USD794582S1 - LED chip - Google Patents
LED chip Download PDFInfo
- Publication number
- USD794582S1 USD794582S1 US29/572,648 US201629572648F USD794582S US D794582 S1 USD794582 S1 US D794582S1 US 201629572648 F US201629572648 F US 201629572648F US D794582 S USD794582 S US D794582S
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- US
- United States
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- led chip
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Claims (1)
- The ornamental design for an LED chip, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/572,648 USD794582S1 (en) | 2016-07-29 | 2016-07-29 | LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/572,648 USD794582S1 (en) | 2016-07-29 | 2016-07-29 | LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD794582S1 true USD794582S1 (en) | 2017-08-15 |
Family
ID=59560828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/572,648 Active USD794582S1 (en) | 2016-07-29 | 2016-07-29 | LED chip |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD794582S1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD826184S1 (en) * | 2016-03-24 | 2018-08-21 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD831593S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K | Optical semiconductor element |
| USD831592S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD832802S1 (en) * | 2016-03-24 | 2018-11-06 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD899384S1 (en) | 2019-11-04 | 2020-10-20 | Putco, Inc. | Surface-mount device |
| USD1009814S1 (en) * | 2020-04-01 | 2024-01-02 | Xiamen San'an Optoelectronics Technology Co., Ltd. | LED chip |
| USD1022930S1 (en) * | 2020-03-30 | 2024-04-16 | Quanzhou San'an Semiconductor Technology Co., Ltd. | LED chip |
| USD1102396S1 (en) * | 2023-08-08 | 2025-11-18 | Creeled, Inc. | Light-emitting device package |
| USD1104971S1 (en) | 2022-01-18 | 2025-12-09 | Creeled, Inc. | Light-emitting device package |
Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030107053A1 (en) * | 2000-03-31 | 2003-06-12 | Toshiya Uemura | Group-III nitride compound semiconductor device |
| US6650018B1 (en) * | 2002-05-24 | 2003-11-18 | Axt, Inc. | High power, high luminous flux light emitting diode and method of making same |
| US20060131600A1 (en) * | 2004-03-05 | 2006-06-22 | Junichi Nakaoka | Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member |
| US20060192223A1 (en) * | 2005-02-28 | 2006-08-31 | Samsung Electro-Mechanics Co., Ltd. | Nitride semiconductor light emitting device |
| USD566057S1 (en) * | 2006-12-21 | 2008-04-08 | Cree, Inc. | LED chip |
| US20080230791A1 (en) * | 2007-03-19 | 2008-09-25 | Epistar Corporation | Optoelectronic device |
| USD582866S1 (en) * | 2007-09-07 | 2008-12-16 | Cree, Inc. | LED chip |
| USD583338S1 (en) * | 2007-09-07 | 2008-12-23 | Cree, Inc. | LED chip |
| USD633876S1 (en) * | 2009-10-30 | 2011-03-08 | Semi LEDs Optoelectronics Co., Ltd. | Light emitting diode device |
| USD635525S1 (en) * | 2009-04-22 | 2011-04-05 | Cree, Inc. | LED chip |
| USD653630S1 (en) * | 2011-02-21 | 2012-02-07 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode device |
| US8212276B2 (en) * | 2005-09-15 | 2012-07-03 | Epiplus Co., Ltd. | Arrangement of electrodes for light emitting device |
| USD680975S1 (en) * | 2011-05-24 | 2013-04-30 | Lextar Electronics Corp. | LED chip |
| USD684548S1 (en) * | 2011-10-28 | 2013-06-18 | SemiLEDs Optoelectronics Co., Ltd. | LED chip |
| US20130214320A1 (en) * | 2012-02-21 | 2013-08-22 | Nichia Corporation | Semiconductor light emitting element and method for producing the same |
| USD689448S1 (en) * | 2012-01-20 | 2013-09-10 | Sharp Kabushiki Kaisha | Light emitting diode |
| USD691569S1 (en) * | 2011-03-25 | 2013-10-15 | Cree, Inc. | LED chip |
| US8866186B2 (en) * | 2005-09-20 | 2014-10-21 | Toyoda Gosei Co., Ltd. | Group III nitride semiconductor light-emitting device |
| USD729752S1 (en) * | 2014-06-10 | 2015-05-19 | High Power Opto, Inc. | LED chip |
| US9070834B2 (en) * | 2013-06-18 | 2015-06-30 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
| USD737228S1 (en) * | 2011-04-07 | 2015-08-25 | Epistar Corporation | Light emitting diode |
| US9130125B2 (en) * | 2011-08-17 | 2015-09-08 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
| USD764421S1 (en) * | 2014-08-20 | 2016-08-23 | Epistar Corporation | Portions of light-emitting diode unit |
