USD717744S1 - Heat spreader on a memory module - Google Patents

Heat spreader on a memory module Download PDF

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Publication number
USD717744S1
USD717744S1 US29/465,650 US201329465650F USD717744S US D717744 S1 USD717744 S1 US D717744S1 US 201329465650 F US201329465650 F US 201329465650F US D717744 S USD717744 S US D717744S
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United States
Prior art keywords
memory module
heat spreader
view
spreader
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/465,650
Inventor
Martin Mueller
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Corsair Memory Inc
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Corsair Memory Inc
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Publication date
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Priority to US29/465,650 priority Critical patent/USD717744S1/en
Assigned to CORSAIR MEMORY, INC. reassignment CORSAIR MEMORY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MUELLER, MARTIN
Assigned to BANK OF AMERICA, N.A., AS AGENT reassignment BANK OF AMERICA, N.A., AS AGENT NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Assignors: CORSAIR COMPONENTS, INC., CORSAIR MEMORY, INC.
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Publication of USD717744S1 publication Critical patent/USD717744S1/en
Assigned to MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT reassignment MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Assignors: CORSAIR MEMORY, INC.
Assigned to MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT reassignment MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Assignors: CORSAIR MEMORY, INC.
Assigned to CORSAIR MEMORY, INC., CORSAIR COMPONENTS, INC. reassignment CORSAIR MEMORY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: BANK OF AMERICA, N.A.
Assigned to Corsair Memory Inc., ORIGIN PC, LLC reassignment Corsair Memory Inc. TERMINATION AND RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY RECORDED AT REEL 043714, FRAME 0171 Assignors: MACQUARIE CAPITAL FUNDING LLC
Assigned to BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT reassignment BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Assignors: CORSAIR MEMORY, INC.
Assigned to CORSAIR MEMORY, INC., ORIGIN PC, LLC reassignment CORSAIR MEMORY, INC. TERMINATION AND RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Assignors: MACQUARIE CAPITAL FUNDING LLC
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front right side perspective view of a heat spreader on a memory module showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top view thereof; and,
FIG. 5 is a bottom view thereof.
The shade lines in the figures show contour and not surface ornamentation.

Claims (1)

    CLAIM
  1. The ornamental design for a heat spreader on a memory module, as shown and described.
US29/465,650 2013-08-30 2013-08-30 Heat spreader on a memory module Active USD717744S1 (en)

Priority Applications (1)

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US29/465,650 USD717744S1 (en) 2013-08-30 2013-08-30 Heat spreader on a memory module

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US29/465,650 USD717744S1 (en) 2013-08-30 2013-08-30 Heat spreader on a memory module

Publications (1)

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USD717744S1 true USD717744S1 (en) 2014-11-18

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US29/465,650 Active USD717744S1 (en) 2013-08-30 2013-08-30 Heat spreader on a memory module

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761744S1 (en) * 2012-07-18 2016-07-19 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD863311S1 (en) * 2018-06-26 2019-10-15 Corsair Memory, Inc. Memory module
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
USD909979S1 (en) * 2017-11-28 2021-02-09 Tai-Sol Electronics Co., Ltd. Vapor chamber
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card
USD963442S1 (en) * 2021-01-22 2022-09-13 New Pig Corporation Installation panel for mats
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module
USD1035597S1 (en) * 2022-12-15 2024-07-16 Kingston Digital, Inc. Heat sink for memory module
USD1061464S1 (en) * 2023-09-28 2025-02-11 Kingston Digital, Inc. Heat sink for memory module
USD1066274S1 (en) * 2021-11-02 2025-03-11 Kingston Digital, Inc. Heat sink for memory module
USD1070863S1 (en) * 2022-12-20 2025-04-15 Kingston Digital, Inc. Heat sink for memory module
USD1080566S1 (en) * 2022-02-23 2025-06-24 Kingston Digital, Inc. Heat sink for memory module

