USD962182S1 - Reticle pod connecting frame - Google Patents

Reticle pod connecting frame Download PDF

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Publication number
USD962182S1
USD962182S1 US29/696,000 US201929696000F USD962182S US D962182 S1 USD962182 S1 US D962182S1 US 201929696000 F US201929696000 F US 201929696000F US D962182 S USD962182 S US D962182S
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US
United States
Prior art keywords
connecting frame
reticle pod
pod connecting
reticle
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/696,000
Inventor
Ming-Chien Chiu
Yung-Chin PAN
Hsiao-Chia Lo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gudeng Precision Industrial Co Ltd
Original Assignee
Gudeng Precision Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gudeng Precision Industrial Co Ltd filed Critical Gudeng Precision Industrial Co Ltd
Assigned to GUDENG PRECISION INDUSTRIAL CO., LTD. reassignment GUDENG PRECISION INDUSTRIAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIU, MING-CHIEN, LO, HSIAO-CHIA, PAN, YUNG-CHIN
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Description

FIG. 1 is a front, bottom and right perspective view of a reticle pod connecting frame showing the claimed design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
The dashed broken lines in the figures show portions of the reticle pod connecting frame that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a reticle pod connecting frame, as shown and described.
US29/696,000 2019-03-27 2019-06-24 Reticle pod connecting frame Active USD962182S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW108301726 2019-03-27
TW108301726F TWD202895S (en) 2019-03-27 2019-03-27 Reticle pod connecting frame

Publications (1)

Publication Number Publication Date
USD962182S1 true USD962182S1 (en) 2022-08-30

Family

ID=82943790

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/696,000 Active USD962182S1 (en) 2019-03-27 2019-06-24 Reticle pod connecting frame

Country Status (2)

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US (1) USD962182S1 (en)
TW (1) TWD202895S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1059259S1 (en) * 2022-04-15 2025-01-28 Aptera Motors Corp. Strain-relieving solar cell interconnect
USD1059258S1 (en) * 2022-04-11 2025-01-28 Aptera Motors Corp. Strain-relieving solar cell interconnect
USD1060205S1 (en) * 2022-05-11 2025-02-04 Aptera Motors Corp. Strain-relieving solar cell termination interconnect
USD1060204S1 (en) * 2022-04-15 2025-02-04 Aptera Motors Corp. Strain-relieving solar cell interconnect
USD1101710S1 (en) * 2024-03-28 2025-11-11 Gudeng Precision Industrial Co., Ltd. Reticle box

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD211779S (en) 2020-09-22 2021-05-21 家登精密工業股份有限公司 Mask box connector

Citations (13)

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US6227870B1 (en) * 1999-05-07 2001-05-08 Kyoshin Kogyo Co., Ltd. Connecting terminal and a connecting terminal assembly
US8342384B2 (en) * 2002-03-13 2013-01-01 Curamik Electronics Gmbh Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
US9713251B2 (en) * 2011-12-02 2017-07-18 Murata Manufacturing Co., Ltd. High-frequency signal line, method for producing same, and electronic device
USD805044S1 (en) * 2015-10-30 2017-12-12 Hirata Corporation Adhesive sheet for substrate
US10056669B2 (en) * 2014-06-16 2018-08-21 Murata Manufacturing Co., Ltd. Transmission line
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD886073S1 (en) * 2018-01-29 2020-06-02 Gigalane Co., Ltd. Flexible printed circuit board
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
US10893615B2 (en) * 2016-12-12 2021-01-12 Cpt Zwei Gmbh Printed circuit board composite and method for producing same
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM409239U (en) 2011-02-09 2011-08-11 Chung King Entpr Co Ltd Shock absorption structure for optical mask box

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6227870B1 (en) * 1999-05-07 2001-05-08 Kyoshin Kogyo Co., Ltd. Connecting terminal and a connecting terminal assembly
US8342384B2 (en) * 2002-03-13 2013-01-01 Curamik Electronics Gmbh Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
US9713251B2 (en) * 2011-12-02 2017-07-18 Murata Manufacturing Co., Ltd. High-frequency signal line, method for producing same, and electronic device
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
US10056669B2 (en) * 2014-06-16 2018-08-21 Murata Manufacturing Co., Ltd. Transmission line
USD805044S1 (en) * 2015-10-30 2017-12-12 Hirata Corporation Adhesive sheet for substrate
US10893615B2 (en) * 2016-12-12 2021-01-12 Cpt Zwei Gmbh Printed circuit board composite and method for producing same
USD887998S1 (en) * 2017-02-17 2020-06-23 Stat Peel Ag Chip
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD886073S1 (en) * 2018-01-29 2020-06-02 Gigalane Co., Ltd. Flexible printed circuit board
USD903613S1 (en) * 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"Integrated USB 3.1 Connector Supports Mobile Platforms." Dec. 7, 2015. Thomas. https://news.thomasnet.com/fullstory/integrated-usb-3-1-connector-supports-mobile-platforms-20051860. *
Fexible Circuit Boards. (Design—© Questel) orbit.com. [Online PDF compilation of references] 108 pgs. Print Dates Range Sep. 27, 2019-Mar. 12, 2010 [Retrieved Jul. 13, 2021]. *
Provancher, William R. "Flex—Circuit Soldering & Assembly Tutorial and Notes." Aug. 27, 2004. University of Utah. https://my.mech.utah.edu/˜wil/tutorials/flexCirc_soldering_tutorial/Flex_circuit_Soldering_Tutorial.html. *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1059258S1 (en) * 2022-04-11 2025-01-28 Aptera Motors Corp. Strain-relieving solar cell interconnect
USD1059259S1 (en) * 2022-04-15 2025-01-28 Aptera Motors Corp. Strain-relieving solar cell interconnect
USD1060204S1 (en) * 2022-04-15 2025-02-04 Aptera Motors Corp. Strain-relieving solar cell interconnect
USD1060205S1 (en) * 2022-05-11 2025-02-04 Aptera Motors Corp. Strain-relieving solar cell termination interconnect
USD1101710S1 (en) * 2024-03-28 2025-11-11 Gudeng Precision Industrial Co., Ltd. Reticle box

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