USD691973S1 - Lamp packages - Google Patents

Lamp packages Download PDF

Info

Publication number
USD691973S1
USD691973S1 US29/396,909 US201129396909F USD691973S US D691973 S1 USD691973 S1 US D691973S1 US 201129396909 F US201129396909 F US 201129396909F US D691973 S USD691973 S US D691973S
Authority
US
United States
Prior art keywords
lamp packages
lamp
packages
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/396,909
Inventor
Matthew Donofrio
Peter Andrews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/396,909 priority Critical patent/USD691973S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANDREWS, PETER, DONOFRIO, MATTHEW
Application granted granted Critical
Publication of USD691973S1 publication Critical patent/USD691973S1/en
Assigned to CREE LED, INC. reassignment CREE LED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to CREELED, INC. reassignment CREELED, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 56012 FRAME 200. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: CREE, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of the lamp package showing our design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a side view thereof;
FIG. 6 is an opposing side view thereof;
FIG. 7 is a front view thereof; and,
FIG. 8 is a back view thereof.
The broken lines shown herein are for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for lamp packages, as shown and described.
US29/396,909 2011-07-08 2011-07-08 Lamp packages Active USD691973S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/396,909 USD691973S1 (en) 2011-07-08 2011-07-08 Lamp packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/396,909 USD691973S1 (en) 2011-07-08 2011-07-08 Lamp packages

Publications (1)

Publication Number Publication Date
USD691973S1 true USD691973S1 (en) 2013-10-22

Family

ID=49355603

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/396,909 Active USD691973S1 (en) 2011-07-08 2011-07-08 Lamp packages

Country Status (1)

Country Link
US (1) USD691973S1 (en)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD703348S1 (en) 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD718258S1 (en) * 2012-09-02 2014-11-25 Cree, Inc. LED package
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD844183S1 (en) 2016-08-19 2019-03-26 Citizen Electronics Co., Ltd. Light emitting diode
USD844576S1 (en) 2017-07-25 2019-04-02 Citizen Electronics Co., Ltd. Light emitting diode
US10991861B2 (en) 2015-10-01 2021-04-27 Cree, Inc. Low optical loss flip chip solid state lighting device
US11031527B2 (en) 2018-01-29 2021-06-08 Creeled, Inc. Reflective layers for light-emitting diodes
US11094848B2 (en) 2019-08-16 2021-08-17 Creeled, Inc. Light-emitting diode chip structures
US11387389B2 (en) 2018-01-29 2022-07-12 Creeled, Inc. Reflective layers for light-emitting diodes
US11398591B2 (en) 2018-12-17 2022-07-26 Creeled, Inc. Interconnects for light emitting diode chips
US11545595B2 (en) 2019-03-19 2023-01-03 Creeled, Inc. Contact structures for light emitting diode chips
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
US11923481B2 (en) 2018-01-29 2024-03-05 Creeled, Inc. Reflective layers for light-emitting diodes
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080157114A1 (en) 2004-11-15 2008-07-03 Philips Lumileds Lighting Company, Llc Multiple Lenses Molded Over LED Die
US20090039381A1 (en) * 2007-08-10 2009-02-12 Alti-Electronics Co., Ltd. Light emitting diode package and method of manufacturing the same
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD598871S1 (en) * 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US7772604B2 (en) * 2006-01-05 2010-08-10 Illumitex Separate optical device for directing light from an LED
US7855395B2 (en) * 2004-09-10 2010-12-21 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins on a light emitting diode die
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
US7906788B2 (en) * 2004-12-22 2011-03-15 Panasonic Corporation Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
USD637565S1 (en) * 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD640643S1 (en) * 2010-04-07 2011-06-28 Everlight Electronics Co., Ltd. Light emitting diode
USD642143S1 (en) * 2010-07-07 2011-07-26 Panasonic Corporation Light emitting diode
US20110248289A1 (en) * 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
US20110260192A1 (en) * 2008-10-01 2011-10-27 Chang Hoon Kwak Light-emitting diode package using a liquid crystal polymer
US20110278627A1 (en) * 2006-12-21 2011-11-17 Geun-Ho Kim Light emitting device package and method for manufacturing the same
US20110291154A1 (en) * 2009-02-10 2011-12-01 Nichia Corporation Semiconductor light emitting device
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD651989S1 (en) * 2010-04-09 2012-01-10 Everlight Electronics Co., Ltd. Light emitting diode
US8119534B2 (en) * 2003-08-19 2012-02-21 Nichia Corporation Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
US8210715B2 (en) 2009-12-09 2012-07-03 Tyco Electronics Corporation Socket assembly with a thermal management structure
USD671661S1 (en) 2008-01-10 2012-11-27 Cree Hong Kong Limited LED package
USD673126S1 (en) 2011-07-08 2012-12-25 Cree, Inc. LED chip

