USD872037S1 - Cover of seal cap for reaction chamber for semiconductor manufacturing - Google Patents

Cover of seal cap for reaction chamber for semiconductor manufacturing Download PDF

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Publication number
USD872037S1
USD872037S1 US29/635,319 US201829635319F USD872037S US D872037 S1 USD872037 S1 US D872037S1 US 201829635319 F US201829635319 F US 201829635319F US D872037 S USD872037 S US D872037S
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United States
Prior art keywords
cover
reaction chamber
semiconductor manufacturing
seal cap
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/635,319
Inventor
Yusaku OKAJIMA
Hidenari YOSHIDA
Shuhei SAIDO
Takafumi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
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Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAIDO, SHUHEI, SASAKI, TAKAFUMI, OKAJIMA, YUSAKU, YOSHIDA, HIDENARI
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
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FIG. 1 is a front, bottom and right side perspective view of a cover of seal cap for reaction chamber for semiconductor manufacturing showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 6; and,
FIG. 9 is a cross-sectional view take along line 9-9 in FIG. 7.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a cover of seal cap for reaction chamber for semiconductor manufacturing, as shown (and described).
US29/635,319 2017-08-09 2018-01-30 Cover of seal cap for reaction chamber for semiconductor manufacturing Active USD872037S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2017-17193F JP1598442S (en) 2017-08-09 2017-08-09
JP2017-017193 2017-08-09

Publications (1)

Publication Number Publication Date
USD872037S1 true USD872037S1 (en) 2020-01-07

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ID=61232739

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US29/635,319 Active USD872037S1 (en) 2017-08-09 2018-01-30 Cover of seal cap for reaction chamber for semiconductor manufacturing

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US (1) USD872037S1 (en)
JP (1) JP1598442S (en)
TW (1) TWD193014S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD916037S1 (en) * 2018-05-18 2021-04-13 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor
USD929198S1 (en) * 2019-09-16 2021-08-31 David Gysland Tungsten grinder
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD1037163S1 (en) * 2021-11-17 2024-07-30 Fuji Electric Co., Ltd. Semiconductor module

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1620194S (en) 2018-01-22 2018-12-10
JP1638504S (en) 2018-12-06 2019-08-05

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD560284S1 (en) * 2005-03-30 2008-01-22 Tokyo Electron Limited Cover ring
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
US20140302700A1 (en) * 2013-04-09 2014-10-09 Carol Makinen Snap electrical connector
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD732480S1 (en) * 2012-12-20 2015-06-23 Patrick Alan Watson Snap electrical connector assembly
JP1579504S (en) 2016-07-26 2017-06-19
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD560284S1 (en) * 2005-03-30 2008-01-22 Tokyo Electron Limited Cover ring
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD732480S1 (en) * 2012-12-20 2015-06-23 Patrick Alan Watson Snap electrical connector assembly
US20140302700A1 (en) * 2013-04-09 2014-10-09 Carol Makinen Snap electrical connector
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
JP1579504S (en) 2016-07-26 2017-06-19
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/591,907, filed Jan. 25, 2017 by Applicant Hitachi Kokusai Electric Inc., Inventors: Yusaku Okajima, Shuhei Saido and Mika Urushihara.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD916037S1 (en) * 2018-05-18 2021-04-13 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD929198S1 (en) * 2019-09-16 2021-08-31 David Gysland Tungsten grinder
USD1037163S1 (en) * 2021-11-17 2024-07-30 Fuji Electric Co., Ltd. Semiconductor module

Also Published As

Publication number Publication date
JP1598442S (en) 2018-02-26
TWD193014S (en) 2018-09-21

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