USD848432S1 - SSD storage device - Google Patents

SSD storage device Download PDF

Info

Publication number
USD848432S1
USD848432S1 US29/614,243 US201729614243F USD848432S US D848432 S1 USD848432 S1 US D848432S1 US 201729614243 F US201729614243 F US 201729614243F US D848432 S USD848432 S US D848432S
Authority
US
United States
Prior art keywords
storage device
ssd storage
ssd
view
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/614,243
Inventor
G. M Lim
Eun-Jin Yun
Hyuk-Jun Yoo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YUN, EUN-JIN, LIM, G. M, YOO, HYUK-JUN
Application granted granted Critical
Publication of USD848432S1 publication Critical patent/USD848432S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of SSD storage device showing our new design.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a rear elevation view thereof.
FIG. 4 is a left side elevation view thereof.
FIG. 5 is a right side elevation view thereof.
FIG. 6 is a top plan view thereof.
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is an enlarged view thereof, showing the edge connector.
The broken lines are for environmental purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an SSD storage device, as shown and described.
US29/614,243 2017-02-17 2017-08-17 SSD storage device Active USD848432S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20170007652 2017-02-17
KR30-2017-0007652 2017-02-17

Publications (1)

Publication Number Publication Date
USD848432S1 true USD848432S1 (en) 2019-05-14

Family

ID=63111784

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/614,243 Active USD848432S1 (en) 2017-02-17 2017-08-17 SSD storage device

Country Status (3)

Country Link
US (1) USD848432S1 (en)
JP (1) JP1611022S (en)
TW (1) TWD190983S (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD930601S1 (en) * 2019-04-26 2021-09-14 The Noco Company Circuit board
USD938374S1 (en) * 2019-09-09 2021-12-14 The Noco Company Circuit board
USD944219S1 (en) * 2019-09-09 2022-02-22 The Noco Company Circuit board
USD949117S1 (en) * 2019-09-09 2022-04-19 The Noco Company Circuit board
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board
USD958762S1 (en) * 2019-09-09 2022-07-26 The Noco Company Circuit board
USD1009777S1 (en) 2019-09-09 2024-01-02 The Noco Company Battery
USD1009815S1 (en) * 2021-01-22 2024-01-02 The Noco Company Circuit board
USD1010591S1 (en) * 2021-01-22 2024-01-09 The Noco Company Circuit board
USD1012872S1 (en) * 2021-01-22 2024-01-30 The Noco Company Circuit board

