USD655256S1 - Semiconductor substrate - Google Patents

Semiconductor substrate Download PDF

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Publication number
USD655256S1
USD655256S1 US29/379,471 US37947110F USD655256S US D655256 S1 USD655256 S1 US D655256S1 US 37947110 F US37947110 F US 37947110F US D655256 S USD655256 S US D655256S
Authority
US
United States
Prior art keywords
semiconductor substrate
view
partially enlarged
mirror image
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/379,471
Inventor
Taro Nishiguchi
Makoto Sasaki
Shin Harada
Shinsuke Fujiwara
Yasuo Namikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAMIKAWA, YASUO, HARADA, SHIN, FUJIWARA, SHINSUKE, NISHIGUCHI, TARO, SASAKI, MAKOTO
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Publication of USD655256S1 publication Critical patent/USD655256S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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FIG. 1 is a front, right, and top perspective view of a semiconductor substrate showing our new design;
FIG. 2 is a front view thereof, a rear view being a mirror image thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right-side view thereof, a left side view being a mirror image thereof;
FIG. 6 is a partially enlarged view at 6 shown in FIG. 2 thereof;
FIG. 7 is a partially enlarged view at 7 shown in FIG. 2 thereof;
FIG. 8 is an enlarged cross sectional view at 8-8 shown in FIG. 3 thereof; and,
FIG. 9 is a partially enlarged sectional view at 9 shown in FIG. 8 thereof.
The broken line showing of the semiconductor substrate is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor substrate, as shown and described.
US29/379,471 2010-08-17 2010-11-19 Semiconductor substrate Expired - Lifetime USD655256S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2010-019916 2010-08-17
JP2010019916 2010-08-17

Publications (1)

Publication Number Publication Date
USD655256S1 true USD655256S1 (en) 2012-03-06

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US29/379,471 Expired - Lifetime USD655256S1 (en) 2010-08-17 2010-11-19 Semiconductor substrate

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US (1) USD655256S1 (en)
CA (1) CA138031S (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD690672S1 (en) * 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD700440S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
USD700441S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD789311S1 (en) * 2015-12-28 2017-06-13 Hitachi Kokusai Electric Inc. Pattern wafer
USD791091S1 (en) * 2015-12-28 2017-07-04 Hitachi Kokusai Electric Inc. Pattern wafer
USD806249S1 (en) * 2014-12-16 2017-12-26 Hamamatsu Photonics K.K. Radiation image conversion plate
USD808664S1 (en) 2016-05-16 2018-01-30 Ninja Brand Incorporated Sheet with camouflage pattern
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module

