USD730848S1 - Lead-frame - Google Patents

Lead-frame Download PDF

Info

Publication number
USD730848S1
USD730848S1 US29/496,032 US201429496032F USD730848S US D730848 S1 USD730848 S1 US D730848S1 US 201429496032 F US201429496032 F US 201429496032F US D730848 S USD730848 S US D730848S
Authority
US
United States
Prior art keywords
lead
frame
view
ornamental design
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/496,032
Inventor
Su-Hon Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lextar Electronics Corp
Original Assignee
Lextar Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lextar Electronics Corp filed Critical Lextar Electronics Corp
Assigned to LEXTAR ELECTRONICS CORPORATION reassignment LEXTAR ELECTRONICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, SU-HON
Application granted granted Critical
Publication of USD730848S1 publication Critical patent/USD730848S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of a lead-frame;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof; and,
FIG. 4 is an enlarged view of the part A of FIG. 2.
The broken lines shown in the drawings form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lead-frame, as shown and described.
US29/496,032 2014-01-14 2014-07-08 Lead-frame Active USD730848S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103300218F TWD167284S (en) 2014-01-14 2014-01-14 Portion of lead-frame
TW103300218 2014-01-14

Publications (1)

Publication Number Publication Date
USD730848S1 true USD730848S1 (en) 2015-06-02

Family

ID=53191019

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/496,032 Active USD730848S1 (en) 2014-01-14 2014-07-08 Lead-frame

Country Status (2)

Country Link
US (1) USD730848S1 (en)
TW (1) TWD167284S (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD762596S1 (en) * 2015-04-02 2016-08-02 Genesis Photonics Inc. Light emitting diode package substrate
USD764097S1 (en) 2012-05-03 2016-08-16 Lumenpulse Lighting, Inc. Shroud for LED (light emitting diode) projection fixture
USD768584S1 (en) * 2014-11-13 2016-10-11 Mitsubishi Electric Corporation Light source module
USD774006S1 (en) * 2014-08-27 2016-12-13 Mitsubishi Electric Corporation Light source module
USD780704S1 (en) * 2014-08-27 2017-03-07 Mitsubishi Electric Corporation Light source module
USD824343S1 (en) * 2016-07-27 2018-07-31 Enraytek Optoelectronics Co., Ltd. LED chip

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5617441A (en) * 1991-10-21 1997-04-01 Rohm Co. Ltd. Light source unit and its manufacturing method, adjusting method and adjusting apparatus
US6770498B2 (en) * 2002-06-26 2004-08-03 Lingsen Precision Industries, Ltd. LED package and the process making the same
US6914261B2 (en) * 2003-10-10 2005-07-05 Lambda Opto Technology Co., Ltd. Light emitting diode module
US7015512B2 (en) * 2003-12-20 2006-03-21 Samsung Electro-Mechanics Co., Ltd. High power flip chip LED
US7201511B2 (en) * 2002-10-25 2007-04-10 Moriyama Sangyo Kabushiki Kaisha Light emitting module
USD552566S1 (en) * 2005-09-16 2007-10-09 Toshiba Lighting & Technology Corporation Light emitting diode module
US7289089B2 (en) * 2001-08-03 2007-10-30 Sony Corporation Light emitting unit
US7385653B2 (en) * 2004-05-28 2008-06-10 Samsung Electro-Mechanics Co., Ltd. LED package and backlight assembly for LCD comprising the same
US20100032693A1 (en) * 2004-09-16 2010-02-11 Ryouji Sugiura Led reflecting plate and led device
US20100123144A1 (en) * 2008-11-20 2010-05-20 Everlight Electronics Co., Ltd. Circuit structure of package carrier and multi-chip package
USD616384S1 (en) * 2008-02-29 2010-05-25 Advanced Optoelectronic Technology, Inc. LED module
US20100176405A1 (en) * 2006-04-21 2010-07-15 Cree, Inc. Light Emitting Diode Lighting Package with Improved Heat Sink
US7786498B2 (en) * 2007-03-29 2010-08-31 Samsung Led Co., Ltd. Light emitting device and package having the same
USD622678S1 (en) * 2009-02-18 2010-08-31 Everlight Electronics Co., Ltd. LED carrier
USD636355S1 (en) * 2010-05-12 2011-04-19 Edison Opto Corporation Light emitting diode assembly
US20110186874A1 (en) * 2010-02-03 2011-08-04 Soraa, Inc. White Light Apparatus and Method
US20110204392A1 (en) * 2006-04-25 2011-08-25 Koninklijke Philips Electronics N.V. Led array grid, method and device for manufacturing said grid and led component for use in the same
USD646234S1 (en) * 2010-06-10 2011-10-04 Epistar Corporation Light-emitting diode array
US8100558B2 (en) * 2009-01-17 2012-01-24 Bright Led Electronics Corp. Lighting device and method for making the same
US20120032203A1 (en) * 2009-04-13 2012-02-09 Youji Urano Led unit
US20120091489A1 (en) * 2010-10-15 2012-04-19 Nippon Carbide Industries Co., Inc. Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same
US8907364B2 (en) * 2011-01-17 2014-12-09 Koninklijke Philips Electronics N.V. LED package comprising encapsulation

