USD788722S1 - Socket for an electronic device testing apparatus - Google Patents

Socket for an electronic device testing apparatus Download PDF

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Publication number
USD788722S1
USD788722S1 US29/509,962 US201429509962F USD788722S US D788722 S1 USD788722 S1 US D788722S1 US 201429509962 F US201429509962 F US 201429509962F US D788722 S USD788722 S US D788722S
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US
United States
Prior art keywords
socket
electronic device
testing apparatus
device testing
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/509,962
Inventor
Takeshi Okushi
Mitsunori Aizawa
Masanori Nagashima
Takashi Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Assigned to ADVANTEST CORPORATION reassignment ADVANTEST CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AIZAWA, MITSUNORI, KAWASHIMA, TAKASHI, NAGASHIMA, MASANORI, OKUSHI, TAKESHI
Priority to US29/601,371 priority Critical patent/USD819581S1/en
Application granted granted Critical
Publication of USD788722S1 publication Critical patent/USD788722S1/en
Assigned to ADVANTEST CORPORATION reassignment ADVANTEST CORPORATION CHANGE OF ADDRESS Assignors: ADVANTEST CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front view of a socket for an electronic device testing apparatus showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a top perspective view thereof;
FIG. 8 is a bottom perspective view thereof;
FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 3;
FIG. 10 is a cross-sectional view taken along line 10-10 of FIG. 3;
FIG. 11 is an enlarged view of part 11-11 of FIGS. 9; and,
FIG. 12 is an enlarged view of part 12-12 of FIG. 10.
The part represented by solid lines is a part of the claimed design. The dot-dash broken lines (the alternate long and short dash lines) represent only a border between the part of the claimed design and other part. The dashed broken lines (the broken lines) are for illustrative purposes only and form no part of the claimed design.
The broken lines connecting the arrows in FIG. 3 which show the cut of the plane for FIGS. 9 and 10 form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a socket for an electronic device testing apparatus, as shown and described.
US29/509,962 2014-07-17 2014-11-24 Socket for an electronic device testing apparatus Active USD788722S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/601,371 USD819581S1 (en) 2014-07-17 2017-04-21 Socket for electronic device testing apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20140035155 2014-07-17
KR30-2014-0035155 2014-07-17
KR30-2014-0035153 2014-07-17
KR20140035153 2014-07-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/601,371 Division USD819581S1 (en) 2014-07-17 2017-04-21 Socket for electronic device testing apparatus

Publications (1)

Publication Number Publication Date
USD788722S1 true USD788722S1 (en) 2017-06-06

Family

ID=58778578

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/509,962 Active USD788722S1 (en) 2014-07-17 2014-11-24 Socket for an electronic device testing apparatus
US29/601,371 Active USD819581S1 (en) 2014-07-17 2017-04-21 Socket for electronic device testing apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/601,371 Active USD819581S1 (en) 2014-07-17 2017-04-21 Socket for electronic device testing apparatus

Country Status (1)

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US (2) USD788722S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD819581S1 (en) * 2014-07-17 2018-06-05 Advantest Corporation Socket for electronic device testing apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1678672S (en) * 2019-11-07 2021-02-08

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD358806S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US20030032322A1 (en) * 2001-08-08 2003-02-13 Yamaichi Electronics Co., Ltd. Semiconductor device-socket
US20040063241A1 (en) * 2001-06-19 2004-04-01 Tomohiro Nakano Socket for semiconductor package
US20040212382A1 (en) * 2003-04-28 2004-10-28 Cram Daniel P. Test socket for semiconductor components having serviceable nest
US20050136721A1 (en) * 2003-12-19 2005-06-23 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US20050231919A1 (en) * 2004-04-16 2005-10-20 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US20050250363A1 (en) * 2002-07-09 2005-11-10 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20050287837A1 (en) * 2004-06-24 2005-12-29 Trobough Mark B Multi-portion socket and related apparatuses
USD522977S1 (en) * 2004-08-31 2006-06-13 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20070173081A1 (en) * 2006-01-20 2007-07-26 Hon Hai Precision Ind. Co., Ltd. Socket assembly
US20100062623A1 (en) * 2008-09-08 2010-03-11 Hon Hai Precision Industry Co., Ltd. Ic socket with floatable pressing device for receiving testing ic packages of different sizes
USD633880S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket housing
USD633877S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket frame
USD633878S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cover cap
USD633879S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cap
USD645426S1 (en) * 2010-03-26 2011-09-20 Advanced Micro Devices, Inc. Socket assembly

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3803099B2 (en) * 2002-12-17 2006-08-02 山一電機株式会社 Socket for semiconductor device
JP4471941B2 (en) * 2005-03-10 2010-06-02 山一電機株式会社 Socket for semiconductor device
JP4495200B2 (en) * 2007-09-28 2010-06-30 山一電機株式会社 Socket for semiconductor device
TWM351499U (en) * 2008-08-11 2009-02-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP2010118275A (en) * 2008-11-13 2010-05-27 Yamaichi Electronics Co Ltd Socket for semiconductor device
JP6251104B2 (en) * 2014-03-31 2017-12-20 株式会社エンプラス Elevating mechanism and socket for electrical parts
USD788722S1 (en) * 2014-07-17 2017-06-06 Advantest Corporation Socket for an electronic device testing apparatus

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US20040063241A1 (en) * 2001-06-19 2004-04-01 Tomohiro Nakano Socket for semiconductor package
US20030032322A1 (en) * 2001-08-08 2003-02-13 Yamaichi Electronics Co., Ltd. Semiconductor device-socket
US20050250363A1 (en) * 2002-07-09 2005-11-10 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20040212382A1 (en) * 2003-04-28 2004-10-28 Cram Daniel P. Test socket for semiconductor components having serviceable nest
US20050136721A1 (en) * 2003-12-19 2005-06-23 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US20050231919A1 (en) * 2004-04-16 2005-10-20 Yamaichi Electronics Co., Ltd. Semiconductor device socket
US20050287837A1 (en) * 2004-06-24 2005-12-29 Trobough Mark B Multi-portion socket and related apparatuses
USD522977S1 (en) * 2004-08-31 2006-06-13 Yamaichi Electronics Co., Ltd. Socket for semiconductor device
US20070173081A1 (en) * 2006-01-20 2007-07-26 Hon Hai Precision Ind. Co., Ltd. Socket assembly
US20100062623A1 (en) * 2008-09-08 2010-03-11 Hon Hai Precision Industry Co., Ltd. Ic socket with floatable pressing device for receiving testing ic packages of different sizes
USD633880S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket housing
USD633877S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket frame
USD633878S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cover cap
USD633879S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cap
USD645426S1 (en) * 2010-03-26 2011-09-20 Advanced Micro Devices, Inc. Socket assembly
USD648688S1 (en) * 2010-03-26 2011-11-15 Advanced Micro Devices, Inc. Socket housing
USD661667S1 (en) * 2010-03-26 2012-06-12 Advanced Micro Devices, Inc. Socket assembly

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Office Action issued in Taiwan Counterpart Patent Appl. No. 103306664, dated Jul. 20, 2015.
Office Action issued in Taiwan Counterpart Patent Appl. No. 10420942510, dated Jul. 20, 2015.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD819581S1 (en) * 2014-07-17 2018-06-05 Advantest Corporation Socket for electronic device testing apparatus

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