USD650343S1 - Multiple configuration light emitting device package - Google Patents

Multiple configuration light emitting device package Download PDF

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Publication number
USD650343S1
USD650343S1 US29/384,476 US201129384476F USD650343S US D650343 S1 USD650343 S1 US D650343S1 US 201129384476 F US201129384476 F US 201129384476F US D650343 S USD650343 S US D650343S
Authority
US
United States
Prior art keywords
light emitting
emitting device
device package
multiple configuration
configuration light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/384,476
Inventor
Peter S. Andrews
Raymond Rosado
Michael P. Laughner
David T. Emerson
Jeffrey C. Britt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/384,476 priority Critical patent/USD650343S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EMERSON, DAVID T., ANDREWS, PETER S., BRITT, JEFFREY C., LAUGHNER, MICHAEL P., ROSADO, RAYMOND
Priority to TW100303944F priority patent/TWD148141S/en
Priority to TW100303945F priority patent/TWD148142S/en
Application granted granted Critical
Publication of USD650343S1 publication Critical patent/USD650343S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Assigned to SMART MODULAR TECHNOLOGIES, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, CREELED, INC., SMART EMBEDDED COMPUTING, INC. reassignment SMART MODULAR TECHNOLOGIES, INC. RELEASE OF PATENT SECURITY INTEREST RECORDED AT R/F 058983/0001 Assignors: CITIZENS BANK, N.A.
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. PATENT SECURITY AGREEMENT Assignors: CREELED, INC., PENGUIN COMPUTING, INC., PENGUIN SOLUTIONS CORPORATION (DE), SMART EMBEDDED COMPUTING, INC., SMART HIGH RELIABILITY SOLUTIONS LLC, SMART MODULAR TECHNOLOGIES, INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a light emitting diode (LED) package showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a first side view thereof, the opposing side being a mirror image of that shown;
FIG. 4 is a second side view thereof;
FIG. 5 is a third side view thereof;
FIG. 6 is a bottom view thereof;
FIG. 7 is a perspective view of a second embodiment of LED package showing our design;
FIG. 8 is a top view thereof;
FIG. 9 is a first side view thereof, the opposing side being a mirror image of that shown;
FIG. 10 is a second side view thereof;
FIG. 11 is a third side view thereof; and,
FIG. 12 is a bottom view thereof.
The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims (1)

  1. The ornamental design for a multiple configuration light emitting device package, as shown and described.
US29/384,476 2011-01-31 2011-01-31 Multiple configuration light emitting device package Expired - Lifetime USD650343S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/384,476 USD650343S1 (en) 2011-01-31 2011-01-31 Multiple configuration light emitting device package
TW100303944F TWD148141S (en) 2011-01-31 2011-07-29 Multiple configuration light emitting device package
TW100303945F TWD148142S (en) 2011-01-31 2011-07-29 Multiple configuration light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/384,476 USD650343S1 (en) 2011-01-31 2011-01-31 Multiple configuration light emitting device package

Publications (1)

Publication Number Publication Date
USD650343S1 true USD650343S1 (en) 2011-12-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/384,476 Expired - Lifetime USD650343S1 (en) 2011-01-31 2011-01-31 Multiple configuration light emitting device package

Country Status (2)

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US (1) USD650343S1 (en)
TW (2) TWD148142S (en)

Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD673126S1 (en) * 2011-07-08 2012-12-25 Cree, Inc. LED chip
USD674359S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674360S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674357S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674358S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674362S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674363S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674757S1 (en) * 2011-10-31 2013-01-22 Silitek Electronics (Guangzhou) Co., Ltd. Package carrier of light emitting diode
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
USD681573S1 (en) * 2006-08-09 2013-05-07 Cree, Inc. Lamp package
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD698323S1 (en) * 2010-07-30 2014-01-28 Nichia Corporation Light emitting diode
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD703348S1 (en) 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD703624S1 (en) * 2012-04-06 2014-04-29 Cree, Inc. LED-array package
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
USD711841S1 (en) * 2012-08-23 2014-08-26 Cree, Inc. Light emitting diode (LED) package
USD712849S1 (en) 2012-05-14 2014-09-09 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
USD713804S1 (en) 2012-05-14 2014-09-23 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD879787S1 (en) * 2017-11-21 2020-03-31 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD880484S1 (en) * 2018-04-26 2020-04-07 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD892066S1 (en) * 2014-12-11 2020-08-04 Cree, Inc. LED package
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD996377S1 (en) * 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods
USD1102268S1 (en) * 2024-06-12 2025-11-18 Creeled, Inc. Light-emitting diode package

