USD724554S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD724554S1
USD724554S1 US29/491,549 US201429491549F USD724554S US D724554 S1 USD724554 S1 US D724554S1 US 201429491549 F US201429491549 F US 201429491549F US D724554 S USD724554 S US D724554S
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United States
Prior art keywords
semiconductor module
view
semiconductor
module
design
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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US29/491,549
Inventor
Satoru Motohashi
Hideaki Takahashi
Tatsuya Karasawa
Kenshi Terashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
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Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KARASAWA, Tatsuya, MOTOHASHI, SATORU, TERASHIMA, KENSHI, TAKAHASHI, HIDEAKI
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FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view of the semiconductor module of FIG. 1;
FIG. 3 is a left side view of the semiconductor module of FIG. 1;
FIG. 4 is a right side view of the semiconductor module of FIG. 1;
FIG. 5 is a top view of the semiconductor module of FIG. 1;
FIG. 6 is a bottom view of the semiconductor module of FIG. 1; and,
FIG. 7 is a top, front and right side perspective view of the semiconductor module of FIG. 1.
The broken lines shown in the drawings represent portions of the semiconductor module that form no part of the claimed design.
The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals projects from the top surface. Each end in a longitudinal direction includes a mounting hole. Each corner includes a positioning boss.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/491,549 2014-02-19 2014-05-22 Semiconductor module Active USD724554S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2014-003350 2014-02-19
JP2014003350 2014-02-19

Publications (1)

Publication Number Publication Date
USD724554S1 true USD724554S1 (en) 2015-03-17

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US29/491,549 Active USD724554S1 (en) 2014-02-19 2014-05-22 Semiconductor module

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US (1) USD724554S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module

Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031462A (en) * 1989-05-08 1991-07-16 Honeywell Inc. Snap-fit construction low cost pressure sensing device
USD318646S (en) * 1988-12-30 1991-07-30 Honeywell Inc. Differential pressure transducer
US5184107A (en) * 1991-01-28 1993-02-02 Honeywell, Inc. Piezoresistive pressure transducer with a conductive elastomeric seal
USD390833S (en) * 1996-09-09 1998-02-17 Fujikura Ltd. Piezolectric conversion type semiconductor device
USD395423S (en) * 1997-03-13 1998-06-23 Sony Corporation Semiconductor package
USD396696S (en) * 1997-01-30 1998-08-04 Sony Corporation Semiconductor package
USD432095S (en) * 1998-10-09 2000-10-17 Vishay Semiconductor Gmbh Light-emitting semi-conductor component
USD436085S1 (en) * 1999-06-18 2001-01-09 Fujikura, Ltd. Piezoelectric conversion type semiconductor device
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
USD472529S1 (en) * 2002-01-17 2003-04-01 Sony Corporation Semiconductor element
USD472531S1 (en) * 2002-06-25 2003-04-01 Sony Corporation Semiconductor element
USD485242S1 (en) * 2002-01-17 2004-01-13 Sony Corporation Semiconductor element
USD493152S1 (en) * 2002-11-27 2004-07-20 International Business Machines Corporation Server blade chassis midplane printed circuit board with cover
USD505923S1 (en) * 2003-11-13 2005-06-07 Sony Corporation Semiconductor element
USD505924S1 (en) * 2003-11-13 2005-06-07 Sony Corporation Semiconductor element
USD554084S1 (en) * 2005-10-31 2007-10-30 Kabushiki Kaisha Toshiba Portion of a semiconductor apparatus mounting-position accuracy measurement jig
USD576577S1 (en) * 2006-11-30 2008-09-09 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD597504S1 (en) * 2006-11-30 2009-08-04 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD689833S1 (en) * 2011-05-19 2013-09-17 Fuji Electric Co., Ltd. Semiconductor device
USD693318S1 (en) * 2011-10-27 2013-11-12 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD704670S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device

Patent Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD318646S (en) * 1988-12-30 1991-07-30 Honeywell Inc. Differential pressure transducer
US5031462A (en) * 1989-05-08 1991-07-16 Honeywell Inc. Snap-fit construction low cost pressure sensing device
US5184107A (en) * 1991-01-28 1993-02-02 Honeywell, Inc. Piezoresistive pressure transducer with a conductive elastomeric seal
USD390833S (en) * 1996-09-09 1998-02-17 Fujikura Ltd. Piezolectric conversion type semiconductor device
USD396696S (en) * 1997-01-30 1998-08-04 Sony Corporation Semiconductor package
USD395423S (en) * 1997-03-13 1998-06-23 Sony Corporation Semiconductor package
USD432095S (en) * 1998-10-09 2000-10-17 Vishay Semiconductor Gmbh Light-emitting semi-conductor component
USD436085S1 (en) * 1999-06-18 2001-01-09 Fujikura, Ltd. Piezoelectric conversion type semiconductor device
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
USD472529S1 (en) * 2002-01-17 2003-04-01 Sony Corporation Semiconductor element
USD485242S1 (en) * 2002-01-17 2004-01-13 Sony Corporation Semiconductor element
USD472531S1 (en) * 2002-06-25 2003-04-01 Sony Corporation Semiconductor element
USD493152S1 (en) * 2002-11-27 2004-07-20 International Business Machines Corporation Server blade chassis midplane printed circuit board with cover
USD505924S1 (en) * 2003-11-13 2005-06-07 Sony Corporation Semiconductor element
USD505923S1 (en) * 2003-11-13 2005-06-07 Sony Corporation Semiconductor element
USD554084S1 (en) * 2005-10-31 2007-10-30 Kabushiki Kaisha Toshiba Portion of a semiconductor apparatus mounting-position accuracy measurement jig
USD576577S1 (en) * 2006-11-30 2008-09-09 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD597504S1 (en) * 2006-11-30 2009-08-04 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD689833S1 (en) * 2011-05-19 2013-09-17 Fuji Electric Co., Ltd. Semiconductor device
USD693318S1 (en) * 2011-10-27 2013-11-12 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD704670S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/458,663, filed Jun. 21, 2013.
U.S. Appl. No. 29/458,665, filed Jun. 21, 2013.
U.S. Appl. No. 29/458,667, filed Jun. 21, 2013.
U.S. Appl. No. 29/458,669, filed Jun. 21, 2013.
U.S. Appl. No. 29/460,859, filed Jul. 16, 2013.
U.S. Appl. No. 29/460,861, filed Jul. 16, 2013.
U.S. Appl. No. 29/460,862, filed Jul. 16, 2013.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD814433S1 (en) 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module

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