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8119534B2 (en) * 2003-08-19 2012-02-21 Nichia Corporation Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
US7855395B2 (en) * 2004-09-10 2010-12-21 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins on a light emitting diode die
US20080157114A1 (en) 2004-11-15 2008-07-03 Philips Lumileds Lighting Company, Llc Multiple Lenses Molded Over LED Die
US7906788B2 (en) * 2004-12-22 2011-03-15 Panasonic Corporation Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
US7772604B2 (en) * 2006-01-05 2010-08-10 Illumitex Separate optical device for directing light from an LED
USD598871S1 (en) * 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
US20110278627A1 (en) * 2006-12-21 2011-11-17 Geun-Ho Kim Light emitting device package and method for manufacturing the same
US20090039381A1 (en) * 2007-08-10 2009-02-12 Alti-Electronics Co., Ltd. Light emitting diode package and method of manufacturing the same
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD671661S1 (en) 2008-01-10 2012-11-27 Cree Hong Kong Limited LED package
US20110260192A1 (en) * 2008-10-01 2011-10-27 Chang Hoon Kwak Light-emitting diode package using a liquid crystal polymer
US20110291154A1 (en) * 2009-02-10 2011-12-01 Nichia Corporation Semiconductor light emitting device
US8210715B2 (en) 2009-12-09 2012-07-03 Tyco Electronics Corporation Socket assembly with a thermal management structure
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
USD640643S1 (en) * 2010-04-07 2011-06-28 Everlight Electronics Co., Ltd. Light emitting diode
US20110248289A1 (en) * 2010-04-09 2011-10-13 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
USD651989S1 (en) * 2010-04-09 2012-01-10 Everlight Electronics Co., Ltd. Light emitting diode
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD642143S1 (en) * 2010-07-07 2011-07-26 Panasonic Corporation Light emitting diode
USD637565S1 (en) * 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD650343S1 (en) * 2011-01-31 2011-12-13 Cree, Inc. Multiple configuration light emitting device package
USD673126S1 (en) 2011-07-08 2012-12-25 Cree, Inc. LED chip

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9397266B2 (en) 2007-11-14 2016-07-19 Cree, Inc. Lateral semiconductor light emitting diodes having large area contacts
USD703348S1 (en) 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD718258S1 (en) * 2012-09-02 2014-11-25 Cree, Inc. LED package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD892066S1 (en) * 2014-12-11 2020-08-04 Cree, Inc. LED package
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
US10991861B2 (en) 2015-10-01 2021-04-27 Cree, Inc. Low optical loss flip chip solid state lighting device
USD844183S1 (en) 2016-08-19 2019-03-26 Citizen Electronics Co., Ltd. Light emitting diode
USD844576S1 (en) 2017-07-25 2019-04-02 Citizen Electronics Co., Ltd. Light emitting diode
US11031527B2 (en) 2018-01-29 2021-06-08 Creeled, Inc. Reflective layers for light-emitting diodes
US12328980B2 (en) 2018-01-29 2025-06-10 Creeled, Inc. Reflective layers for light-emitting diodes
US11387389B2 (en) 2018-01-29 2022-07-12 Creeled, Inc. Reflective layers for light-emitting diodes
US11923481B2 (en) 2018-01-29 2024-03-05 Creeled, Inc. Reflective layers for light-emitting diodes
US11817537B2 (en) 2018-12-17 2023-11-14 Creeled, Inc. Interconnects for light emitting diode chips
US11398591B2 (en) 2018-12-17 2022-07-26 Creeled, Inc. Interconnects for light emitting diode chips
US11545595B2 (en) 2019-03-19 2023-01-03 Creeled, Inc. Contact structures for light emitting diode chips
US11094848B2 (en) 2019-08-16 2021-08-17 Creeled, Inc. Light-emitting diode chip structures
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD996378S1 (en) * 2022-03-09 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods

Similar Documents

Publication Publication Date Title
USD691973S1 (en) Lamp packages
USD689209S1 (en) Lamp packages
USD680439S1 (en) Package
USD679715S1 (en) Packaging
USD671842S1 (en) Blister packaging
USD639662S1 (en) Package
USD631020S1 (en) LED package
USD703348S1 (en) Lamp package
USD626852S1 (en) Cosmetic package
USD764283S1 (en) Packaging
USD652316S1 (en) Package
USD666107S1 (en) Bottle
USD714660S1 (en) Package
USD672660S1 (en) Packaging with earphones
USD647807S1 (en) Package
USD713259S1 (en) Packaging for a feeding bottle component
USD707550S1 (en) Clamshell package
USD627217S1 (en) Package
USD695625S1 (en) Package for product
USD705068S1 (en) Bottle bottom
USD673126S1 (en) LED chip
USD653963S1 (en) Package
USD693219S1 (en) Clamshell package
USD678053S1 (en) Razor package
USD648636S1 (en) Package