USD851142S1 - Pressing member for substrate polishing apparatus - Google Patents

Pressing member for substrate polishing apparatus Download PDF

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Publication number
USD851142S1
USD851142S1 US29/659,981 US201829659981F USD851142S US D851142 S1 USD851142 S1 US D851142S1 US 201829659981 F US201829659981 F US 201829659981F US D851142 S USD851142 S US D851142S
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US
United States
Prior art keywords
pressing member
polishing apparatus
substrate polishing
substrate
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/659,981
Inventor
Kenji Kamimura
Masayuki Nakanishi
Satoru Yamamoto
Yasuyuki MIYASAWA
Kenji Kodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2016-16854F external-priority patent/JP1576585S/ja
Priority claimed from JPD2016-16852F external-priority patent/JP1576368S/ja
Priority claimed from JPD2016-16855F external-priority patent/JP1576370S/ja
Priority claimed from JPD2016-16853F external-priority patent/JP1576369S/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US29/659,981 priority Critical patent/USD851142S1/en
Application granted granted Critical
Publication of USD851142S1 publication Critical patent/USD851142S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a first perspective view, observed from a front of a pressing member for a substrate polishing apparatus showing our new design;
FIG. 2 is a second perspective view, observed from a rear thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a right-side view thereof, a left-side view being a mirror image thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a pressing member for a substrate polishing apparatus, as shown and described.
US29/659,981 2016-08-05 2018-08-14 Pressing member for substrate polishing apparatus Active USD851142S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/659,981 USD851142S1 (en) 2016-08-05 2018-08-14 Pressing member for substrate polishing apparatus

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2016-016852 2016-02-01
JPD2016-16854F JP1576585S (en) 2016-08-05 2016-08-05
JP2016-016854 2016-08-05
JP2016-016853 2016-08-05
JPD2016-16852F JP1576368S (en) 2016-08-05 2016-08-05
JPD2016-16855F JP1576370S (en) 2016-08-05 2016-08-05
JPD2016-16853F JP1576369S (en) 2016-08-05 2016-08-05
JP2016-016855 2016-08-05
US29/592,889 USD834075S1 (en) 2016-08-05 2017-02-03 Pressing member for substrate polishing apparatus
US29/659,981 USD851142S1 (en) 2016-08-05 2018-08-14 Pressing member for substrate polishing apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/592,889 Division USD834075S1 (en) 2016-08-05 2017-02-03 Pressing member for substrate polishing apparatus

Publications (1)

Publication Number Publication Date
USD851142S1 true USD851142S1 (en) 2019-06-11

Family

ID=64176235

Family Applications (4)

Application Number Title Priority Date Filing Date
US29/592,889 Active USD834075S1 (en) 2016-08-05 2017-02-03 Pressing member for substrate polishing apparatus
US29/659,981 Active USD851142S1 (en) 2016-08-05 2018-08-14 Pressing member for substrate polishing apparatus
US29/659,970 Active USD851141S1 (en) 2016-08-05 2018-08-14 Pressing member for substrate polishing apparatus
US29/659,963 Active USD851140S1 (en) 2016-08-05 2018-08-14 Pressing member for substrate polishing apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/592,889 Active USD834075S1 (en) 2016-08-05 2017-02-03 Pressing member for substrate polishing apparatus

Family Applications After (2)

Application Number Title Priority Date Filing Date
US29/659,970 Active USD851141S1 (en) 2016-08-05 2018-08-14 Pressing member for substrate polishing apparatus
US29/659,963 Active USD851140S1 (en) 2016-08-05 2018-08-14 Pressing member for substrate polishing apparatus

Country Status (1)

Country Link
US (4) USD834075S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD890823S1 (en) * 2018-07-18 2020-07-21 Ebara Corporation Substrate holding parts
USD890825S1 (en) * 2018-07-18 2020-07-21 Ebara Corporation Substrate holding parts
USD890824S1 (en) * 2018-07-18 2020-07-21 Ebara Corporation Substrate holding parts
USD890822S1 (en) * 2018-07-18 2020-07-21 Ebara Corporation Substrate holding parts

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD834075S1 (en) * 2016-08-05 2018-11-20 Ebara Corporation Pressing member for substrate polishing apparatus
JP1753524S (en) * 2021-06-01 2023-09-20 press machine jaws

Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1867620A (en) 1930-09-29 1932-07-19 Harry D Forse Pressing member
US3867797A (en) 1973-12-03 1975-02-25 Burroughs Corp Lapping fixture
US5271185A (en) 1991-06-12 1993-12-21 Shin-Etsu Handotai Co., Ltd. Apparatus for chamfering notch of wafer
US5335530A (en) 1991-09-10 1994-08-09 Hewing Gmbh Pressing tool for pressing a cylindrical pressing member or a pressing member comprising a cylindrical portion onto a round profile, particularly a pipe conduit
US5445554A (en) 1991-06-12 1995-08-29 Shin-Etsu Handotai Co., Ltd. Method for chamfering notch of wafer and apparatus therefor
US5476413A (en) 1993-09-30 1995-12-19 Shin-Etsu Handotai Co., Ltd. Apparatus for polishing the periphery portion of a wafer
US5476414A (en) 1992-09-24 1995-12-19 Ebara Corporation Polishing apparatus
US5493380A (en) 1993-05-11 1996-02-20 Canon Kabushiki Kaisha Fixing device with means for limiting a distance between heating and pressing member
US5564965A (en) 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
US5960729A (en) 1997-06-11 1999-10-05 Yamato Mishin Seizo Kabushiki Kaisha Pressing member with air ejector for a sewing machine
US5973271A (en) 1997-12-11 1999-10-26 Sumitomo Wiring Systems, Ltd Grommet assembly including elastic pressing member
US6248005B1 (en) 1998-08-09 2001-06-19 Emutech Co., Ltd. Method and device for polishing work edge
US20010041523A1 (en) 2000-05-04 2001-11-15 Societe Des Procedes Et Machines Speciales Machine for grinding cylindrical bearing surfaces on parts using an abrasive belt
US20020061211A1 (en) 2000-06-30 2002-05-23 Masahiko Kamijo Method and apparatus for toner image fixing using a sheet-shaped pressing member
US20020137439A1 (en) 2000-11-07 2002-09-26 Shunji Hakomori Apparatus of and method for polishing the outer circumferential portions of a circular plate-shaped work
US20020164930A1 (en) 2001-05-02 2002-11-07 Shunji Hakomori Apparatus for polishing periphery of device wafer and polishing method
US20030186624A1 (en) 2002-03-29 2003-10-02 Hoya Corporation Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
US20040087253A1 (en) 2002-11-04 2004-05-06 Niraj Mahadev Method and apparatus for processing sliders for use in disk drives and the like
US20040180610A1 (en) 2001-05-29 2004-09-16 Tetsuji Togawa Polishing apparatus and polishing method
US20050275398A1 (en) 2002-12-04 2005-12-15 Tsuyoshi Yamashita Pressing member and electronic device handling apparatus
US20080085658A1 (en) 2006-10-06 2008-04-10 Seiji Katsuoka Substrate polishing apparatus and method
US20080182482A1 (en) 2007-01-25 2008-07-31 Fujitsu Limited Grinding device and method of grinding
US20090011651A1 (en) 2007-07-02 2009-01-08 Hon Hai Precision Ind. Co., Ltd. Electrical connector with an improved pressing member
US20090177083A1 (en) 2005-01-26 2009-07-09 Takeshi Matsumura Pressing Member, Ultrasonic Probe and Ultrasonic Diagnosing Device
US20090264053A1 (en) 2008-04-21 2009-10-22 Applied Materials, Inc. Apparatus and methods for using a polishing tape cassette
US20100170716A1 (en) 2007-12-26 2010-07-08 Onamba Co., Ltd. Terminal plate circuit using a pressing member
US20110003540A1 (en) 2007-07-11 2011-01-06 Tamami Takahashi Polishing apparatus
US7955113B2 (en) 2009-08-05 2011-06-07 Hon Hai Precision Ind. Co., Ltd. Electrical connector with a retainer with pressing member
US20110132956A1 (en) 2009-12-08 2011-06-09 Kempka Jr Russell Presser Assembly Having A Presser And An Improved Mounting Arrangement For Mounting A Pressing Member To The Presser
US20110237164A1 (en) 2010-01-15 2011-09-29 Masaya Seki Polishing apparatus, polishing method and pressing member for pressing a polishing tool
US20140042005A1 (en) 2012-08-09 2014-02-13 Lite-On Technology Corporation Resilient pressing member structure
USD834075S1 (en) * 2016-08-05 2018-11-20 Ebara Corporation Pressing member for substrate polishing apparatus

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1867620A (en) 1930-09-29 1932-07-19 Harry D Forse Pressing member
US3867797A (en) 1973-12-03 1975-02-25 Burroughs Corp Lapping fixture
US5271185A (en) 1991-06-12 1993-12-21 Shin-Etsu Handotai Co., Ltd. Apparatus for chamfering notch of wafer
US5445554A (en) 1991-06-12 1995-08-29 Shin-Etsu Handotai Co., Ltd. Method for chamfering notch of wafer and apparatus therefor
US5335530A (en) 1991-09-10 1994-08-09 Hewing Gmbh Pressing tool for pressing a cylindrical pressing member or a pressing member comprising a cylindrical portion onto a round profile, particularly a pipe conduit
US5476414A (en) 1992-09-24 1995-12-19 Ebara Corporation Polishing apparatus
US5493380A (en) 1993-05-11 1996-02-20 Canon Kabushiki Kaisha Fixing device with means for limiting a distance between heating and pressing member
US5476413A (en) 1993-09-30 1995-12-19 Shin-Etsu Handotai Co., Ltd. Apparatus for polishing the periphery portion of a wafer
US5564965A (en) 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
US5960729A (en) 1997-06-11 1999-10-05 Yamato Mishin Seizo Kabushiki Kaisha Pressing member with air ejector for a sewing machine
US5973271A (en) 1997-12-11 1999-10-26 Sumitomo Wiring Systems, Ltd Grommet assembly including elastic pressing member
US6248005B1 (en) 1998-08-09 2001-06-19 Emutech Co., Ltd. Method and device for polishing work edge
US20010041523A1 (en) 2000-05-04 2001-11-15 Societe Des Procedes Et Machines Speciales Machine for grinding cylindrical bearing surfaces on parts using an abrasive belt
US20020061211A1 (en) 2000-06-30 2002-05-23 Masahiko Kamijo Method and apparatus for toner image fixing using a sheet-shaped pressing member
US20020137439A1 (en) 2000-11-07 2002-09-26 Shunji Hakomori Apparatus of and method for polishing the outer circumferential portions of a circular plate-shaped work
US20020164930A1 (en) 2001-05-02 2002-11-07 Shunji Hakomori Apparatus for polishing periphery of device wafer and polishing method
US20040180610A1 (en) 2001-05-29 2004-09-16 Tetsuji Togawa Polishing apparatus and polishing method
US20030186624A1 (en) 2002-03-29 2003-10-02 Hoya Corporation Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
US20040087253A1 (en) 2002-11-04 2004-05-06 Niraj Mahadev Method and apparatus for processing sliders for use in disk drives and the like
US20050275398A1 (en) 2002-12-04 2005-12-15 Tsuyoshi Yamashita Pressing member and electronic device handling apparatus
US20090177083A1 (en) 2005-01-26 2009-07-09 Takeshi Matsumura Pressing Member, Ultrasonic Probe and Ultrasonic Diagnosing Device
US20080085658A1 (en) 2006-10-06 2008-04-10 Seiji Katsuoka Substrate polishing apparatus and method
US20080182482A1 (en) 2007-01-25 2008-07-31 Fujitsu Limited Grinding device and method of grinding
US20090011651A1 (en) 2007-07-02 2009-01-08 Hon Hai Precision Ind. Co., Ltd. Electrical connector with an improved pressing member
US20110003540A1 (en) 2007-07-11 2011-01-06 Tamami Takahashi Polishing apparatus
US20100170716A1 (en) 2007-12-26 2010-07-08 Onamba Co., Ltd. Terminal plate circuit using a pressing member
US20090264053A1 (en) 2008-04-21 2009-10-22 Applied Materials, Inc. Apparatus and methods for using a polishing tape cassette
US7955113B2 (en) 2009-08-05 2011-06-07 Hon Hai Precision Ind. Co., Ltd. Electrical connector with a retainer with pressing member
US20110132956A1 (en) 2009-12-08 2011-06-09 Kempka Jr Russell Presser Assembly Having A Presser And An Improved Mounting Arrangement For Mounting A Pressing Member To The Presser
US20110237164A1 (en) 2010-01-15 2011-09-29 Masaya Seki Polishing apparatus, polishing method and pressing member for pressing a polishing tool
US20140042005A1 (en) 2012-08-09 2014-02-13 Lite-On Technology Corporation Resilient pressing member structure
USD834075S1 (en) * 2016-08-05 2018-11-20 Ebara Corporation Pressing member for substrate polishing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD890823S1 (en) * 2018-07-18 2020-07-21 Ebara Corporation Substrate holding parts
USD890825S1 (en) * 2018-07-18 2020-07-21 Ebara Corporation Substrate holding parts
USD890824S1 (en) * 2018-07-18 2020-07-21 Ebara Corporation Substrate holding parts
USD890822S1 (en) * 2018-07-18 2020-07-21 Ebara Corporation Substrate holding parts

Also Published As

Publication number Publication date
USD834075S1 (en) 2018-11-20
USD851140S1 (en) 2019-06-11
USD851141S1 (en) 2019-06-11

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