USD822625S1 - Fin for heat exchanger - Google Patents

Fin for heat exchanger Download PDF

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Publication number
USD822625S1
USD822625S1 US29/582,196 US201629582196F USD822625S US D822625 S1 USD822625 S1 US D822625S1 US 201629582196 F US201629582196 F US 201629582196F US D822625 S USD822625 S US D822625S
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US
United States
Prior art keywords
fin
heat exchanger
elevational view
view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/582,196
Inventor
Shinobu Tamura
Takayuki Matsuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2016-9149F external-priority patent/JP1565579S/ja
Priority claimed from JPD2016-9150F external-priority patent/JP1565876S/ja
Application filed by Showa Denko KK filed Critical Showa Denko KK
Assigned to SHOWA DENKO K.K. reassignment SHOWA DENKO K.K. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUZAWA, TAKAYUKI, TAMURA, SHINOBU
Application granted granted Critical
Publication of USD822625S1 publication Critical patent/USD822625S1/en
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SHOWA DENKO K.K.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
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Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top and right front perspective view of a first embodiment of fin for heat exchanger, showing our design;
FIG. 2 is a front elevational view of the first embodiment;
FIG. 3 is a rear elevational view of the first embodiment;
FIG. 4 is a top plan view of the first embodiment;
FIG. 5 is a bottom elevational view of the first embodiment;
FIG. 6 is a right side elevational view of the first embodiment;
FIG. 7 is a left side elevational view of the first embodiment;
FIG. 8 is an enlarged cross-sectional view of the first embodiment taken along line 8-8 in FIG. 4;
FIG. 9 is a top and right front perspective view of a second embodiment of fin for heat exchanger, showing our design;
FIG. 10 is a front elevational view of the second embodiment;
FIG. 11 is a rear elevational view of the second embodiment;
FIG. 12 is a top plan view of the second embodiment;
FIG. 13 is a bottom elevational view of the second embodiment;
FIG. 14 is a right side elevational view of the second embodiment;
FIG. 15 is a left side elevational view of the second embodiment; and,
FIG. 16 is an enlarged cross-sectional view of the second embodiment taken along line 16-16 in FIG. 12.
Portions of the disclosure shown in broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a fin for heat exchanger, as shown and described.
US29/582,196 2016-04-26 2016-10-26 Fin for heat exchanger Active USD822625S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPD2016-009150 2016-04-26
JPD2016-9149F JP1565579S (en) 2016-04-26 2016-04-26
JPD2016-9150F JP1565876S (en) 2016-04-26 2016-04-26
JPD2016-009149 2016-04-26

Publications (1)

Publication Number Publication Date
USD822625S1 true USD822625S1 (en) 2018-07-10

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US29/582,196 Active USD822625S1 (en) 2016-04-26 2016-10-26 Fin for heat exchanger

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US (1) USD822625S1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD856944S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD856945S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD896767S1 (en) 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD903610S1 (en) * 2019-08-28 2020-12-01 Carbice Corporation Flexible heat sink
US10859330B1 (en) 2019-08-28 2020-12-08 Carbice Corporation Flexible and conformable polymer-based heat sinks and methods of making and using thereof
USD904322S1 (en) * 2019-08-28 2020-12-08 Carbice Corporation Flexible heat sink
USD906269S1 (en) * 2019-08-28 2020-12-29 Carbice Corporation Flexible heat sink
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure

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US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
USD356067S (en) * 1992-03-04 1995-03-07 Itoh Research & Development Laboratory Co., Ltd. Heat dissipating device for a semiconductor package
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US5832992A (en) * 1993-08-19 1998-11-10 Fiwihex Heat exchanger and method for manufacturing same
US5941302A (en) * 1996-03-25 1999-08-24 Ngk Insulators, Ltd. Ceramic shell-and-tube type heat exchanger and method for manufacturing the same
US20020029871A1 (en) * 2000-05-23 2002-03-14 Josef Kern Heat exchanger block
USD478055S1 (en) * 2002-08-08 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating fin
US6622786B1 (en) * 2002-04-17 2003-09-23 International Business Machines Corporation Heat sink structure with pyramidic and base-plate cut-outs
USD490382S1 (en) * 2002-12-09 2004-05-25 Xanoptix, Inc. Inside-out heat sink
US20060196052A1 (en) * 1995-06-13 2006-09-07 Lesage Philip G Modular heat exchanger having a brazed core and method for forming
US7443676B1 (en) * 2007-08-09 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090151900A1 (en) * 2007-12-12 2009-06-18 Tsung-Hsien Huang Heat sink
USD597497S1 (en) * 2007-10-26 2009-08-04 Delta Electronics Inc. Heat dissipating module
USD605141S1 (en) * 2008-10-17 2009-12-01 Kenneth Allen Jones Passive heat sink stand for electronic devices
US20100258287A1 (en) * 2009-04-08 2010-10-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink and method of manufacturing the same
USD662897S1 (en) * 2011-01-04 2012-07-03 Technicolor S.A. Heat sink
US8579017B2 (en) * 2009-08-26 2013-11-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with multiple heat sinks
USD699690S1 (en) * 2013-03-29 2014-02-18 Silverstone Technology Co., Ltd. Cooling fin
US20140293541A1 (en) * 2013-03-26 2014-10-02 Ge Energy Power Conversion Technology Ltd Heat pipe heat sink for high power density
US8881797B2 (en) * 2010-05-05 2014-11-11 Ametek, Inc. Compact plate-fin heat exchanger utilizing an integral heat transfer layer
US20150027669A1 (en) * 2013-07-26 2015-01-29 Hamilton Sundstrand Corporation Heat exchanger with embedded heat pipes
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
US20160091260A1 (en) * 2014-09-29 2016-03-31 International Business Machines Corporation Pin fin compliant heat sink with enhanced flexibility
US20160102920A1 (en) * 2014-10-08 2016-04-14 Mersen Canada Toronto Inc. Heat pipe assembly with bonded fins on the baseplate hybrid
US9383145B2 (en) * 2005-11-30 2016-07-05 Raytheon Company System and method of boiling heat transfer using self-induced coolant transport and impingements
US20160313067A1 (en) * 2015-04-27 2016-10-27 Cooler Master Co., Ltd. Heat dissipating device and heat dissipating fin
US9655287B1 (en) * 2016-02-03 2017-05-16 International Business Machines Corporation Heat exchangers for cooling integrated circuits

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD268666S (en) * 1981-05-18 1983-04-19 Thermalloy Incorporated Heat sink or similar article
US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
USD356067S (en) * 1992-03-04 1995-03-07 Itoh Research & Development Laboratory Co., Ltd. Heat dissipating device for a semiconductor package
US5832992A (en) * 1993-08-19 1998-11-10 Fiwihex Heat exchanger and method for manufacturing same
US5655600A (en) * 1995-06-05 1997-08-12 Alliedsignal Inc. Composite plate pin or ribbon heat exchanger
US20060196052A1 (en) * 1995-06-13 2006-09-07 Lesage Philip G Modular heat exchanger having a brazed core and method for forming
US5941302A (en) * 1996-03-25 1999-08-24 Ngk Insulators, Ltd. Ceramic shell-and-tube type heat exchanger and method for manufacturing the same
US20020029871A1 (en) * 2000-05-23 2002-03-14 Josef Kern Heat exchanger block
US6622786B1 (en) * 2002-04-17 2003-09-23 International Business Machines Corporation Heat sink structure with pyramidic and base-plate cut-outs
USD478055S1 (en) * 2002-08-08 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating fin
USD490382S1 (en) * 2002-12-09 2004-05-25 Xanoptix, Inc. Inside-out heat sink
US9383145B2 (en) * 2005-11-30 2016-07-05 Raytheon Company System and method of boiling heat transfer using self-induced coolant transport and impingements
US7443676B1 (en) * 2007-08-09 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
USD597497S1 (en) * 2007-10-26 2009-08-04 Delta Electronics Inc. Heat dissipating module
US20090151900A1 (en) * 2007-12-12 2009-06-18 Tsung-Hsien Huang Heat sink
USD605141S1 (en) * 2008-10-17 2009-12-01 Kenneth Allen Jones Passive heat sink stand for electronic devices
US20100258287A1 (en) * 2009-04-08 2010-10-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink and method of manufacturing the same
US8579017B2 (en) * 2009-08-26 2013-11-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with multiple heat sinks
US8881797B2 (en) * 2010-05-05 2014-11-11 Ametek, Inc. Compact plate-fin heat exchanger utilizing an integral heat transfer layer
USD662897S1 (en) * 2011-01-04 2012-07-03 Technicolor S.A. Heat sink
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
US20140293541A1 (en) * 2013-03-26 2014-10-02 Ge Energy Power Conversion Technology Ltd Heat pipe heat sink for high power density
USD699690S1 (en) * 2013-03-29 2014-02-18 Silverstone Technology Co., Ltd. Cooling fin
US20150027669A1 (en) * 2013-07-26 2015-01-29 Hamilton Sundstrand Corporation Heat exchanger with embedded heat pipes
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
US20160091260A1 (en) * 2014-09-29 2016-03-31 International Business Machines Corporation Pin fin compliant heat sink with enhanced flexibility
US20160102920A1 (en) * 2014-10-08 2016-04-14 Mersen Canada Toronto Inc. Heat pipe assembly with bonded fins on the baseplate hybrid
US20160313067A1 (en) * 2015-04-27 2016-10-27 Cooler Master Co., Ltd. Heat dissipating device and heat dissipating fin
US9655287B1 (en) * 2016-02-03 2017-05-16 International Business Machines Corporation Heat exchangers for cooling integrated circuits

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Reserch Gate, "Three-Dimensional Numerical Investigations on Flow and Heat Transfer for Flow Past a Channel " by Pratish P Patil and Shaligram Tiwari, Published May 2010. (https://www.researchgate.net/figure/236009504_fig1_Figure-1-Schematic-of-a-fin-tube-heat-exchanger). *
Science Direct, "Thermal and hydraulic performance of finned-tube heat exchangers under different flow ranges: A review on modeling and experiment" by Arafat A. Bhuiyan, A.K.M. Sadrul Islam, Published originally Oct. 2016. (http://www.sciencedirect.com/science/article/pii/S001793101630134X). *
The American Society of Mechanical Engineers, "Effect of Tube Location Change on Heat Transfer Characteristics of Plain Plate Fin-and-Tube Heat Exchangers " by Jixiang Yin, Zeming He, Fuqiang Chen and Jianzong Ma. Published Nov. 15, 2013. (http://thermalscienceapplication.asmedigitalcollection.asme.org/article.aspx?articleid=1727069). *
Thermopedia, "Extended Surface Heat Transfer" by Ramesh Shah, Article added Feb. 2, 2011. (http://www.thermopedia.com/content/750/). *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD856944S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD856945S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD903610S1 (en) * 2019-08-28 2020-12-01 Carbice Corporation Flexible heat sink
US10859330B1 (en) 2019-08-28 2020-12-08 Carbice Corporation Flexible and conformable polymer-based heat sinks and methods of making and using thereof
USD904322S1 (en) * 2019-08-28 2020-12-08 Carbice Corporation Flexible heat sink
USD906269S1 (en) * 2019-08-28 2020-12-29 Carbice Corporation Flexible heat sink
USD896767S1 (en) 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD969760S1 (en) 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure

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