USD918160S1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- USD918160S1 USD918160S1 US29/720,619 US202029720619F USD918160S US D918160 S1 USD918160 S1 US D918160S1 US 202029720619 F US202029720619 F US 202029720619F US D918160 S USD918160 S US D918160S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- view
- side perspective
- ornamental design
- elevation view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for a heat sink, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/720,619 USD918160S1 (en) | 2020-01-14 | 2020-01-14 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/720,619 USD918160S1 (en) | 2020-01-14 | 2020-01-14 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
USD918160S1 true USD918160S1 (en) | 2021-05-04 |
Family
ID=75644120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/720,619 Active USD918160S1 (en) | 2020-01-14 | 2020-01-14 | Heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | USD918160S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD953339S1 (en) * | 2019-05-06 | 2022-05-31 | Dell Products L.P. | Information handling system bezel |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5771153A (en) * | 1997-05-16 | 1998-06-23 | Sheng; Lin Chun | CPU heat dissipating apparatus |
USD398589S (en) * | 1997-05-27 | 1998-09-22 | Dodson Douglas A | Cooling device |
US5864464A (en) * | 1997-06-09 | 1999-01-26 | Lin; Alex | Heat sink for integrated circuit |
US5932925A (en) * | 1996-09-09 | 1999-08-03 | Intricast, Inc. | Adjustable-pressure mount heatsink system |
US5946190A (en) * | 1997-08-29 | 1999-08-31 | Hewlett-Packard Company | Ducted high aspect ratio heatsink assembly |
US6195893B1 (en) * | 1997-04-11 | 2001-03-06 | Tetsuji Kataoka | Method of manufacture of heat exchange unit |
USD450044S1 (en) * | 2000-06-14 | 2001-11-06 | Christer E. Lindstrom | Cooler for heat dissipation |
USD481017S1 (en) * | 2002-09-13 | 2003-10-21 | Delta Electronics Inc. | Heat sink |
US20110290449A1 (en) * | 2010-05-31 | 2011-12-01 | Tsung-Hsien Huang | Cooler device |
USD672322S1 (en) * | 2011-12-28 | 2012-12-11 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD672730S1 (en) * | 2012-03-13 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD672728S1 (en) * | 2011-12-28 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
US20130105112A1 (en) * | 2011-10-31 | 2013-05-02 | Cooler Master Co., Ltd. | Heat sink |
US20130146252A1 (en) * | 2011-12-09 | 2013-06-13 | Hon Hai Precision Industry Co., Ltd. | Heat sink assembly with mistake-proof structure |
US20130163207A1 (en) * | 2011-12-26 | 2013-06-27 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US20130250523A1 (en) * | 2012-03-23 | 2013-09-26 | Wistron Corp. | Heat dissipating assembly and elastic fastening member thereof |
USD698740S1 (en) * | 2012-05-23 | 2014-02-04 | Alpoint Technologies, LLC | Heat sink |
US20140248081A1 (en) * | 2013-03-01 | 2014-09-04 | Radian Thermal Products, Inc. | Interlocking clip heatsink mounting system |
US20170265331A1 (en) * | 2016-03-11 | 2017-09-14 | Enzo Technology Corp. | Heat Dissipating Heat Sink Retainer |
-
2020
- 2020-01-14 US US29/720,619 patent/USD918160S1/en active Active
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5932925A (en) * | 1996-09-09 | 1999-08-03 | Intricast, Inc. | Adjustable-pressure mount heatsink system |
US6195893B1 (en) * | 1997-04-11 | 2001-03-06 | Tetsuji Kataoka | Method of manufacture of heat exchange unit |
US5771153A (en) * | 1997-05-16 | 1998-06-23 | Sheng; Lin Chun | CPU heat dissipating apparatus |
USD398589S (en) * | 1997-05-27 | 1998-09-22 | Dodson Douglas A | Cooling device |
US5864464A (en) * | 1997-06-09 | 1999-01-26 | Lin; Alex | Heat sink for integrated circuit |
US5946190A (en) * | 1997-08-29 | 1999-08-31 | Hewlett-Packard Company | Ducted high aspect ratio heatsink assembly |
USD450044S1 (en) * | 2000-06-14 | 2001-11-06 | Christer E. Lindstrom | Cooler for heat dissipation |
USD481017S1 (en) * | 2002-09-13 | 2003-10-21 | Delta Electronics Inc. | Heat sink |
US20110290449A1 (en) * | 2010-05-31 | 2011-12-01 | Tsung-Hsien Huang | Cooler device |
US20130105112A1 (en) * | 2011-10-31 | 2013-05-02 | Cooler Master Co., Ltd. | Heat sink |
US20130146252A1 (en) * | 2011-12-09 | 2013-06-13 | Hon Hai Precision Industry Co., Ltd. | Heat sink assembly with mistake-proof structure |
US20130163207A1 (en) * | 2011-12-26 | 2013-06-27 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
USD672322S1 (en) * | 2011-12-28 | 2012-12-11 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD672728S1 (en) * | 2011-12-28 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
USD672730S1 (en) * | 2012-03-13 | 2012-12-18 | Foxsemicon Integrated Technology, Inc. | Heat sink |
US20130250523A1 (en) * | 2012-03-23 | 2013-09-26 | Wistron Corp. | Heat dissipating assembly and elastic fastening member thereof |
USD698740S1 (en) * | 2012-05-23 | 2014-02-04 | Alpoint Technologies, LLC | Heat sink |
US20140248081A1 (en) * | 2013-03-01 | 2014-09-04 | Radian Thermal Products, Inc. | Interlocking clip heatsink mounting system |
US20170265331A1 (en) * | 2016-03-11 | 2017-09-14 | Enzo Technology Corp. | Heat Dissipating Heat Sink Retainer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD953339S1 (en) * | 2019-05-06 | 2022-05-31 | Dell Products L.P. | Information handling system bezel |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |