no part of the claim design. The broken line consisting of a long dash and one short dash defines the boundary of the claim design, which extends to the boundary but does not include the boundary. All other broken lines in the drawings form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heat-dissipation unit, as shown and described.
US29/741,641 2020-04-09 2020-07-14 Heat-dissipation unit Active USD962879S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW109301879F TWD210771S (en) 2020-04-09 2020-04-09 Heat-dissipation fin
TW109301879 2020-04-09

Publications (1)

Publication Number Publication Date
USD962879S1 true USD962879S1 (en) 2022-09-06

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ID=83112699

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US29/741,641 Active USD962879S1 (en) 2020-04-09 2020-07-14 Heat-dissipation unit

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US (1) USD962879S1 (en)
TW (1) TWD210771S (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1042372S1 (en) * 2022-09-26 2024-09-17 Poynting Antennas (Pty) Limited Heat sink
USD1051824S1 (en) * 2022-07-26 2024-11-19 Delta-Q Technologies Corp. Battery charger
USD1055850S1 (en) * 2021-11-29 2024-12-31 Delta-Q Technologies Corp. Battery charger
USD1075655S1 (en) 2020-05-05 2025-05-20 Delta-Q Technologies Corp. Battery charger
USD1105016S1 (en) * 2023-03-07 2025-12-09 Lumenwerx, Ulc. Radial heat sink
USD1113772S1 (en) * 2024-04-30 2026-02-17 Delta Electronics, Inc. Heat sink module
USD1118551S1 (en) * 2023-12-19 2026-03-17 Nakamura Magic Co., Ltd. Heat sink

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US3239003A (en) * 1962-11-30 1966-03-08 Wakefield Engineering Co Inc Heat transfer
US4715438A (en) * 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US20020018336A1 (en) * 2000-08-08 2002-02-14 Liang C. Y. Heat sink apparatus
US20020017378A1 (en) * 2000-08-09 2002-02-14 Hu Chin Yi Heat ventilation device
US20020046826A1 (en) * 2000-10-25 2002-04-25 Chao-Chih Kao CPU cooling structure
US6479895B1 (en) * 2001-05-18 2002-11-12 Intel Corporation High performance air cooled heat sinks used in high density packaging applications
US6535385B2 (en) * 2000-11-20 2003-03-18 Intel Corporation High performance heat sink configurations for use in high density packaging applications
USD473529S1 (en) * 2002-04-04 2003-04-22 Designs For Vision, Inc. Heat sink for a fiber optic light source
US6557626B1 (en) * 2000-01-11 2003-05-06 Molex Incorporated Heat sink retainer and Heat sink assembly using same
US6705144B2 (en) * 2001-09-10 2004-03-16 Intel Corporation Manufacturing process for a radial fin heat sink
US6851467B1 (en) * 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
US20060034058A1 (en) * 2004-08-13 2006-02-16 Hon Hai Precision Industry Co., Ltd. Heat dissipating device and method for manufacturing it
US7120020B2 (en) * 2001-09-10 2006-10-10 Intel Corporation Electronic assemblies with high capacity bent fin heat sinks
US20070217159A1 (en) * 2006-03-17 2007-09-20 Foxconn Technology Co., Ltd. Clip assembly for attaching a heat sink to an electronic device
USD552564S1 (en) * 2006-06-01 2007-10-09 Fujikura Ltd. Heat sink
US7284596B2 (en) * 2001-06-05 2007-10-23 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
USD568829S1 (en) * 2006-10-12 2008-05-13 Nidec Corporation Heat sink
USD576964S1 (en) * 2007-11-08 2008-09-16 Abl Ip Holding, Llc Heat sink
US20090009999A1 (en) * 2007-07-06 2009-01-08 Bily Wang LED lamp structure and system with high-efficiency heat-dissipating function
US20090073656A1 (en) * 2007-09-18 2009-03-19 Nidec Corporation Heat sink, heat sink fan, and method for manufacturing the same
US20090147517A1 (en) * 2007-12-07 2009-06-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led recessed lamp with screws fixing a recessed fixture thereof
US20090147520A1 (en) * 2007-12-07 2009-06-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink
US20090255658A1 (en) * 2008-04-10 2009-10-15 Asia Vital Components Co., Ltd. Heat dissipation module
US20090288806A1 (en) * 2008-05-21 2009-11-26 Asia Vital Components Co., Ltd. Heat Radiating Unit
USD608876S1 (en) * 2009-03-21 2010-01-26 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622675S1 (en) * 2009-07-21 2010-08-31 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD634279S1 (en) * 2009-12-08 2011-03-15 Agency For Science, Technology And Research Heat sink
USD642732S1 (en) * 2010-03-23 2011-08-02 Cooper Technologies Company Lighting fixture
US8322897B2 (en) * 2010-04-05 2012-12-04 Cooper Technologies Company Lighting assemblies having controlled directional heat transfer
USD762181S1 (en) * 2014-09-30 2016-07-26 Aeonovalite Technologies, Inc. High bay LED device
US10103081B2 (en) * 2014-09-08 2018-10-16 Ashwin Bharadwaj Heat sink
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
USD836571S1 (en) * 2017-02-15 2018-12-25 SAIJOINX Co., Ltd. Heat sink
USD838251S1 (en) * 2017-02-15 2019-01-15 SAIJOINX Co., Ltd. Heat sink