Citations (118)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4936785A (en) * 1988-12-19 1990-06-26 Krug Eric M Interchangeable adapter module for electronic devices
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US5303121A (en) * 1992-12-28 1994-04-12 Ncr Corporation Multi-chip module board
US5347428A (en) * 1992-12-03 1994-09-13 Irvine Sensors Corporation Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
USD370464S (en) * 1994-11-30 1996-06-04 Metropage, Inc. Heat seal connector for a pager
US6008994A (en) * 1998-08-04 1999-12-28 Itt Manufacturing Enterprises, Inc. PC card grounding clip
US6021048A (en) * 1998-02-17 2000-02-01 Smith; Gary W. High speed memory module
US6025992A (en) * 1999-02-11 2000-02-15 International Business Machines Corp. Integrated heat exchanger for memory module
US6036098A (en) * 1992-05-15 2000-03-14 Symbol Technologies, Inc. Miniature scan element operably connected to a personal computer interface card
US6088829A (en) * 1995-10-26 2000-07-11 Hitachi, Ltd. Synchronous data transfer system
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
US6381140B1 (en) * 1999-08-30 2002-04-30 Witek Enterprise Co., Ltd. Memory module
US20020056018A1 (en) * 2000-09-08 2002-05-09 Schumacher Matthew J. Method and apparatus implementing a tuned stub SCSI topology
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US20030097506A1 (en) * 2001-11-20 2003-05-22 Aaeon Technology Inc. Structure of the bus card of the mini image port
US6590282B1 (en) * 2002-04-12 2003-07-08 Industrial Technology Research Institute Stacked semiconductor package formed on a substrate and method for fabrication
US6614664B2 (en) * 2000-10-24 2003-09-02 Samsung Electronics Co., Ltd. Memory module having series-connected printed circuit boards
US6628538B2 (en) * 2000-03-10 2003-09-30 Hitachi, Ltd. Memory module including module data wirings available as a memory access data bus
US6757751B1 (en) * 2000-08-11 2004-06-29 Harrison Gene High-speed, multiple-bank, stacked, and PCB-mounted memory module
US6762942B1 (en) * 2002-09-05 2004-07-13 Gary W. Smith Break away, high speed, folded, jumperless electronic assembly
US6765278B2 (en) * 2000-08-24 2004-07-20 Heetronix Circuit structure with W, WC and/or W2C layer on AlN substrate
US20040196682A1 (en) * 2002-09-26 2004-10-07 Elpida Memory, Inc. Semiconductor unit having two device terminals for every one input/output signal
US6812555B2 (en) * 2003-03-10 2004-11-02 Everstone Industry Corp. Memory card substrate with alternating contacts
US20050078454A1 (en) * 2001-12-04 2005-04-14 Jun Hyodo Power supply
US20050082663A1 (en) * 2003-10-20 2005-04-21 Renesas Technology Corp. Semiconductor device and semiconductor module
US20050088828A1 (en) * 2003-10-27 2005-04-28 Benq Corporation Electronic apparatus with module-locking device
US20050161782A1 (en) * 2003-12-24 2005-07-28 Sanyo Electric Co., Ltd. Hybrid integrated circuit device and manufacturing method of the same
US20050161781A1 (en) * 2003-12-24 2005-07-28 Sanyo Electric Co., Ltd. Hybrid integrated circuit device and manufacturing method thereof
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US20060050488A1 (en) * 2004-09-03 2006-03-09 Staktel Group, L.P. High capacity thin module system and method
US20060050592A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Compact module system and method
US20060049502A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Module thermal management system and method
US20060050489A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Optimized mounting area circuit module system and method
US20060050498A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Die module system and method
US20060049500A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US20060067054A1 (en) * 2004-09-29 2006-03-30 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US20060129888A1 (en) * 2004-09-03 2006-06-15 Staktek Group L.P. Circuit module turbulence enhacement systems and methods
US20060171247A1 (en) * 2005-02-03 2006-08-03 Wolfgang Hoppe Semiconductor memory module with bus architecture
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US20070011574A1 (en) * 2005-06-14 2007-01-11 Christian Weiss Memory device
US20070033490A1 (en) * 2005-07-19 2007-02-08 Karl-Heinz Moosrainer Semiconductor memory module with error correction
US20070139897A1 (en) * 2005-12-19 2007-06-21 Siva Raghuram Circuit board arrangement including heat dissipater
US20070176286A1 (en) * 2006-02-02 2007-08-02 Staktek Group L.P. Composite core circuit module system and method
US7269025B2 (en) * 2004-12-30 2007-09-11 Intel Corporation Ballout for buffer
US20070212902A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212920A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212906A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212919A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070223198A1 (en) * 2006-03-25 2007-09-27 Foxconn Technology Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US7299313B2 (en) * 2004-10-29 2007-11-20 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
US20070281500A1 (en) * 2006-05-31 2007-12-06 Hon Hai Precision Ind. Co., Ltd. Card edge connector
US20070294889A1 (en) * 2001-12-06 2007-12-27 Reinhold Schmitt Electronic circuit module and method for its assembly
US20080038961A1 (en) * 2006-08-11 2008-02-14 Samsung Electronics Co., Ltd. Memory module, memory module socket and mainboard using same
US20080094811A1 (en) * 2006-10-23 2008-04-24 International Business Machines Corporation High density high reliability memory module with a fault tolerant address and command bus