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USD262962S (en) * 1978-11-03 1982-02-09 Strumpell Winton C Silicon wafer emitter electrode configuration
US4630093A (en) * 1983-11-24 1986-12-16 Sumitomo Electric Industries, Ltd. Wafer of semiconductors
US5182233A (en) * 1989-08-02 1993-01-26 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
US20050106839A1 (en) * 2001-07-24 2005-05-19 Seiko Epson Corporation Transfer method, method of manufacturing thin film devices, method of maufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance
US6927416B2 (en) * 2002-12-26 2005-08-09 Disco Corporation Wafer support plate
JP2005260154A (en) 2004-03-15 2005-09-22 Tokyo Seimitsu Co Ltd Method of manufacturing chip
US20050287846A1 (en) * 2004-06-29 2005-12-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit, and element substrate
US20060038182A1 (en) * 2004-06-04 2006-02-23 The Board Of Trustees Of The University Stretchable semiconductor elements and stretchable electrical circuits
US20060091402A1 (en) * 2004-10-29 2006-05-04 Sixon Ltd. Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal
US7112952B2 (en) * 2004-01-30 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Inspection system, inspection method, and method for manufacturing semiconductor device
US20070082508A1 (en) * 2005-10-11 2007-04-12 Chiang Tony P Methods for discretized processing and process sequence integration of regions of a substrate
US7205639B2 (en) * 2005-03-09 2007-04-17 Infineon Technologies Ag Semiconductor devices with rotated substrates and methods of manufacture thereof
US20090011598A1 (en) * 2007-07-05 2009-01-08 Denso Corporation Method of manufacturing semiconductor device including silicon carbide substrate
US7476575B2 (en) * 2004-06-24 2009-01-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US7705430B2 (en) * 2005-04-27 2010-04-27 Disco Corporation Semiconductor wafer and processing method for same
US20100176403A1 (en) * 2009-01-13 2010-07-15 Sumitomo Electric Industries, Ltd. Silicon carbide substrate, epitaxial wafer and manufacturing method of silicon carbide substrate
US20110111593A1 (en) * 2009-11-09 2011-05-12 Masahiro Kanno Pattern formation method, pattern formation system, and method for manufacturing semiconductor device
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD262962S (en) * 1978-11-03 1982-02-09 Strumpell Winton C Silicon wafer emitter electrode configuration
US4630093A (en) * 1983-11-24 1986-12-16 Sumitomo Electric Industries, Ltd. Wafer of semiconductors
US5182233A (en) * 1989-08-02 1993-01-26 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
US20050106839A1 (en) * 2001-07-24 2005-05-19 Seiko Epson Corporation Transfer method, method of manufacturing thin film devices, method of maufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance
US6927416B2 (en) * 2002-12-26 2005-08-09 Disco Corporation Wafer support plate
US7112952B2 (en) * 2004-01-30 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Inspection system, inspection method, and method for manufacturing semiconductor device
JP2005260154A (en) 2004-03-15 2005-09-22 Tokyo Seimitsu Co Ltd Method of manufacturing chip
US20060038182A1 (en) * 2004-06-04 2006-02-23 The Board Of Trustees Of The University Stretchable semiconductor elements and stretchable electrical circuits
US7476575B2 (en) * 2004-06-24 2009-01-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit
US20050287846A1 (en) * 2004-06-29 2005-12-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit, and element substrate
US20060091402A1 (en) * 2004-10-29 2006-05-04 Sixon Ltd. Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal
US7205639B2 (en) * 2005-03-09 2007-04-17 Infineon Technologies Ag Semiconductor devices with rotated substrates and methods of manufacture thereof
US7705430B2 (en) * 2005-04-27 2010-04-27 Disco Corporation Semiconductor wafer and processing method for same
US20070082508A1 (en) * 2005-10-11 2007-04-12 Chiang Tony P Methods for discretized processing and process sequence integration of regions of a substrate
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US20090011598A1 (en) * 2007-07-05 2009-01-08 Denso Corporation Method of manufacturing semiconductor device including silicon carbide substrate
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US20100176403A1 (en) * 2009-01-13 2010-07-15 Sumitomo Electric Industries, Ltd. Silicon carbide substrate, epitaxial wafer and manufacturing method of silicon carbide substrate
US20110111593A1 (en) * 2009-11-09 2011-05-12 Masahiro Kanno Pattern formation method, pattern formation system, and method for manufacturing semiconductor device
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/379,460, Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Appl. No. 29/379,485, Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Appl. No. 29/379,488, Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Notice of Allowance dated Aug. 3, 2011, issued in U.S. Appl. No. 29/379,485.
U.S. Notice of Allowance dated Aug. 30, 2011, issued in U.S. Appl. No. 29/379,485.
U.S. Notice of Allowance dated Jul. 25, 2011, issued in U.S. Appl. No. 29/379,460.
U.S. Office Action dated Jul. 22, 2011, issued in U.S. Appl. No. 29/379,488.

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD690672S1 (en) * 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
USD700440S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
USD700441S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD839220S1 (en) 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD852958S1 (en) 2014-12-16 2019-07-02 Hamamatsu Photonics K.K. Radiation image conversion plate
USD806249S1 (en) * 2014-12-16 2017-12-26 Hamamatsu Photonics K.K. Radiation image conversion plate
USD791091S1 (en) * 2015-12-28 2017-07-04 Hitachi Kokusai Electric Inc. Pattern wafer
USD789311S1 (en) * 2015-12-28 2017-06-13 Hitachi Kokusai Electric Inc. Pattern wafer
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD808664S1 (en) 2016-05-16 2018-01-30 Ninja Brand Incorporated Sheet with camouflage pattern
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
US11333677B2 (en) 2018-07-23 2022-05-17 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using heuristic models
US11662698B2 (en) 2018-07-23 2023-05-30 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using machine learning models
US11747775B2 (en) 2018-07-23 2023-09-05 CACI, Inc.—Federal Integrated tamper detection system and methods

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