USD950507S1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- USD950507S1 USD950507S1 US29/732,857 US202029732857F USD950507S US D950507 S1 USD950507 S1 US D950507S1 US 202029732857 F US202029732857 F US 202029732857F US D950507 S USD950507 S US D950507S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- view
- perspective
- ornamental design
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines in the drawings illustrate portions of the heat sink that form no part of the claimed design.
Claims (1)
- The ornamental design for a heat sink, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/732,857 USD950507S1 (en) | 2020-04-28 | 2020-04-28 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/732,857 USD950507S1 (en) | 2020-04-28 | 2020-04-28 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD950507S1 true USD950507S1 (en) | 2022-05-03 |
Family
ID=81329132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/732,857 Active USD950507S1 (en) | 2020-04-28 | 2020-04-28 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD950507S1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230171917A1 (en) * | 2021-11-30 | 2023-06-01 | Delta Electronics, Inc. | Heat dissipation assembly |
| USD1024985S1 (en) * | 2019-01-17 | 2024-04-30 | Telefonaktiebolaget Lm Ericsson (Publ) | Heat sink |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6921328B1 (en) * | 1998-05-26 | 2005-07-26 | Kabushiki Kaisha Yaskawa Denki | Cooling device for electric equipment |
| USD510325S1 (en) * | 2003-10-15 | 2005-10-04 | Asustek Computer Inc. | Thermal module |
| USD510324S1 (en) * | 2003-10-15 | 2005-10-04 | Asustek Computer Inc. | Thermal module |
| US20070091566A1 (en) * | 2005-10-24 | 2007-04-26 | Hon Hai Precision Industry Co., Ltd. | Fan duct and heat dissipation module comprising the same |
| US20070151706A1 (en) * | 2006-01-05 | 2007-07-05 | International Business Machines Corporation | Heat sink for dissipating a thermal load |
| US20070254584A1 (en) * | 2005-10-14 | 2007-11-01 | Cooler Master Co., Ltd. | Heat-dissipation structure |
| US7359192B2 (en) * | 2005-04-01 | 2008-04-15 | Foxconn Technology Co., Ltd. | Cooling device for heat-generating electronic component |
| US20080101018A1 (en) * | 2006-10-27 | 2008-05-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| USD604705S1 (en) * | 2008-09-15 | 2009-11-24 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US7729119B2 (en) * | 2007-11-28 | 2010-06-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| USD634278S1 (en) * | 2009-10-15 | 2011-03-15 | Sapa Ab | Heat sink |
| US8081458B2 (en) * | 2009-12-10 | 2011-12-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus for electronic device |
| US8300405B2 (en) * | 2010-05-28 | 2012-10-30 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow duct |
| US8305752B2 (en) * | 2010-07-27 | 2012-11-06 | Hon Hai Precision Industry Co., Ltd. | Air duct and electronic device incorporating the same |
| US8335082B2 (en) * | 2010-09-21 | 2012-12-18 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating apparatus |
| US20170083058A1 (en) * | 2015-09-23 | 2017-03-23 | Chris Janak | Modular thermal solution for high-performance processors |
| US10281220B1 (en) * | 2016-08-19 | 2019-05-07 | ZT Group Int'l, Inc. | Heat sink with vapor chamber |
| US11096312B1 (en) * | 2020-06-04 | 2021-08-17 | Aic Inc. | Heat dissipation apparatus with fan |
-
2020
- 2020-04-28 US US29/732,857 patent/USD950507S1/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6921328B1 (en) * | 1998-05-26 | 2005-07-26 | Kabushiki Kaisha Yaskawa Denki | Cooling device for electric equipment |
| USD510325S1 (en) * | 2003-10-15 | 2005-10-04 | Asustek Computer Inc. | Thermal module |
| USD510324S1 (en) * | 2003-10-15 | 2005-10-04 | Asustek Computer Inc. | Thermal module |
| US7359192B2 (en) * | 2005-04-01 | 2008-04-15 | Foxconn Technology Co., Ltd. | Cooling device for heat-generating electronic component |
| US20070254584A1 (en) * | 2005-10-14 | 2007-11-01 | Cooler Master Co., Ltd. | Heat-dissipation structure |
| US20070091566A1 (en) * | 2005-10-24 | 2007-04-26 | Hon Hai Precision Industry Co., Ltd. | Fan duct and heat dissipation module comprising the same |
| US20070151706A1 (en) * | 2006-01-05 | 2007-07-05 | International Business Machines Corporation | Heat sink for dissipating a thermal load |
| US20080101018A1 (en) * | 2006-10-27 | 2008-05-01 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US7729119B2 (en) * | 2007-11-28 | 2010-06-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| USD604705S1 (en) * | 2008-09-15 | 2009-11-24 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| USD634278S1 (en) * | 2009-10-15 | 2011-03-15 | Sapa Ab | Heat sink |
| US8081458B2 (en) * | 2009-12-10 | 2011-12-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus for electronic device |
| US8300405B2 (en) * | 2010-05-28 | 2012-10-30 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow duct |
| US8305752B2 (en) * | 2010-07-27 | 2012-11-06 | Hon Hai Precision Industry Co., Ltd. | Air duct and electronic device incorporating the same |
| US8335082B2 (en) * | 2010-09-21 | 2012-12-18 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating apparatus |
| US20170083058A1 (en) * | 2015-09-23 | 2017-03-23 | Chris Janak | Modular thermal solution for high-performance processors |
| US10281220B1 (en) * | 2016-08-19 | 2019-05-07 | ZT Group Int'l, Inc. | Heat sink with vapor chamber |
| US11096312B1 (en) * | 2020-06-04 | 2021-08-17 | Aic Inc. | Heat dissipation apparatus with fan |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1024985S1 (en) * | 2019-01-17 | 2024-04-30 | Telefonaktiebolaget Lm Ericsson (Publ) | Heat sink |
| US20230171917A1 (en) * | 2021-11-30 | 2023-06-01 | Delta Electronics, Inc. | Heat dissipation assembly |
| US12267984B2 (en) * | 2021-11-30 | 2025-04-01 | Delta Electronics, Inc. | Heat dissipation assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |