USD798251S1 - Printed circuit board of solid-state memory - Google Patents
Printed circuit board of solid-state memory Download PDFInfo
- Publication number
- USD798251S1 USD798251S1 US29/583,515 US201629583515F USD798251S US D798251 S1 USD798251 S1 US D798251S1 US 201629583515 F US201629583515 F US 201629583515F US D798251 S USD798251 S US D798251S
- Authority
- US
- United States
- Prior art keywords
- solid
- circuit board
- printed circuit
- state memory
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines represent portions of the structure that form no part of the claim.
Claims (1)
- The ornamental design for a printed circuit board of solid-state memory, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/583,515 USD798251S1 (en) | 2016-11-07 | 2016-11-07 | Printed circuit board of solid-state memory |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/583,515 USD798251S1 (en) | 2016-11-07 | 2016-11-07 | Printed circuit board of solid-state memory |
Publications (1)
Publication Number | Publication Date |
---|---|
USD798251S1 true USD798251S1 (en) | 2017-09-26 |
Family
ID=59886702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/583,515 Active USD798251S1 (en) | 2016-11-07 | 2016-11-07 | Printed circuit board of solid-state memory |
Country Status (1)
Country | Link |
---|---|
US (1) | USD798251S1 (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD821987S1 (en) * | 2016-04-27 | 2018-07-03 | Ngk Insulators, Ltd. | Flexible printed circuits |
USD824910S1 (en) * | 2017-02-17 | 2018-08-07 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826946S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826944S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826945S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD828358S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD828357S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD834025S1 (en) * | 2017-02-17 | 2018-11-20 | Samsung Electronics Co., Ltd. | SSD storage device |
USD848432S1 (en) * | 2017-02-17 | 2019-05-14 | Samsung Electronics Co., Ltd. | SSD storage device |
USD862475S1 (en) * | 2017-02-17 | 2019-10-08 | Samsung Electronics Co., Ltd. | SSD storage device |
USD864881S1 (en) * | 2017-04-20 | 2019-10-29 | Msa Technology, Llc | Printed circuit board |
USD869470S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD875056S1 (en) * | 2017-06-08 | 2020-02-11 | Jie Qi | Flexible printed circuit board |
Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD427159S (en) * | 1997-06-27 | 2000-06-27 | Sony Corporation | Semiconductor element |
USD429704S (en) * | 1999-03-10 | 2000-08-22 | Keonil Kang | Printed circuit board for wireless telephones |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US6381143B1 (en) * | 1999-12-17 | 2002-04-30 | Kabushiki Kaisha Toshiba | Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts |
US6410355B1 (en) * | 1998-06-11 | 2002-06-25 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
USD459706S1 (en) * | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
USD465772S1 (en) * | 2001-04-20 | 2002-11-19 | 3Com Corporation | Printed circuit board |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD525213S1 (en) * | 2002-11-01 | 2006-07-18 | Siemens Aktiengesellschaft | Circuit board |
US7094633B2 (en) * | 2003-06-23 | 2006-08-22 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
USD529031S1 (en) * | 2004-07-27 | 2006-09-26 | Siliconware Precision Industries Co., Ltd. | IC card type circuit module |
USD537081S1 (en) * | 2003-07-17 | 2007-02-20 | Sandisk Corporation | Memory card |
USD538286S1 (en) * | 2003-07-17 | 2007-03-13 | Sandisk Corporation | Memory card |
USD548201S1 (en) * | 2006-01-31 | 2007-08-07 | Smart Parts, Inc. | Ion solenoid circuit board |
US7307848B2 (en) * | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with raised portion |
US7306161B2 (en) * | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with chamfer |
USD601978S1 (en) * | 2008-01-09 | 2009-10-13 | Panasonic Corporation | Printed circuit board |
USD605613S1 (en) * | 2008-05-15 | 2009-12-08 | Adc Gmbh | Printed circuit board for electrical connector |
US7864540B2 (en) * | 2003-07-17 | 2011-01-04 | Sandisk Corporation | Peripheral card with sloped edges |
USD637566S1 (en) * | 2010-08-10 | 2011-05-10 | Taymac Corporation | Electrical receptacle circuit board |
USD669478S1 (en) * | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
USD669479S1 (en) * | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
US8649820B2 (en) * | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD716743S1 (en) * | 2014-03-25 | 2014-11-04 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
USD743399S1 (en) * | 2014-05-30 | 2015-11-17 | Emc Corporation | Flash module |
USD753073S1 (en) * | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
USD757666S1 (en) * | 2014-10-16 | 2016-05-31 | Japan Aviation Electronics Industry, Limited | Flexible printed circuit |
USD764424S1 (en) * | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD787456S1 (en) * | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD787457S1 (en) * | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
-
2016
- 2016-11-07 US US29/583,515 patent/USD798251S1/en active Active
Patent Citations (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD427159S (en) * | 1997-06-27 | 2000-06-27 | Sony Corporation | Semiconductor element |
US6410355B1 (en) * | 1998-06-11 | 2002-06-25 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
USD429704S (en) * | 1999-03-10 | 2000-08-22 | Keonil Kang | Printed circuit board for wireless telephones |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US6381143B1 (en) * | 1999-12-17 | 2002-04-30 | Kabushiki Kaisha Toshiba | Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts |
USD465772S1 (en) * | 2001-04-20 | 2002-11-19 | 3Com Corporation | Printed circuit board |
USD459706S1 (en) * | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD471167S1 (en) * | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
USD525213S1 (en) * | 2002-11-01 | 2006-07-18 | Siemens Aktiengesellschaft | Circuit board |
US7094633B2 (en) * | 2003-06-23 | 2006-08-22 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
US7306161B2 (en) * | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with chamfer |
USD537081S1 (en) * | 2003-07-17 | 2007-02-20 | Sandisk Corporation | Memory card |
USD538286S1 (en) * | 2003-07-17 | 2007-03-13 | Sandisk Corporation | Memory card |
US7307848B2 (en) * | 2003-07-17 | 2007-12-11 | Sandisk Corporation | Memory card with raised portion |
US7864540B2 (en) * | 2003-07-17 | 2011-01-04 | Sandisk Corporation | Peripheral card with sloped edges |
USD529031S1 (en) * | 2004-07-27 | 2006-09-26 | Siliconware Precision Industries Co., Ltd. | IC card type circuit module |
USD548201S1 (en) * | 2006-01-31 | 2007-08-07 | Smart Parts, Inc. | Ion solenoid circuit board |
USD601978S1 (en) * | 2008-01-09 | 2009-10-13 | Panasonic Corporation | Printed circuit board |
USD605613S1 (en) * | 2008-05-15 | 2009-12-08 | Adc Gmbh | Printed circuit board for electrical connector |
USD637566S1 (en) * | 2010-08-10 | 2011-05-10 | Taymac Corporation | Electrical receptacle circuit board |
US8649820B2 (en) * | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD669479S1 (en) * | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
USD669478S1 (en) * | 2012-01-13 | 2012-10-23 | Research In Motion Limited | Device smart card |
USD716743S1 (en) * | 2014-03-25 | 2014-11-04 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
USD764424S1 (en) * | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD778850S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD778852S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD778851S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD743399S1 (en) * | 2014-05-30 | 2015-11-17 | Emc Corporation | Flash module |
USD757666S1 (en) * | 2014-10-16 | 2016-05-31 | Japan Aviation Electronics Industry, Limited | Flexible printed circuit |
USD753073S1 (en) * | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
USD787456S1 (en) * | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD787457S1 (en) * | 2015-01-14 | 2017-05-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD821987S1 (en) * | 2016-04-27 | 2018-07-03 | Ngk Insulators, Ltd. | Flexible printed circuits |
USD828357S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826946S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826944S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD826945S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
USD828358S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
USD824910S1 (en) * | 2017-02-17 | 2018-08-07 | Samsung Electronics Co., Ltd. | SSD storage device |
USD834025S1 (en) * | 2017-02-17 | 2018-11-20 | Samsung Electronics Co., Ltd. | SSD storage device |
USD848432S1 (en) * | 2017-02-17 | 2019-05-14 | Samsung Electronics Co., Ltd. | SSD storage device |
USD862475S1 (en) * | 2017-02-17 | 2019-10-08 | Samsung Electronics Co., Ltd. | SSD storage device |
USD864881S1 (en) * | 2017-04-20 | 2019-10-29 | Msa Technology, Llc | Printed circuit board |
USD875056S1 (en) * | 2017-06-08 | 2020-02-11 | Jie Qi | Flexible printed circuit board |
USD869470S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
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