US20080116571A1 (en) * 2006-11-22 2008-05-22 International Business Machines Corporation, Inc. Structures to enhance cooling of computer memory modules
US20080123300A1 (en) * 2006-11-29 2008-05-29 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
US20080123303A1 (en) * 2006-11-29 2008-05-29 Elpida Memory, Inc. Memory module
US20080137278A1 (en) * 2006-12-11 2008-06-12 Kreton Corporation Memory chip and insert card having the same thereon
US20080155158A1 (en) * 2006-12-22 2008-06-26 Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd Pci interface card
US20080266816A1 (en) * 2004-11-16 2008-10-30 Super Talent Electronics, Inc. Light-Weight Solid State Drive With Rivet Sets
US20090086448A1 (en) * 2007-09-27 2009-04-02 Hiew Siew S Solid state drive with coverless casing
US7516281B2 (en) * 2004-05-25 2009-04-07 Micron Technology, Inc. On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
US20090129026A1 (en) * 2007-11-19 2009-05-21 Samsung Electronics Co., Ltd. Heat sink for semiconductor device and semiconductor module assembly including the heat sink
US20090153163A1 (en) * 2007-12-12 2009-06-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
US7590899B2 (en) * 2006-09-15 2009-09-15 International Business Machines Corporation Processor memory array having memory macros for relocatable store protect keys
US20090268390A1 (en) * 2008-04-23 2009-10-29 International Business Machines Corporation Printed circuit assembly with determination of storage configuration based on installed paddle board
US7619893B1 (en) * 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US7636274B2 (en) * 2004-03-05 2009-12-22 Netlist, Inc. Memory module with a circuit providing load isolation and memory domain translation
US20100049914A1 (en) * 2008-08-20 2010-02-25 Goodwin Paul M RAID Enhanced solid state drive
US20100062624A1 (en) * 2008-09-09 2010-03-11 Chou Hsien Tsai Electrical connector having elastic card-ejecting member
US20100073860A1 (en) * 2008-09-24 2010-03-25 Takakatsu Moriai Ssd apparatus
US7688592B2 (en) * 2004-02-23 2010-03-30 Infineon Technologies Ag Cooling system for devices having power semiconductors and method for cooling the device
US7811097B1 (en) * 2005-08-29 2010-10-12 Netlist, Inc. Circuit with flexible portion
US7839712B2 (en) * 2007-08-03 2010-11-23 Qimonda Ag Semiconductor memory arrangement
US7861029B2 (en) * 2007-04-23 2010-12-28 Qimonda Ag Memory module having buffer and memory ranks addressable by respective selection signal
US20110019370A1 (en) * 2009-07-27 2011-01-27 Gainteam Holdings Limited Flexible circuit module
US20110043994A1 (en) * 2009-08-18 2011-02-24 Inventec Corporation Server device with a storage array module
USD637193S1 (en) * 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD637192S1 (en) * 2010-10-18 2011-05-03 Apple Inc. Electronic device
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US20110283043A1 (en) * 2009-09-08 2011-11-17 Ocz Technology Group Inc. Large capacity solid-state storage devices and methods therefor
US8347057B2 (en) * 2009-08-27 2013-01-01 Elpida Memory, Inc. Memory module
USD673921S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
US8422263B2 (en) * 2009-06-05 2013-04-16 Elpida Memory, Inc. Load reduced memory module and memory system including the same
US20130094138A1 (en) * 2010-06-16 2013-04-18 Justion James Meza Computer racks
US8510629B2 (en) * 2009-10-21 2013-08-13 Elpida Memory, Inc. Memory module on which regular chips and error correction chips are mounted
US20130219235A1 (en) * 2012-02-17 2013-08-22 Kabushiki Kaisha Toshiba Memory system and test method thereof
US8675355B2 (en) * 2011-03-16 2014-03-18 Lenovo (Singapore) Pte. Ltd. Release mechanism with pre-travel
US8705240B1 (en) * 2007-12-18 2014-04-22 Google Inc. Embossed heat spreader
US20140111933A1 (en) * 2012-10-18 2014-04-24 Apple Inc. Ssd (solid state drive) related features of a portable computer
US20140146462A1 (en) * 2012-11-26 2014-05-29 Giovanni Coglitore High Density Storage Applicance
USD709894S1 (en) * 2012-09-22 2014-07-29 Apple Inc. Electronic device
US8796830B1 (en) * 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
USD716310S1 (en) * 2012-06-09 2014-10-28 Apple, Inc. Electronic device
USD716743S1 (en) * 2014-03-25 2014-11-04 Transcend Information, Inc. Printed circuit board of solid-state memory
US8885422B2 (en) * 2009-06-12 2014-11-11 Hewlett-Packard Development Company, L.P. Hierarchical on-chip memory
JP1520122S (en) 2014-05-15 2015-03-23
JP1528484S (en) 2015-01-14 2015-07-13
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
US20160172016A1 (en) * 2014-12-12 2016-06-16 Kabushiki Kaisha Toshiba Semiconductor device and electronic device
US20160334992A1 (en) * 2015-05-12 2016-11-17 Kabushiki Kaisha Toshiba Semiconductor device that changes a target memory unit based on temperature
US20170010639A1 (en) * 2015-07-09 2017-01-12 Kabushiki Kaisha Toshiba Semiconductor device package having an oscillator and an apparatus having the same
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD794035S1 (en) * 2016-06-20 2017-08-08 V-Color Technology Inc. Solid state drive
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD795823S1 (en) * 2014-08-29 2017-08-29 Apple Inc. Component for electronic device
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
JP1600323S (en) 2017-02-17 2018-03-26
JP1608117S (en) 2017-02-17 2018-07-02
JP1608282S (en) 2017-02-17 2018-07-02
JP1608281S (en) 2017-02-17 2018-07-02
USD824910S1 (en) * 2017-02-17 2018-08-07 Samsung Electronics Co., Ltd. SSD storage device
USD826945S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD826946S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD828358S1 (en) * 2017-02-17 2018-09-11 Samsung Electronics Co., Ltd. SSD storage device

