USD906267S1 - Surface-mountable heat sink - Google Patents

Surface-mountable heat sink Download PDF

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Publication number
USD906267S1
USD906267S1 US29/654,640 US201829654640F USD906267S US D906267 S1 USD906267 S1 US D906267S1 US 201829654640 F US201829654640 F US 201829654640F US D906267 S USD906267 S US D906267S
Authority
US
United States
Prior art keywords
heat sink
mountable heat
mountable
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/654,640
Inventor
Chad Ice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Sylvania Inc
Original Assignee
Osram Sylvania Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Sylvania Inc filed Critical Osram Sylvania Inc
Priority to US29/654,640 priority Critical patent/USD906267S1/en
Assigned to OSRAM SYLVANIA INC. reassignment OSRAM SYLVANIA INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ICE, Chad
Assigned to NOVITÀ TECHNOLOGIES INC., reassignment NOVITÀ TECHNOLOGIES INC., CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY NAME PREVIOUSLY RECORDED AT REEL: 046210 FRAME: 0919. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Assignors: ICE, Chad
Assigned to OSRAM SYLVANIA INC. reassignment OSRAM SYLVANIA INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NOVITÀ TECHNOLOGIES INC.
Priority to CA184469F priority patent/CA184469S/en
Application granted granted Critical
Publication of USD906267S1 publication Critical patent/USD906267S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top view of the design for a surface-mountable heat sink;
FIG. 2 is a front elevational view thereof, the opposite rear view being the same;
FIG. 3 is a side elevational view thereof, the opposite side view being the same;
FIG. 4 is a bottom view thereof; and,
FIG. 5 is a front, top perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a surface-mountable heat sink, as shown and described.
US29/654,640 2018-06-26 2018-06-26 Surface-mountable heat sink Active USD906267S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/654,640 USD906267S1 (en) 2018-06-26 2018-06-26 Surface-mountable heat sink
CA184469F CA184469S (en) 2018-06-26 2018-11-02 Surface-mountable heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/654,640 USD906267S1 (en) 2018-06-26 2018-06-26 Surface-mountable heat sink

Publications (1)

Publication Number Publication Date
USD906267S1 true USD906267S1 (en) 2020-12-29

Family

ID=69102727

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/654,640 Active USD906267S1 (en) 2018-06-26 2018-06-26 Surface-mountable heat sink

Country Status (2)

Country Link
US (1) USD906267S1 (en)
CA (1) CA184469S (en)

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD269084S (en) * 1981-04-08 1983-05-24 Aavid Engineering, Inc. Dual heat sink for electronic semiconductor devices
USD295281S (en) * 1985-04-01 1988-04-19 Thermalloy Incorporated Heat sink or similar article
USD390539S (en) * 1996-07-29 1998-02-10 Wakefield Engineering, Inc. Heat sink
USD394043S (en) * 1996-02-23 1998-05-05 Wakefield Engineering, Inc. Clamping heat sink
USD407381S (en) * 1997-10-27 1999-03-30 Wakefield Engineering, Inc. Heat sink
USD409157S (en) * 1998-03-09 1999-05-04 Schneider Automation Inc. Clip-on heat sink
USD422970S (en) * 1998-11-30 2000-04-18 I.E.R.C. (International Electronic Research Corp. Heat sink
USD531965S1 (en) * 2004-10-28 2006-11-14 Mushkin, Inc. Memory card heat sink
US20070133176A1 (en) * 2005-12-08 2007-06-14 Ruei-An Lo Heat dissipating element for a memory
US20070247820A1 (en) * 2006-04-24 2007-10-25 Foxconn Technology Co., Ltd. Memory module assembly including heat dissipating members
US20070263361A1 (en) * 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Memory module assembly
USD618992S1 (en) * 2008-12-18 2010-07-06 Ipvision, Inc. Pole bracket camera mount
US20120103564A1 (en) * 2010-10-29 2012-05-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20120162919A1 (en) * 2010-12-24 2012-06-28 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
USD724257S1 (en) * 2014-01-16 2015-03-10 Sylwester Klus Housing for a LED based lighting apparatus
USD787925S1 (en) * 2015-08-13 2017-05-30 David J. Moerer Clip to suspend eyewear and other articles
USD793215S1 (en) * 2015-08-25 2017-08-01 Hellermanntyton Corporation Blind hole mount
US20170332522A1 (en) * 2015-01-22 2017-11-16 Mitsubishi Electric Corporation Semiconductor device

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD269084S (en) * 1981-04-08 1983-05-24 Aavid Engineering, Inc. Dual heat sink for electronic semiconductor devices
USD295281S (en) * 1985-04-01 1988-04-19 Thermalloy Incorporated Heat sink or similar article
USD394043S (en) * 1996-02-23 1998-05-05 Wakefield Engineering, Inc. Clamping heat sink
USD390539S (en) * 1996-07-29 1998-02-10 Wakefield Engineering, Inc. Heat sink
USD407381S (en) * 1997-10-27 1999-03-30 Wakefield Engineering, Inc. Heat sink
USD409157S (en) * 1998-03-09 1999-05-04 Schneider Automation Inc. Clip-on heat sink
USD422970S (en) * 1998-11-30 2000-04-18 I.E.R.C. (International Electronic Research Corp. Heat sink
USD531965S1 (en) * 2004-10-28 2006-11-14 Mushkin, Inc. Memory card heat sink
US20070133176A1 (en) * 2005-12-08 2007-06-14 Ruei-An Lo Heat dissipating element for a memory
US20070247820A1 (en) * 2006-04-24 2007-10-25 Foxconn Technology Co., Ltd. Memory module assembly including heat dissipating members
US20070263361A1 (en) * 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Memory module assembly
USD618992S1 (en) * 2008-12-18 2010-07-06 Ipvision, Inc. Pole bracket camera mount
US20120103564A1 (en) * 2010-10-29 2012-05-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20120162919A1 (en) * 2010-12-24 2012-06-28 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
USD724257S1 (en) * 2014-01-16 2015-03-10 Sylwester Klus Housing for a LED based lighting apparatus
US20170332522A1 (en) * 2015-01-22 2017-11-16 Mitsubishi Electric Corporation Semiconductor device
USD787925S1 (en) * 2015-08-13 2017-05-30 David J. Moerer Clip to suspend eyewear and other articles
USD793215S1 (en) * 2015-08-25 2017-08-01 Hellermanntyton Corporation Blind hole mount

Also Published As

Publication number Publication date
CA184469S (en) 2020-01-06

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