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3239003A (en) * 1962-11-30 1966-03-08 Wakefield Engineering Co Inc Heat transfer
US4715438A (en) * 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US6851467B1 (en) * 1999-08-30 2005-02-08 Molex Incorporated Heat sink assembly
US6557626B1 (en) * 2000-01-11 2003-05-06 Molex Incorporated Heat sink retainer and Heat sink assembly using same
US20020018336A1 (en) * 2000-08-08 2002-02-14 Liang C. Y. Heat sink apparatus
US20020017378A1 (en) * 2000-08-09 2002-02-14 Hu Chin Yi Heat ventilation device
US20020046826A1 (en) * 2000-10-25 2002-04-25 Chao-Chih Kao CPU cooling structure
US6535385B2 (en) * 2000-11-20 2003-03-18 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6479895B1 (en) * 2001-05-18 2002-11-12 Intel Corporation High performance air cooled heat sinks used in high density packaging applications
US7284596B2 (en) * 2001-06-05 2007-10-23 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
US6705144B2 (en) * 2001-09-10 2004-03-16 Intel Corporation Manufacturing process for a radial fin heat sink
US7120020B2 (en) * 2001-09-10 2006-10-10 Intel Corporation Electronic assemblies with high capacity bent fin heat sinks
USD473529S1 (en) * 2002-04-04 2003-04-22 Designs For Vision, Inc. Heat sink for a fiber optic light source
US20060034058A1 (en) * 2004-08-13 2006-02-16 Hon Hai Precision Industry Co., Ltd. Heat dissipating device and method for manufacturing it
US20070217159A1 (en) * 2006-03-17 2007-09-20 Foxconn Technology Co., Ltd. Clip assembly for attaching a heat sink to an electronic device
USD552564S1 (en) * 2006-06-01 2007-10-09 Fujikura Ltd. Heat sink
USD568829S1 (en) * 2006-10-12 2008-05-13 Nidec Corporation Heat sink
US20090009999A1 (en) * 2007-07-06 2009-01-08 Bily Wang LED lamp structure and system with high-efficiency heat-dissipating function
US20090073656A1 (en) * 2007-09-18 2009-03-19 Nidec Corporation Heat sink, heat sink fan, and method for manufacturing the same
USD576964S1 (en) * 2007-11-08 2008-09-16 Abl Ip Holding, Llc Heat sink
US20090147517A1 (en) * 2007-12-07 2009-06-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led recessed lamp with screws fixing a recessed fixture thereof
US20090147520A1 (en) * 2007-12-07 2009-06-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink
US20090255658A1 (en) * 2008-04-10 2009-10-15 Asia Vital Components Co., Ltd. Heat dissipation module
US20090288806A1 (en) * 2008-05-21 2009-11-26 Asia Vital Components Co., Ltd. Heat Radiating Unit
USD608876S1 (en) * 2009-03-21 2010-01-26 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622675S1 (en) * 2009-07-21 2010-08-31 Foxsemicon Integrated Technology, Inc. Heat dissipation device
USD634279S1 (en) * 2009-12-08 2011-03-15 Agency For Science, Technology And Research Heat sink
USD657490S1 (en) * 2010-03-23 2012-04-10 Cooper Technologies Company Lighting fixture
USD642732S1 (en) * 2010-03-23 2011-08-02 Cooper Technologies Company Lighting fixture
USD657492S1 (en) * 2010-03-23 2012-04-10 Cooper Technologies Company Lighting fixture
USD657908S1 (en) * 2010-03-23 2012-04-17 Cooper Technologies Company Lighting fixture
USD664291S1 (en) * 2010-03-23 2012-07-24 Cooper Technologies Company Lighting fixture
US10103089B2 (en) * 2010-03-26 2018-10-16 Hamilton Sundstrand Corporation Heat transfer device with fins defining air flow channels
US8322897B2 (en) * 2010-04-05 2012-12-04 Cooper Technologies Company Lighting assemblies having controlled directional heat transfer
US10103081B2 (en) * 2014-09-08 2018-10-16 Ashwin Bharadwaj Heat sink
USD762181S1 (en) * 2014-09-30 2016-07-26 Aeonovalite Technologies, Inc. High bay LED device
USD836571S1 (en) * 2017-02-15 2018-12-25 SAIJOINX Co., Ltd. Heat sink
USD838251S1 (en) * 2017-02-15 2019-01-15 SAIJOINX Co., Ltd. Heat sink

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1075655S1 (en) 2020-05-05 2025-05-20 Delta-Q Technologies Corp. Battery charger
USD1055850S1 (en) * 2021-11-29 2024-12-31 Delta-Q Technologies Corp. Battery charger
USD1051824S1 (en) * 2022-07-26 2024-11-19 Delta-Q Technologies Corp. Battery charger
USD1104958S1 (en) 2022-07-26 2025-12-09 Delta-Q Technologies Corp. Battery charger
USD1042372S1 (en) * 2022-09-26 2024-09-17 Poynting Antennas (Pty) Limited Heat sink
USD1105016S1 (en) * 2023-03-07 2025-12-09 Lumenwerx, Ulc. Radial heat sink
USD1118551S1 (en) * 2023-12-19 2026-03-17 Nakamura Magic Co., Ltd. Heat sink
USD1113772S1 (en) * 2024-04-30 2026-02-17 Delta Electronics, Inc. Heat sink module

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