Patent Citations (126)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4936785A (en) * 1988-12-19 1990-06-26 Krug Eric M Interchangeable adapter module for electronic devices
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US6036098A (en) * 1992-05-15 2000-03-14 Symbol Technologies, Inc. Miniature scan element operably connected to a personal computer interface card
US5347428A (en) * 1992-12-03 1994-09-13 Irvine Sensors Corporation Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
US5303121A (en) * 1992-12-28 1994-04-12 Ncr Corporation Multi-chip module board
USD370464S (en) * 1994-11-30 1996-06-04 Metropage, Inc. Heat seal connector for a pager
US6088829A (en) * 1995-10-26 2000-07-11 Hitachi, Ltd. Synchronous data transfer system
US6021048A (en) * 1998-02-17 2000-02-01 Smith; Gary W. High speed memory module
US6008994A (en) * 1998-08-04 1999-12-28 Itt Manufacturing Enterprises, Inc. PC card grounding clip
US6025992A (en) * 1999-02-11 2000-02-15 International Business Machines Corp. Integrated heat exchanger for memory module
US6381140B1 (en) * 1999-08-30 2002-04-30 Witek Enterprise Co., Ltd. Memory module
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
US6628538B2 (en) * 2000-03-10 2003-09-30 Hitachi, Ltd. Memory module including module data wirings available as a memory access data bus
US6757751B1 (en) * 2000-08-11 2004-06-29 Harrison Gene High-speed, multiple-bank, stacked, and PCB-mounted memory module
US6765278B2 (en) * 2000-08-24 2004-07-20 Heetronix Circuit structure with W, WC and/or W2C layer on AlN substrate
US20020056018A1 (en) * 2000-09-08 2002-05-09 Schumacher Matthew J. Method and apparatus implementing a tuned stub SCSI topology
US6614664B2 (en) * 2000-10-24 2003-09-02 Samsung Electronics Co., Ltd. Memory module having series-connected printed circuit boards
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US20030097506A1 (en) * 2001-11-20 2003-05-22 Aaeon Technology Inc. Structure of the bus card of the mini image port
US20050078454A1 (en) * 2001-12-04 2005-04-14 Jun Hyodo Power supply
US20070294889A1 (en) * 2001-12-06 2007-12-27 Reinhold Schmitt Electronic circuit module and method for its assembly
US6590282B1 (en) * 2002-04-12 2003-07-08 Industrial Technology Research Institute Stacked semiconductor package formed on a substrate and method for fabrication
US6762942B1 (en) * 2002-09-05 2004-07-13 Gary W. Smith Break away, high speed, folded, jumperless electronic assembly
US20040196682A1 (en) * 2002-09-26 2004-10-07 Elpida Memory, Inc. Semiconductor unit having two device terminals for every one input/output signal
US6812555B2 (en) * 2003-03-10 2004-11-02 Everstone Industry Corp. Memory card substrate with alternating contacts
US20050082663A1 (en) * 2003-10-20 2005-04-21 Renesas Technology Corp. Semiconductor device and semiconductor module
US20050088828A1 (en) * 2003-10-27 2005-04-28 Benq Corporation Electronic apparatus with module-locking device
US20050161782A1 (en) * 2003-12-24 2005-07-28 Sanyo Electric Co., Ltd. Hybrid integrated circuit device and manufacturing method of the same
US20050161781A1 (en) * 2003-12-24 2005-07-28 Sanyo Electric Co., Ltd. Hybrid integrated circuit device and manufacturing method thereof
US7688592B2 (en) * 2004-02-23 2010-03-30 Infineon Technologies Ag Cooling system for devices having power semiconductors and method for cooling the device
US7636274B2 (en) * 2004-03-05 2009-12-22 Netlist, Inc. Memory module with a circuit providing load isolation and memory domain translation
US7516281B2 (en) * 2004-05-25 2009-04-07 Micron Technology, Inc. On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
US20060050498A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Die module system and method
US20060050489A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Optimized mounting area circuit module system and method
US20060049500A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US20060129888A1 (en) * 2004-09-03 2006-06-15 Staktek Group L.P. Circuit module turbulence enhacement systems and methods