| US9425358B2 (en) * | 2012-09-20 | 2016-08-23 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for production thereof |
| USD771578S1 (en) * | 2014-11-04 | 2016-11-15 | Epistar Corporation | Light-emitting diode device |
-
2016
- 2016-07-29 US US29/572,648 patent/USD794582S1/en active Active
Patent Citations (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030107053A1 (en) * | 2000-03-31 | 2003-06-12 | Toshiya Uemura | Group-III nitride compound semiconductor device |
| US6650018B1 (en) * | 2002-05-24 | 2003-11-18 | Axt, Inc. | High power, high luminous flux light emitting diode and method of making same |
| US20060131600A1 (en) * | 2004-03-05 | 2006-06-22 | Junichi Nakaoka | Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member |
| US20060192223A1 (en) * | 2005-02-28 | 2006-08-31 | Samsung Electro-Mechanics Co., Ltd. | Nitride semiconductor light emitting device |
| US8212276B2 (en) * | 2005-09-15 | 2012-07-03 | Epiplus Co., Ltd. | Arrangement of electrodes for light emitting device |
| US8866186B2 (en) * | 2005-09-20 | 2014-10-21 | Toyoda Gosei Co., Ltd. | Group III nitride semiconductor light-emitting device |
| USD566057S1 (en) * | 2006-12-21 | 2008-04-08 | Cree, Inc. | LED chip |
| US20080230791A1 (en) * | 2007-03-19 | 2008-09-25 | Epistar Corporation | Optoelectronic device |
| USD583338S1 (en) * | 2007-09-07 | 2008-12-23 | Cree, Inc. | LED chip |
| USD602450S1 (en) * | 2007-09-07 | 2009-10-20 | Cree, Inc. | LED chip |
| USD582866S1 (en) * | 2007-09-07 | 2008-12-16 | Cree, Inc. | LED chip |
| USD635525S1 (en) * | 2009-04-22 | 2011-04-05 | Cree, Inc. | LED chip |
| USD633876S1 (en) * | 2009-10-30 | 2011-03-08 | Semi LEDs Optoelectronics Co., Ltd. | Light emitting diode device |
| USD653630S1 (en) * | 2011-02-21 | 2012-02-07 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode device |
| USD691569S1 (en) * | 2011-03-25 | 2013-10-15 | Cree, Inc. | LED chip |
| USD737228S1 (en) * | 2011-04-07 | 2015-08-25 | Epistar Corporation | Light emitting diode |
| USD680975S1 (en) * | 2011-05-24 | 2013-04-30 | Lextar Electronics Corp. | LED chip |
| US9130125B2 (en) * | 2011-08-17 | 2015-09-08 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
| USD684548S1 (en) * | 2011-10-28 | 2013-06-18 | SemiLEDs Optoelectronics Co., Ltd. | LED chip |
| USD689448S1 (en) * | 2012-01-20 | 2013-09-10 | Sharp Kabushiki Kaisha | Light emitting diode |
| US20130214320A1 (en) * | 2012-02-21 | 2013-08-22 | Nichia Corporation | Semiconductor light emitting element and method for producing the same |
| US9425358B2 (en) * | 2012-09-20 | 2016-08-23 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for production thereof |
| US9070834B2 (en) * | 2013-06-18 | 2015-06-30 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
| USD729752S1 (en) * | 2014-06-10 | 2015-05-19 | High Power Opto, Inc. | LED chip |
| USD764421S1 (en) * | 2014-08-20 | 2016-08-23 | Epistar Corporation | Portions of light-emitting diode unit |
| USD771578S1 (en) * | 2014-11-04 | 2016-11-15 | Epistar Corporation | Light-emitting diode device |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD826184S1 (en) * | 2016-03-24 | 2018-08-21 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD831593S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K | Optical semiconductor element |
| USD831592S1 (en) * | 2016-03-24 | 2018-10-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD832802S1 (en) * | 2016-03-24 | 2018-11-06 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD846512S1 (en) * | 2016-03-24 | 2019-04-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD846511S1 (en) * | 2016-03-24 | 2019-04-23 | Hamamatsu Photonics K.K. | Optical semiconductor element |
| USD899384S1 (en) | 2019-11-04 | 2020-10-20 | Putco, Inc. | Surface-mount device |
| USD920933S1 (en) | 2019-11-04 | 2021-06-01 | Putco, Inc. | Surface-mount device |
| USD1022930S1 (en) * | 2020-03-30 | 2024-04-16 | Quanzhou San'an Semiconductor Technology Co., Ltd. | LED chip |
| USD1009814S1 (en) * | 2020-04-01 | 2024-01-02 | Xiamen San'an Optoelectronics Technology Co., Ltd. | LED chip |
| USD1104971S1 (en) | 2022-01-18 | 2025-12-09 | Creeled, Inc. | Light-emitting device package |
| USD1102396S1 (en) * | 2023-08-08 | 2025-11-18 | Creeled, Inc. | Light-emitting device package |
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