USD896229S1 - SSD storage device - Google Patents

SSD storage device Download PDF

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Publication number
USD896229S1
USD896229S1 US29/692,883 US201929692883F USD896229S US D896229 S1 USD896229 S1 US D896229S1 US 201929692883 F US201929692883 F US 201929692883F US D896229 S USD896229 S US D896229S
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US
United States
Prior art keywords
storage device
ssd storage
ssd
view
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/692,883
Inventor
Gye-jin Jun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JUN, GYE-JIN
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FIG. 1 is a perspective view of an SSD storage device showing our new design.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a rear elevation view thereof.
FIG. 4 is a left side elevation view thereof.
FIG. 5 is a right side elevation view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines are for environmental purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an SSD storage device, as shown and described.
US29/692,883 2018-11-30 2019-05-29 SSD storage device Active USD896229S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20180056410 2018-11-30
KR30-2018-0056410 2018-11-30

Publications (1)

Publication Number Publication Date
USD896229S1 true USD896229S1 (en) 2020-09-15

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US29/692,883 Active USD896229S1 (en) 2018-11-30 2019-05-29 SSD storage device

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US (1) USD896229S1 (en)
TW (1) TWD202064S (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD943586S1 (en) * 2019-05-22 2022-02-15 Samsung Electronics Co., Ltd. SSD (solid state drive)
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
USD988318S1 (en) * 2020-09-10 2023-06-06 Samsung Electronics Co., Ltd. Solid state drive memory device
USD996424S1 (en) * 2020-06-09 2023-08-22 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1024985S1 (en) 2019-01-17 2024-04-30 Telefonaktiebolaget Lm Ericsson (Publ) Heat sink
USD1048027S1 (en) * 2020-07-09 2024-10-22 Samsung Electronics Co., Ltd. SSD (solid state drive) memory device
USD1072829S1 (en) * 2022-01-10 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1072828S1 (en) * 2021-08-27 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1072812S1 (en) * 2021-08-27 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1075779S1 (en) * 2021-08-27 2025-05-20 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1076923S1 (en) * 2024-07-09 2025-05-27 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1076922S1 (en) * 2024-07-09 2025-05-27 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1095505S1 (en) * 2023-09-11 2025-09-30 Moxa Inc. Communication device
USD1095503S1 (en) * 2023-09-11 2025-09-30 Moxa Inc. Portion of communication device

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US20060056154A1 (en) * 2004-09-15 2006-03-16 International Business Machines Corporation Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board
US20060268523A1 (en) * 2005-05-31 2006-11-30 Akust Technology Co., Ltd. Heat sink for memory
US20080101036A1 (en) * 2006-10-26 2008-05-01 Chiung Yi Chen Heat-dissipating assembly structure
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD698792S1 (en) * 2012-01-05 2014-02-04 Kingston Digital, Inc. Memory module
USD702690S1 (en) * 2012-10-17 2014-04-15 Kingston Digital, Inc. Memory module
USD702689S1 (en) * 2012-08-17 2014-04-15 Kingston Digital, Inc. Memory module
USD714789S1 (en) * 2013-02-04 2014-10-07 Comptake Technology Inc. Housing of solid state drive
US20140367077A1 (en) * 2013-06-17 2014-12-18 Che Yuan Wu Complex heat dissipation assembly
USD735201S1 (en) * 2014-07-30 2015-07-28 Kingston Digital, Inc. Memory module
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060056154A1 (en) * 2004-09-15 2006-03-16 International Business Machines Corporation Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board
US20060268523A1 (en) * 2005-05-31 2006-11-30 Akust Technology Co., Ltd. Heat sink for memory
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
US20080101036A1 (en) * 2006-10-26 2008-05-01 Chiung Yi Chen Heat-dissipating assembly structure
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD698792S1 (en) * 2012-01-05 2014-02-04 Kingston Digital, Inc. Memory module
USD702689S1 (en) * 2012-08-17 2014-04-15 Kingston Digital, Inc. Memory module
USD702690S1 (en) * 2012-10-17 2014-04-15 Kingston Digital, Inc. Memory module
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD714789S1 (en) * 2013-02-04 2014-10-07 Comptake Technology Inc. Housing of solid state drive
US20140367077A1 (en) * 2013-06-17 2014-12-18 Che Yuan Wu Complex heat dissipation assembly
USD735201S1 (en) * 2014-07-30 2015-07-28 Kingston Digital, Inc. Memory module
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Communication dated Sep. 9, 2019, issued by the Taiwan Patent Office in counterpart Taiwan Application No. 108303223.

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
USD1024985S1 (en) 2019-01-17 2024-04-30 Telefonaktiebolaget Lm Ericsson (Publ) Heat sink
USD943586S1 (en) * 2019-05-22 2022-02-15 Samsung Electronics Co., Ltd. SSD (solid state drive)
US12219721B2 (en) 2020-06-09 2025-02-04 Samsung Electronics Co., Ltd. Memory device and electronic device including the same
USD996424S1 (en) * 2020-06-09 2023-08-22 Samsung Electronics Co., Ltd. Solid state drive memory device
USD997939S1 (en) * 2020-06-09 2023-09-05 Samsung Electronics Co., Ltd. Solid state drive memory device
USD998612S1 (en) * 2020-06-09 2023-09-12 Samsung Electronics Co., Ltd. Solid state drive memory device
US11979996B2 (en) 2020-06-09 2024-05-07 Samsung Electronics Co., Ltd. Memory device and electronic device including the same
USD1048027S1 (en) * 2020-07-09 2024-10-22 Samsung Electronics Co., Ltd. SSD (solid state drive) memory device
USD997161S1 (en) * 2020-09-10 2023-08-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD988318S1 (en) * 2020-09-10 2023-06-06 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1072828S1 (en) * 2021-08-27 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1072812S1 (en) * 2021-08-27 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1075779S1 (en) * 2021-08-27 2025-05-20 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1072829S1 (en) * 2022-01-10 2025-04-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1095505S1 (en) * 2023-09-11 2025-09-30 Moxa Inc. Communication device
USD1095503S1 (en) * 2023-09-11 2025-09-30 Moxa Inc. Portion of communication device
USD1076923S1 (en) * 2024-07-09 2025-05-27 Samsung Electronics Co., Ltd. Solid state drive memory device
USD1076922S1 (en) * 2024-07-09 2025-05-27 Samsung Electronics Co., Ltd. Solid state drive memory device

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