US20060049502A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Module thermal management system and method
US20060050592A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Compact module system and method
US20060050488A1 (en) * 2004-09-03 2006-03-09 Staktel Group, L.P. High capacity thin module system and method
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US20060067054A1 (en) * 2004-09-29 2006-03-30 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7299313B2 (en) * 2004-10-29 2007-11-20 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
US20080266816A1 (en) * 2004-11-16 2008-10-30 Super Talent Electronics, Inc. Light-Weight Solid State Drive With Rivet Sets
US7269025B2 (en) * 2004-12-30 2007-09-11 Intel Corporation Ballout for buffer
US20060171247A1 (en) * 2005-02-03 2006-08-03 Wolfgang Hoppe Semiconductor memory module with bus architecture
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US20070011574A1 (en) * 2005-06-14 2007-01-11 Christian Weiss Memory device
US20070033490A1 (en) * 2005-07-19 2007-02-08 Karl-Heinz Moosrainer Semiconductor memory module with error correction
US7811097B1 (en) * 2005-08-29 2010-10-12 Netlist, Inc. Circuit with flexible portion
US20070139897A1 (en) * 2005-12-19 2007-06-21 Siva Raghuram Circuit board arrangement including heat dissipater
US20070176286A1 (en) * 2006-02-02 2007-08-02 Staktek Group L.P. Composite core circuit module system and method
US7619893B1 (en) * 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US20070212902A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212920A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212919A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070212906A1 (en) * 2006-03-08 2007-09-13 Clayton James E Thin multichip flex-module
US20070223198A1 (en) * 2006-03-25 2007-09-27 Foxconn Technology Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US20070281500A1 (en) * 2006-05-31 2007-12-06 Hon Hai Precision Ind. Co., Ltd. Card edge connector
US20080038961A1 (en) * 2006-08-11 2008-02-14 Samsung Electronics Co., Ltd. Memory module, memory module socket and mainboard using same
US8796830B1 (en) * 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US7590899B2 (en) * 2006-09-15 2009-09-15 International Business Machines Corporation Processor memory array having memory macros for relocatable store protect keys
US20080094811A1 (en) * 2006-10-23 2008-04-24 International Business Machines Corporation High density high reliability memory module with a fault tolerant address and command bus
US20080116571A1 (en) * 2006-11-22 2008-05-22 International Business Machines Corporation, Inc. Structures to enhance cooling of computer memory modules
US20080123300A1 (en) * 2006-11-29 2008-05-29 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
US20080123303A1 (en) * 2006-11-29 2008-05-29 Elpida Memory, Inc. Memory module
US20080137278A1 (en) * 2006-12-11 2008-06-12 Kreton Corporation Memory chip and insert card having the same thereon
US20080155158A1 (en) * 2006-12-22 2008-06-26 Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd Pci interface card
US7861029B2 (en) * 2007-04-23 2010-12-28 Qimonda Ag Memory module having buffer and memory ranks addressable by respective selection signal
US7839712B2 (en) * 2007-08-03 2010-11-23 Qimonda Ag Semiconductor memory arrangement
US20090086448A1 (en) * 2007-09-27 2009-04-02 Hiew Siew S Solid state drive with coverless casing
US20090129026A1 (en) * 2007-11-19 2009-05-21 Samsung Electronics Co., Ltd. Heat sink for semiconductor device and semiconductor module assembly including the heat sink
US20090153163A1 (en) * 2007-12-12 2009-06-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
US8705240B1 (en) * 2007-12-18 2014-04-22 Google Inc. Embossed heat spreader
US20090268390A1 (en) * 2008-04-23 2009-10-29 International Business Machines Corporation Printed circuit assembly with determination of storage configuration based on installed paddle board
