USD655256S1 - Semiconductor substrate - Google Patents
Semiconductor substrate Download PDFInfo
- Publication number
- USD655256S1 USD655256S1 US29/379,471 US37947110F USD655256S US D655256 S1 USD655256 S1 US D655256S1 US 37947110 F US37947110 F US 37947110F US D655256 S USD655256 S US D655256S
- Authority
- US
- United States
- Prior art keywords
- semiconductor substrate
- view
- partially enlarged
- mirror image
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
The broken line showing of the semiconductor substrate is for the purpose of illustrating environmental structure and forms no part of the claimed design.
Claims (1)
- The ornamental design for a semiconductor substrate, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2010-019916 | 2010-08-17 | ||
| JP2010019916 | 2010-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD655256S1 true USD655256S1 (en) | 2012-03-06 |
Family
ID=45758269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/379,471 Expired - Lifetime USD655256S1 (en) | 2010-08-17 | 2010-11-19 | Semiconductor substrate |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD655256S1 (en) |
| CA (1) | CA138031S (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD690672S1 (en) * | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
| USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| USD700440S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD700441S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
| USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
| USD784937S1 (en) | 2014-11-13 | 2017-04-25 | Tokyo Electron Limited | Dummy wafer |
| USD785576S1 (en) | 2014-11-13 | 2017-05-02 | Tokyo Electron Limited | Dummy wafer |
| USD786810S1 (en) * | 2014-11-13 | 2017-05-16 | Tokyo Electron Limited | Dummy wafer |
| USD789311S1 (en) * | 2015-12-28 | 2017-06-13 | Hitachi Kokusai Electric Inc. | Pattern wafer |
| USD791091S1 (en) * | 2015-12-28 | 2017-07-04 | Hitachi Kokusai Electric Inc. | Pattern wafer |
| USD806249S1 (en) * | 2014-12-16 | 2017-12-26 | Hamamatsu Photonics K.K. | Radiation image conversion plate |
| USD808664S1 (en) | 2016-05-16 | 2018-01-30 | Ninja Brand Incorporated | Sheet with camouflage pattern |
| USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| USD947800S1 (en) * | 2018-07-23 | 2022-04-05 | CACI, Inc.—Federal | Integrated module |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD262962S (en) * | 1978-11-03 | 1982-02-09 | Strumpell Winton C | Silicon wafer emitter electrode configuration |
| US4630093A (en) * | 1983-11-24 | 1986-12-16 | Sumitomo Electric Industries, Ltd. | Wafer of semiconductors |
| US5182233A (en) * | 1989-08-02 | 1993-01-26 | Kabushiki Kaisha Toshiba | Compound semiconductor pellet, and method for dicing compound semiconductor wafer |
| US20050106839A1 (en) * | 2001-07-24 | 2005-05-19 | Seiko Epson Corporation | Transfer method, method of manufacturing thin film devices, method of maufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance |
| US6927416B2 (en) * | 2002-12-26 | 2005-08-09 | Disco Corporation | Wafer support plate |
| JP2005260154A (en) | 2004-03-15 | 2005-09-22 | Tokyo Seimitsu Co Ltd | Method of manufacturing chip |
| US20050287846A1 (en) * | 2004-06-29 | 2005-12-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit, and element substrate |
| US20060038182A1 (en) * | 2004-06-04 | 2006-02-23 | The Board Of Trustees Of The University | Stretchable semiconductor elements and stretchable electrical circuits |
| US20060091402A1 (en) * | 2004-10-29 | 2006-05-04 | Sixon Ltd. | Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal |
| US7112952B2 (en) * | 2004-01-30 | 2006-09-26 | Semiconductor Energy Laboratory Co., Ltd. | Inspection system, inspection method, and method for manufacturing semiconductor device |
| US20070082508A1 (en) * | 2005-10-11 | 2007-04-12 | Chiang Tony P | Methods for discretized processing and process sequence integration of regions of a substrate |
| US7205639B2 (en) * | 2005-03-09 | 2007-04-17 | Infineon Technologies Ag | Semiconductor devices with rotated substrates and methods of manufacture thereof |
| US20090011598A1 (en) * | 2007-07-05 | 2009-01-08 | Denso Corporation | Method of manufacturing semiconductor device including silicon carbide substrate |
| US7476575B2 (en) * | 2004-06-24 | 2009-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit |
| USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| US7705430B2 (en) * | 2005-04-27 | 2010-04-27 | Disco Corporation | Semiconductor wafer and processing method for same |
| US20100176403A1 (en) * | 2009-01-13 | 2010-07-15 | Sumitomo Electric Industries, Ltd. | Silicon carbide substrate, epitaxial wafer and manufacturing method of silicon carbide substrate |
| US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
| USD638382S1 (en) * | 2010-04-09 | 2011-05-24 | Panasonic Electric Works Co., Ltd. | Electroluminescence module |
-
2010
- 2010-11-19 CA CA138031F patent/CA138031S/en not_active Expired - Lifetime
- 2010-11-19 US US29/379,471 patent/USD655256S1/en not_active Expired - Lifetime
