TWD167284S - Portion of lead-frame - Google Patents
Portion of lead-frameInfo
- Publication number
- TWD167284S TWD167284S TW103300218F TW103300218F TWD167284S TW D167284 S TWD167284 S TW D167284S TW 103300218 F TW103300218 F TW 103300218F TW 103300218 F TW103300218 F TW 103300218F TW D167284 S TWD167284 S TW D167284S
- Authority
- TW
- Taiwan
- Prior art keywords
- lead frame
- circular
- lines
- design
- tape
- Prior art date
Links
- 238000010586 diagram Methods 0.000 abstract 1
Abstract
【物品用途】;本設計係為一種發光二極體用之導線架料帶。;【設計說明】;本設計之導線架料帶為一薄板狀結構。導線架料帶具有多個呈陣列排列之導線架單元。導線架單元大致呈現一方形之結構。每一導線架單元具有一圓形線條以及多個呈環狀排列之弧形線條。上述弧形線條沿著上述圓形線條排列。此外,每一導線架單元具有相對於上述圓形線條呈對稱排列之圖案以及缺口。;如單元放大圖所示,四個相鄰之導線架單元的缺口形成一圓形狀之穿孔,且每兩相鄰之導線架單元的圖案彼此靠近。;圖式所揭露之虛線部分,為本案不主張設計之部分。[Use of article]; This design is a lead frame tape for light-emitting diodes. ;[Design Description];The lead frame tape of this design is a thin plate structure. The lead frame tape has a plurality of lead frame units arranged in an array. The lead frame unit generally has a square structure. Each lead frame unit has a circular line and a plurality of arc-shaped lines arranged in a ring. The above-mentioned arc lines are arranged along the above-mentioned circular lines. In addition, each lead frame unit has patterns and gaps arranged symmetrically with respect to the circular lines. ; As shown in the enlarged view of the unit, the gaps in four adjacent lead frame units form a circular through hole, and the patterns of every two adjacent lead frame units are close to each other. ; The dotted line portion disclosed in the diagram is the portion of the case that is not intended to be designed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103300218F TWD167284S (en) | 2014-01-14 | 2014-01-14 | Portion of lead-frame |
| US29/496,032 USD730848S1 (en) | 2014-01-14 | 2014-07-08 | Lead-frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103300218F TWD167284S (en) | 2014-01-14 | 2014-01-14 | Portion of lead-frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD167284S true TWD167284S (en) | 2015-04-21 |
Family
ID=53191019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103300218F TWD167284S (en) | 2014-01-14 | 2014-01-14 | Portion of lead-frame |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD730848S1 (en) |
| TW (1) | TWD167284S (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD728849S1 (en) | 2012-05-03 | 2015-05-05 | Lumenpulse Lighting Inc. | LED projection fixture |
| USD780704S1 (en) * | 2014-08-27 | 2017-03-07 | Mitsubishi Electric Corporation | Light source module |
| USD774006S1 (en) * | 2014-08-27 | 2016-12-13 | Mitsubishi Electric Corporation | Light source module |
| USD768584S1 (en) * | 2014-11-13 | 2016-10-11 | Mitsubishi Electric Corporation | Light source module |
| USD762596S1 (en) * | 2015-04-02 | 2016-08-02 | Genesis Photonics Inc. | Light emitting diode package substrate |
| USD824343S1 (en) * | 2016-07-27 | 2018-07-31 | Enraytek Optoelectronics Co., Ltd. | LED chip |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5617441A (en) * | 1991-10-21 | 1997-04-01 | Rohm Co. Ltd. | Light source unit and its manufacturing method, adjusting method and adjusting apparatus |
| JP3659407B2 (en) * | 2001-08-03 | 2005-06-15 | ソニー株式会社 | Light emitting device |
| TW546799B (en) * | 2002-06-26 | 2003-08-11 | Lingsen Precision Ind Ltd | Packaged formation method of LED and product structure |
| DE10392736T5 (en) * | 2002-10-25 | 2005-07-07 | Moriyama Sangyo K.K. | light module |
| US6914261B2 (en) * | 2003-10-10 | 2005-07-05 | Lambda Opto Technology Co., Ltd. | Light emitting diode module |
| KR100576855B1 (en) * | 2003-12-20 | 2006-05-10 | 삼성전기주식회사 | High Power Flip Chip LEDs |
| KR100586968B1 (en) * | 2004-05-28 | 2006-06-08 | 삼성전기주식회사 | LED Package and Backlight Assembly for LCD |
| US7626211B2 (en) * | 2004-09-16 | 2009-12-01 | Hitachi Aic Inc. | LED reflecting plate and LED device |
| TWD116536S1 (en) * | 2005-09-16 | 2007-04-21 | 東芝照明技術股份有限公司 | Light emitting diode module |
| US20070247851A1 (en) * | 2006-04-21 | 2007-10-25 | Villard Russel G | Light Emitting Diode Lighting Package With Improved Heat Sink |
| EP2013532A1 (en) * | 2006-04-25 | 2009-01-14 | Koninklijke Philips Electronics N.V. | Led array grid, method and device for manufacturing said grid and led component for use in the same |
| KR100849826B1 (en) * | 2007-03-29 | 2008-07-31 | 삼성전기주식회사 | Light emitting device and package containing same |
| TWD130494S1 (en) * | 2008-02-29 | 2009-08-21 | 先進開發光電股份有限公司 | Led module |
| TWI372476B (en) * | 2008-11-20 | 2012-09-11 | Everlight Electronics Co Ltd | Circuit structure of package carrier and multi-chip package |
| TWI423421B (en) * | 2009-01-17 | 2014-01-11 | Bright Led Electronics Corp | A light emitting device and a manufacturing method thereof |
| TWD134729S1 (en) * | 2009-02-18 | 2010-05-01 | 億光電子工業股份有限公司 | Led carrier |
| WO2010119872A1 (en) * | 2009-04-13 | 2010-10-21 | パナソニック電工株式会社 | Led unit |
| US20110186874A1 (en) * | 2010-02-03 | 2011-08-04 | Soraa, Inc. | White Light Apparatus and Method |
| USD636355S1 (en) * | 2010-05-12 | 2011-04-19 | Edison Opto Corporation | Light emitting diode assembly |
| TWD141522S1 (en) * | 2010-06-10 | 2011-07-11 | 晶元光電股份有限公司 | Light emitting diode array |
| JP5554680B2 (en) * | 2010-10-15 | 2014-07-23 | スタンレー電気株式会社 | Light-emitting element mounting substrate, light-emitting device, and manufacturing method thereof |
| WO2012101488A1 (en) * | 2011-01-17 | 2012-08-02 | Koninklijke Philips Electronics N.V. | Led package comprising encapsulation |
-
2014
- 2014-01-14 TW TW103300218F patent/TWD167284S/en unknown
- 2014-07-08 US US29/496,032 patent/USD730848S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD730848S1 (en) | 2015-06-02 |
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