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5617441A (en) * 1991-10-21 1997-04-01 Rohm Co. Ltd. Light source unit and its manufacturing method, adjusting method and adjusting apparatus
US7289089B2 (en) * 2001-08-03 2007-10-30 Sony Corporation Light emitting unit
US6770498B2 (en) * 2002-06-26 2004-08-03 Lingsen Precision Industries, Ltd. LED package and the process making the same
US7201511B2 (en) * 2002-10-25 2007-04-10 Moriyama Sangyo Kabushiki Kaisha Light emitting module
US6914261B2 (en) * 2003-10-10 2005-07-05 Lambda Opto Technology Co., Ltd. Light emitting diode module
US7015512B2 (en) * 2003-12-20 2006-03-21 Samsung Electro-Mechanics Co., Ltd. High power flip chip LED
US7385653B2 (en) * 2004-05-28 2008-06-10 Samsung Electro-Mechanics Co., Ltd. LED package and backlight assembly for LCD comprising the same
US20100032693A1 (en) * 2004-09-16 2010-02-11 Ryouji Sugiura Led reflecting plate and led device
USD552566S1 (en) * 2005-09-16 2007-10-09 Toshiba Lighting & Technology Corporation Light emitting diode module
US20100176405A1 (en) * 2006-04-21 2010-07-15 Cree, Inc. Light Emitting Diode Lighting Package with Improved Heat Sink
US20110204392A1 (en) * 2006-04-25 2011-08-25 Koninklijke Philips Electronics N.V. Led array grid, method and device for manufacturing said grid and led component for use in the same
US7786498B2 (en) * 2007-03-29 2010-08-31 Samsung Led Co., Ltd. Light emitting device and package having the same
USD616384S1 (en) * 2008-02-29 2010-05-25 Advanced Optoelectronic Technology, Inc. LED module
US20100123144A1 (en) * 2008-11-20 2010-05-20 Everlight Electronics Co., Ltd. Circuit structure of package carrier and multi-chip package
US8100558B2 (en) * 2009-01-17 2012-01-24 Bright Led Electronics Corp. Lighting device and method for making the same
USD622678S1 (en) * 2009-02-18 2010-08-31 Everlight Electronics Co., Ltd. LED carrier
US20120032203A1 (en) * 2009-04-13 2012-02-09 Youji Urano Led unit
US20110186874A1 (en) * 2010-02-03 2011-08-04 Soraa, Inc. White Light Apparatus and Method
USD636355S1 (en) * 2010-05-12 2011-04-19 Edison Opto Corporation Light emitting diode assembly
USD646234S1 (en) * 2010-06-10 2011-10-04 Epistar Corporation Light-emitting diode array
US20120091489A1 (en) * 2010-10-15 2012-04-19 Nippon Carbide Industries Co., Inc. Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same
US8907364B2 (en) * 2011-01-17 2014-12-09 Koninklijke Philips Electronics N.V. LED package comprising encapsulation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD764097S1 (en) 2012-05-03 2016-08-16 Lumenpulse Lighting, Inc. Shroud for LED (light emitting diode) projection fixture
USD774006S1 (en) * 2014-08-27 2016-12-13 Mitsubishi Electric Corporation Light source module
USD780704S1 (en) * 2014-08-27 2017-03-07 Mitsubishi Electric Corporation Light source module
USD768584S1 (en) * 2014-11-13 2016-10-11 Mitsubishi Electric Corporation Light source module
USD762596S1 (en) * 2015-04-02 2016-08-02 Genesis Photonics Inc. Light emitting diode package substrate
USD824343S1 (en) * 2016-07-27 2018-07-31 Enraytek Optoelectronics Co., Ltd. LED chip

Also Published As

Publication number Publication date
TWD167284S (en) 2015-04-21

Similar Documents

Publication Publication Date Title
USD892402S1 (en) Makeup device
USD756222S1 (en) Cap
USD815945S1 (en) Cap
USD780601S1 (en) Container
USD735525S1 (en) One-way valve
USD769124S1 (en) Bottle
USD738972S1 (en) Practice ball
USD738778S1 (en) Oval shaped gemstone
USD766658S1 (en) Impeller for mixer
USD811083S1 (en) Eyeglass case
USD766040S1 (en) Glass
USD779974S1 (en) Container
USD779975S1 (en) Container
USD714098S1 (en) Glass
USD772525S1 (en) Pet food piece
USD789211S1 (en) Container
USD769769S1 (en) Round gemstone
USD759302S1 (en) Vaporizer
USD738445S1 (en) Practice ball
USD839648S1 (en) Table top
USD734688S1 (en) Plant container
USD729061S1 (en) Mirror package
USD779929S1 (en) Glass fastener
USD757596S1 (en) Ornament
USD730848S1 (en) Lead-frame