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297966B1 (en) * 1998-12-24 2001-10-02 Foxconn Precision Components Co., Ltd. Memory module having improved heat dissipation and shielding
US20020039282A1 (en) * 2000-09-29 2002-04-04 Samsung Electronics Co., Ltd. Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof
US20030076657A1 (en) * 2001-06-28 2003-04-24 Intel Corporation Heat transfer apparatus
US20050264998A1 (en) * 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
US20070070607A1 (en) * 2005-09-23 2007-03-29 Staktek Group, L.P. Applied heat spreader with cooling fin
US20070263360A1 (en) * 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US7365985B1 (en) * 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US7382617B2 (en) * 2006-01-16 2008-06-03 Nanya Technology Corporation Heat sink assembly
US7391613B2 (en) * 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US20090168356A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly with heat dissipation device
USD597966S1 (en) * 2008-10-09 2009-08-11 Asustek Computer Inc. Memory heat sink
US7606035B2 (en) * 2006-09-22 2009-10-20 Samsung Electronics Co., Ltd. Heat sink and memory module using the same
US20100038054A1 (en) * 2008-08-18 2010-02-18 Comptake Technology Inc. Heat dispensing unit for memory chip
USD610557S1 (en) * 2009-06-16 2010-02-23 Comptake Technology Inc. Heat sink for read only memory device
US20100175852A1 (en) * 2009-01-13 2010-07-15 Peterson Eric C Cooling Manifold Assembly
USD626520S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
US8081474B1 (en) * 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297966B1 (en) * 1998-12-24 2001-10-02 Foxconn Precision Components Co., Ltd. Memory module having improved heat dissipation and shielding
US20020039282A1 (en) * 2000-09-29 2002-04-04 Samsung Electronics Co., Ltd. Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof
US20030076657A1 (en) * 2001-06-28 2003-04-24 Intel Corporation Heat transfer apparatus
US20050264998A1 (en) * 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
US7365985B1 (en) * 2004-09-29 2008-04-29 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US20070070607A1 (en) * 2005-09-23 2007-03-29 Staktek Group, L.P. Applied heat spreader with cooling fin
US7382617B2 (en) * 2006-01-16 2008-06-03 Nanya Technology Corporation Heat sink assembly
US7391613B2 (en) * 2006-05-12 2008-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly including a clamp for mounting heat sinks thereon
US20070263360A1 (en) * 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Memory module assembly including a clip for mounting a heat sink thereon
US7606035B2 (en) * 2006-09-22 2009-10-20 Samsung Electronics Co., Ltd. Heat sink and memory module using the same
US8081474B1 (en) * 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US20090168356A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Memory module assembly with heat dissipation device
US20100038054A1 (en) * 2008-08-18 2010-02-18 Comptake Technology Inc. Heat dispensing unit for memory chip
USD597966S1 (en) * 2008-10-09 2009-08-11 Asustek Computer Inc. Memory heat sink
US20100175852A1 (en) * 2009-01-13 2010-07-15 Peterson Eric C Cooling Manifold Assembly
USD610557S1 (en) * 2009-06-16 2010-02-23 Comptake Technology Inc. Heat sink for read only memory device
USD626520S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761744S1 (en) * 2012-07-18 2016-07-19 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
USD909979S1 (en) * 2017-11-28 2021-02-09 Tai-Sol Electronics Co., Ltd. Vapor chamber
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
USD863311S1 (en) * 2018-06-26 2019-10-15 Corsair Memory, Inc. Memory module
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
USD963442S1 (en) * 2021-01-22 2022-09-13 New Pig Corporation Installation panel for mats
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module
USD1066274S1 (en) * 2021-11-02 2025-03-11 Kingston Digital, Inc. Heat sink for memory module
USD1080566S1 (en) * 2022-02-23 2025-06-24 Kingston Digital, Inc. Heat sink for memory module
USD1035597S1 (en) * 2022-12-15 2024-07-16 Kingston Digital, Inc. Heat sink for memory module
USD1070863S1 (en) * 2022-12-20 2025-04-15 Kingston Digital, Inc. Heat sink for memory module
USD1061464S1 (en) * 2023-09-28 2025-02-11 Kingston Digital, Inc. Heat sink for memory module

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