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
US20100049914A1 (en) * 2008-08-20 2010-02-25 Goodwin Paul M RAID Enhanced solid state drive
US20100062624A1 (en) * 2008-09-09 2010-03-11 Chou Hsien Tsai Electrical connector having elastic card-ejecting member
US20100073860A1 (en) * 2008-09-24 2010-03-25 Takakatsu Moriai Ssd apparatus
US8422263B2 (en) * 2009-06-05 2013-04-16 Elpida Memory, Inc. Load reduced memory module and memory system including the same
US8885422B2 (en) * 2009-06-12 2014-11-11 Hewlett-Packard Development Company, L.P. Hierarchical on-chip memory
US20110019370A1 (en) * 2009-07-27 2011-01-27 Gainteam Holdings Limited Flexible circuit module
US20110043994A1 (en) * 2009-08-18 2011-02-24 Inventec Corporation Server device with a storage array module
US8347057B2 (en) * 2009-08-27 2013-01-01 Elpida Memory, Inc. Memory module
US20110283043A1 (en) * 2009-09-08 2011-11-17 Ocz Technology Group Inc. Large capacity solid-state storage devices and methods therefor
US8510629B2 (en) * 2009-10-21 2013-08-13 Elpida Memory, Inc. Memory module on which regular chips and error correction chips are mounted
US20130094138A1 (en) * 2010-06-16 2013-04-18 Justion James Meza Computer racks
USD655296S1 (en) * 2010-10-18 2012-03-06 Apple Inc. Electronic device
USD637192S1 (en) * 2010-10-18 2011-05-03 Apple Inc. Electronic device
USD768134S1 (en) * 2010-10-18 2016-10-04 Apple Inc. Electronic device
USD686215S1 (en) * 2010-11-19 2013-07-16 Apple Inc. Electronic device
USD652041S1 (en) * 2010-11-19 2012-01-10 Apple Inc. Electronic device
USD637193S1 (en) * 2010-11-19 2011-05-03 Apple Inc. Electronic device
US8675355B2 (en) * 2011-03-16 2014-03-18 Lenovo (Singapore) Pte. Ltd. Release mechanism with pre-travel
USD673921S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
US20130219235A1 (en) * 2012-02-17 2013-08-22 Kabushiki Kaisha Toshiba Memory system and test method thereof
USD716310S1 (en) * 2012-06-09 2014-10-28 Apple, Inc. Electronic device
USD709894S1 (en) * 2012-09-22 2014-07-29 Apple Inc. Electronic device
US20140111933A1 (en) * 2012-10-18 2014-04-24 Apple Inc. Ssd (solid state drive) related features of a portable computer
US20140146462A1 (en) * 2012-11-26 2014-05-29 Giovanni Coglitore High Density Storage Applicance
USD716743S1 (en) * 2014-03-25 2014-11-04 Transcend Information, Inc. Printed circuit board of solid-state memory
JP1520122S (en) 2014-05-15 2015-03-23
USD795823S1 (en) * 2014-08-29 2017-08-29 Apple Inc. Component for electronic device
US20160172016A1 (en) * 2014-12-12 2016-06-16 Kabushiki Kaisha Toshiba Semiconductor device and electronic device
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
JP1528484S (en) 2015-01-14 2015-07-13
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
US20160334992A1 (en) * 2015-05-12 2016-11-17 Kabushiki Kaisha Toshiba Semiconductor device that changes a target memory unit based on temperature
US20170010639A1 (en) * 2015-07-09 2017-01-12 Kabushiki Kaisha Toshiba Semiconductor device package having an oscillator and an apparatus having the same
USD794035S1 (en) * 2016-06-20 2017-08-08 V-Color Technology Inc. Solid state drive
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
JP1608281S (en) 2017-02-17 2018-07-02
JP1608117S (en) 2017-02-17 2018-07-02
JP1608282S (en) 2017-02-17 2018-07-02
JP1600323S (en) 2017-02-17 2018-03-26
USD824910S1 (en) * 2017-02-17 2018-08-07 Samsung Electronics Co., Ltd. SSD storage device
USD826944S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD826945S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD826946S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD828358S1 (en) * 2017-02-17 2018-09-11 Samsung Electronics Co., Ltd. SSD storage device
USD828357S1 (en) * 2017-02-17 2018-09-11 Samsung Electronics Co., Ltd. SSD storage device
USD834025S1 (en) * 2017-02-17 2018-11-20 Samsung Electronics Co., Ltd. SSD storage device