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD262962S (en) * | 1978-11-03 | 1982-02-09 | Strumpell Winton C | Silicon wafer emitter electrode configuration |
| US4630093A (en) * | 1983-11-24 | 1986-12-16 | Sumitomo Electric Industries, Ltd. | Wafer of semiconductors |
| US5182233A (en) * | 1989-08-02 | 1993-01-26 | Kabushiki Kaisha Toshiba | Compound semiconductor pellet, and method for dicing compound semiconductor wafer |
| US20050106839A1 (en) * | 2001-07-24 | 2005-05-19 | Seiko Epson Corporation | Transfer method, method of manufacturing thin film devices, method of maufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance |
| US6927416B2 (en) * | 2002-12-26 | 2005-08-09 | Disco Corporation | Wafer support plate |
| US7112952B2 (en) * | 2004-01-30 | 2006-09-26 | Semiconductor Energy Laboratory Co., Ltd. | Inspection system, inspection method, and method for manufacturing semiconductor device |
| JP2005260154A (en) | 2004-03-15 | 2005-09-22 | Tokyo Seimitsu Co Ltd | Method of manufacturing chip |
| US20060038182A1 (en) * | 2004-06-04 | 2006-02-23 | The Board Of Trustees Of The University | Stretchable semiconductor elements and stretchable electrical circuits |
| US7476575B2 (en) * | 2004-06-24 | 2009-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit |
| US20050287846A1 (en) * | 2004-06-29 | 2005-12-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit, and element substrate |
| US20060091402A1 (en) * | 2004-10-29 | 2006-05-04 | Sixon Ltd. | Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal |
| US7205639B2 (en) * | 2005-03-09 | 2007-04-17 | Infineon Technologies Ag | Semiconductor devices with rotated substrates and methods of manufacture thereof |
| US7705430B2 (en) * | 2005-04-27 | 2010-04-27 | Disco Corporation | Semiconductor wafer and processing method for same |
| US20070082508A1 (en) * | 2005-10-11 | 2007-04-12 | Chiang Tony P | Methods for discretized processing and process sequence integration of regions of a substrate |
| USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
| US20090011598A1 (en) * | 2007-07-05 | 2009-01-08 | Denso Corporation | Method of manufacturing semiconductor device including silicon carbide substrate |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| US20100176403A1 (en) * | 2009-01-13 | 2010-07-15 | Sumitomo Electric Industries, Ltd. | Silicon carbide substrate, epitaxial wafer and manufacturing method of silicon carbide substrate |
| US20110111593A1 (en) * | 2009-11-09 | 2011-05-12 | Masahiro Kanno | Pattern formation method, pattern formation system, and method for manufacturing semiconductor device |
| USD638382S1 (en) * | 2010-04-09 | 2011-05-24 | Panasonic Electric Works Co., Ltd. | Electroluminescence module |
Non-Patent Citations (7)
| Title |
|---|
| U.S. Appl. No. 29/379,460, Nov. 19, 2010, Taro Nishiguchi et al. |
| U.S. Appl. No. 29/379,485, Nov. 19, 2010, Taro Nishiguchi et al. |
| U.S. Appl. No. 29/379,488, Nov. 19, 2010, Taro Nishiguchi et al. |
| U.S. Notice of Allowance dated Aug. 3, 2011, issued in U.S. Appl. No. 29/379,485. |
| U.S. Notice of Allowance dated Aug. 30, 2011, issued in U.S. Appl. No. 29/379,485. |
| U.S. Notice of Allowance dated Jul. 25, 2011, issued in U.S. Appl. No. 29/379,460. |
| U.S. Office Action dated Jul. 22, 2011, issued in U.S. Appl. No. 29/379,488. |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD690672S1 (en) * | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
| USD700440S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD700441S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| USD839220S1 (en) | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
| USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
| USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
| USD784937S1 (en) | 2014-11-13 | 2017-04-25 | Tokyo Electron Limited | Dummy wafer |
| USD785576S1 (en) | 2014-11-13 | 2017-05-02 | Tokyo Electron Limited | Dummy wafer |
| USD786810S1 (en) * | 2014-11-13 | 2017-05-16 | Tokyo Electron Limited | Dummy wafer |
| USD852958S1 (en) | 2014-12-16 | 2019-07-02 | Hamamatsu Photonics K.K. | Radiation image conversion plate |
| USD806249S1 (en) * | 2014-12-16 | 2017-12-26 | Hamamatsu Photonics K.K. | Radiation image conversion plate |
| USD791091S1 (en) * | 2015-12-28 | 2017-07-04 | Hitachi Kokusai Electric Inc. | Pattern wafer |
| USD789311S1 (en) * | 2015-12-28 | 2017-06-13 | Hitachi Kokusai Electric Inc. | Pattern wafer |
| USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| USD808664S1 (en) | 2016-05-16 | 2018-01-30 | Ninja Brand Incorporated | Sheet with camouflage pattern |
| USD947800S1 (en) * | 2018-07-23 | 2022-04-05 | CACI, Inc.—Federal | Integrated module |
| US11333677B2 (en) | 2018-07-23 | 2022-05-17 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using heuristic models |
| US11662698B2 (en) | 2018-07-23 | 2023-05-30 | CACI, Inc.—Federal | Methods and apparatuses for detecting tamper using machine learning models |
| US11747775B2 (en) | 2018-07-23 | 2023-09-05 | CACI, Inc.—Federal | Integrated tamper detection system and methods |
Also Published As
| Publication number | Publication date |
|---|---|
| CA138031S (en) | 2011-11-17 |
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