USD909979S1 - Vapor chamber - Google Patents

Vapor chamber Download PDF

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Publication number
USD909979S1
USD909979S1 US29/627,535 US201729627535F USD909979S US D909979 S1 USD909979 S1 US D909979S1 US 201729627535 F US201729627535 F US 201729627535F US D909979 S USD909979 S US D909979S
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United States
Prior art keywords
vapor chamber
view
elevational view
vapor
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/627,535
Inventor
Chuan-Chi TSENG
Ming-Quan CUI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tai Sol Electronics Co Ltd
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Priority to US29/627,535 priority Critical patent/USD909979S1/en
Assigned to TAI-SOL ELECTRONICS CO., LTD. reassignment TAI-SOL ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CUI, Ming-quan, TSENG, CHUAN-CHI
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Publication of USD909979S1 publication Critical patent/USD909979S1/en
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Description

FIG. 1 is a perspective view of a first embodiment of a vapor chamber showing the new design;
FIG. 2 is a front elevational view thereof, the rear elevational view being omitted;
FIG. 3 is a right side elevational view thereof, the left side elevational view being omitted;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a perspective view of a second embodiment of a vapor chamber showing the new design.
The broken lines shown in FIGS. 1-6 depict portions of the vapor chamber that form no part of the claimed design. The dash-dot-dash line drawn in the FIGS. 1-6 depict boundary of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a vapor chamber, as shown and described.
US29/627,535 2017-11-28 2017-11-28 Vapor chamber Active USD909979S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/627,535 USD909979S1 (en) 2017-11-28 2017-11-28 Vapor chamber

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Application Number Priority Date Filing Date Title
US29/627,535 USD909979S1 (en) 2017-11-28 2017-11-28 Vapor chamber

Publications (1)

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USD909979S1 true USD909979S1 (en) 2021-02-09

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US29/627,535 Active USD909979S1 (en) 2017-11-28 2017-11-28 Vapor chamber

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130048252A1 (en) * 2011-08-29 2013-02-28 Asia Vital Components Co., Ltd. Vapor chamber structure and method of manufacturing same
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module
US20150119111A1 (en) * 2013-10-30 2015-04-30 Toshiba Home Technology Corporation Mobile terminal
US20160091259A1 (en) * 2014-09-26 2016-03-31 Asia Vital Components Co., Ltd. Vapor chamber structure
US9854705B2 (en) * 2013-12-24 2017-12-26 Toshiba Home Technology Corporation Sheet-type heat pipe
US20190113290A1 (en) * 2017-10-12 2019-04-18 Tai-Sol Electronics Co., Ltd. Vapor chamber with inner ridge forming passage
US10368430B2 (en) * 2017-06-06 2019-07-30 Cooler Master Co., Ltd. Heat dissipation device
US10371458B2 (en) * 2016-04-07 2019-08-06 Cooler Master Co., Ltd. Thermal conducting structure
US10591222B2 (en) * 2018-02-13 2020-03-17 Asia Vital Components Co., Ltd. Vapor chamber water-filling section sealing structure
US10605540B2 (en) * 2018-06-28 2020-03-31 Tai-Sol Electronics Co., Ltd. Vapor chamber that utilizes a capillary structure and bumps to form a liquid-vapor channel
US10612862B2 (en) * 2017-10-31 2020-04-07 Heatscape.Com, Inc. Method of forming a combined vapor chamber and heat pipe assembly

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130048252A1 (en) * 2011-08-29 2013-02-28 Asia Vital Components Co., Ltd. Vapor chamber structure and method of manufacturing same
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module
US20150119111A1 (en) * 2013-10-30 2015-04-30 Toshiba Home Technology Corporation Mobile terminal
US9854705B2 (en) * 2013-12-24 2017-12-26 Toshiba Home Technology Corporation Sheet-type heat pipe
US20160091259A1 (en) * 2014-09-26 2016-03-31 Asia Vital Components Co., Ltd. Vapor chamber structure
US10371458B2 (en) * 2016-04-07 2019-08-06 Cooler Master Co., Ltd. Thermal conducting structure
US10368430B2 (en) * 2017-06-06 2019-07-30 Cooler Master Co., Ltd. Heat dissipation device
US20190113290A1 (en) * 2017-10-12 2019-04-18 Tai-Sol Electronics Co., Ltd. Vapor chamber with inner ridge forming passage
US10612862B2 (en) * 2017-10-31 2020-04-07 Heatscape.Com, Inc. Method of forming a combined vapor chamber and heat pipe assembly
US10591222B2 (en) * 2018-02-13 2020-03-17 Asia Vital Components Co., Ltd. Vapor chamber water-filling section sealing structure
US10605540B2 (en) * 2018-06-28 2020-03-31 Tai-Sol Electronics Co., Ltd. Vapor chamber that utilizes a capillary structure and bumps to form a liquid-vapor channel

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
A L M T Corp, "Heatspreader Materials", accessed Oct. 13, 2020. (https://www.allied-material.co.jp/en/products/heatspreader/Material.html) (Year: 2020). *
Cooler Master , "Vapor Chambers and Slim VC", Accessed Oct. 13, 2020. (https://www.coolermastercorp.com/technology/design/vapor-chambers-and-slim-vc/) (Year: 2020). *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus
USD952585S1 (en) * 2020-03-16 2022-05-24 Dynatron Corporation Vapor chamber

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