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Communication dated Jun. 26, 2018, issued by the Japanese Patent Office in counterpart Japanese Application No. 2017-017642.
Communication dated Mar. 16, 2018, issued by the Taiwanese Patent Office in counterpart Taiwanese application No. 106304668.
Memory Module ; Product No. THNSNC 256 GMDJ; Toshiba Corporation, Japan; H1-460HJ22057882, Dec. 6, 2010.
Non-Patent Prior Art list, total 2 pages.
Solid state drive, 64G Mini PCIe 64 GB SATA Solid State Drive, H6-553, CompUSA, Inc., US; HJ21030272, Oct. 5, 2009.

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
USD930601S1 (en) * 2019-04-26 2021-09-14 The Noco Company Circuit board
USD937793S1 (en) * 2019-04-26 2021-12-07 The Noco Company Circuit board
USD937792S1 (en) * 2019-04-26 2021-12-07 The Noco Company Circuit board
USD1009778S1 (en) 2019-04-26 2024-01-02 The Noco Company Battery
USD1003842S1 (en) * 2019-04-26 2023-11-07 The Noco Company Circuit board
USD1003822S1 (en) 2019-04-26 2023-11-07 The Noco Company Battery
USD958762S1 (en) * 2019-09-09 2022-07-26 The Noco Company Circuit board
USD989014S1 (en) * 2019-09-09 2023-06-13 The Noco Company Circuit board
USD1001753S1 (en) 2019-09-09 2023-10-17 The Noco Company Circuit board
USD949117S1 (en) * 2019-09-09 2022-04-19 The Noco Company Circuit board
USD944219S1 (en) * 2019-09-09 2022-02-22 The Noco Company Circuit board
USD1009777S1 (en) 2019-09-09 2024-01-02 The Noco Company Battery
USD938374S1 (en) * 2019-09-09 2021-12-14 The Noco Company Circuit board
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board
USD1009815S1 (en) * 2021-01-22 2024-01-02 The Noco Company Circuit board
USD1010591S1 (en) * 2021-01-22 2024-01-09 The Noco Company Circuit board
USD1012872S1 (en) * 2021-01-22 2024-01-30 The Noco Company Circuit board

Also Published As

Publication number Publication date
TWD190983S (en) 2018-06-11
JP1611022S (en) 2018-08-13

Similar Documents

Publication Publication Date Title
USD892124S1 (en) SSD storage device
USD848432S1 (en) SSD storage device
USD847811S1 (en) SSD storage device
USD866558S1 (en) SSD storage device
USD812065S1 (en) External storage device case
USD829719S1 (en) SSD storage device
USD819023S1 (en) SSD storage device
USD834301S1 (en) Case
USD848419S1 (en) SSD storage device
USD819022S1 (en) SSD storage device
USD831657S1 (en) External SSD storage device
USD856651S1 (en) Insole
USD861161S1 (en) Connector
USD896230S1 (en) SSD storage device
USD819633S1 (en) External SSD storage device
USD818554S1 (en) Magazine loader
USD940066S1 (en) Battery
USD819024S1 (en) External SSD storage device
USD817397S1 (en) Information board
USD816833S1 (en) Access needle securement device
USD859803S1 (en) Insole
USD896229S1 (en) SSD storage device
USD801277S1 (en) Connection module
USD862475S1 (en) SSD storage device
USD820572S1 (en) Insole