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100140634A1 (en) * 2009-11-09 2010-06-10 Cree Led Lighting Solutions, Inc. Solid state emitter package including red and blue emitters
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
USD637565S1 (en) * 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
US20110127912A1 (en) * 2009-11-30 2011-06-02 Young Jin Lee Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
USD615504S1 (en) * 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US20100252851A1 (en) * 2007-10-31 2010-10-07 Cree, Inc. Led package with increased feature sizes
US20100140634A1 (en) * 2009-11-09 2010-06-10 Cree Led Lighting Solutions, Inc. Solid state emitter package including red and blue emitters
US20110127912A1 (en) * 2009-11-30 2011-06-02 Young Jin Lee Led package, led package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
US20110062482A1 (en) * 2010-01-20 2011-03-17 Bridgelux, Inc. Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces
USD631020S1 (en) * 2010-04-29 2011-01-18 Edison Opto Corporation LED package
USD637565S1 (en) * 2010-11-02 2011-05-10 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode

Cited By (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD681573S1 (en) * 2006-08-09 2013-05-07 Cree, Inc. Lamp package
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
USD698323S1 (en) * 2010-07-30 2014-01-28 Nichia Corporation Light emitting diode
US9627361B2 (en) 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
USD658139S1 (en) * 2011-01-31 2012-04-24 Cree, Inc. High-density emitter package
USD660257S1 (en) * 2011-01-31 2012-05-22 Cree, Inc. Emitter package
USD673126S1 (en) * 2011-07-08 2012-12-25 Cree, Inc. LED chip
USD689031S1 (en) 2011-07-08 2013-09-03 Cree, Inc. LED chip
USD691973S1 (en) * 2011-07-08 2013-10-22 Cree, Inc. Lamp packages
USD674757S1 (en) * 2011-10-31 2013-01-22 Silitek Electronics (Guangzhou) Co., Ltd. Package carrier of light emitting diode
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
USD675169S1 (en) * 2011-12-13 2013-01-29 Lextar Electronics Corp. Multi-chip LED
USD674363S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674362S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674359S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674360S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674357S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674358S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD704154S1 (en) * 2012-04-06 2014-05-06 Cree, Inc. Light emitter package
USD703624S1 (en) * 2012-04-06 2014-04-29 Cree, Inc. LED-array package
USD712849S1 (en) 2012-05-14 2014-09-09 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
USD713804S1 (en) 2012-05-14 2014-09-23 Cree, Inc. Light emitting diode (LED) package with multiple anodes and cathodes
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD693317S1 (en) * 2012-05-29 2013-11-12 Kabushiki Kaisha Toshiba Light-emitting diode
USD698741S1 (en) * 2012-05-29 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
USD709464S1 (en) * 2012-05-31 2014-07-22 Cree, Inc. Light emitting diode (LED) package
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD703348S1 (en) 2012-07-09 2014-04-22 Cree, Inc. Lamp package
USD711841S1 (en) * 2012-08-23 2014-08-26 Cree, Inc. Light emitting diode (LED) package
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
USD735683S1 (en) * 2013-05-03 2015-08-04 Cree, Inc. LED package
USD718725S1 (en) * 2013-08-01 2014-12-02 Cree, Inc. LED package with encapsulant
USD758976S1 (en) * 2013-08-08 2016-06-14 Cree, Inc. LED package
USD746240S1 (en) * 2013-12-30 2015-12-29 Cree, Inc. LED package
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD892066S1 (en) * 2014-12-11 2020-08-04 Cree, Inc. LED package
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD790487S1 (en) * 2015-04-02 2017-06-27 Genesis Photonics Inc. Light emitting diode package substrate
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
USD879787S1 (en) * 2017-11-21 2020-03-31 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD880484S1 (en) * 2018-04-26 2020-04-07 Hangzhou Chipjet Technology Co., Ltd. Data processing equipment
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package
USD996377S1 (en) * 2022-02-17 2023-08-22 Creeled, Inc. Light-emitting diode package
USD1036711S1 (en) 2022-02-17 2024-07-23 Creeled, Inc. Light-emitting diode package
USD1060278S1 (en) 2022-03-09 2025-02-04 Creeled, Inc. Light-emitting diode package
US12355013B2 (en) 2022-04-21 2025-07-08 Creeled, Inc. Emission height arrangements in light-emitting diode packages and related devices and methods
USD1102268S1 (en) * 2024-06-12 2025-11-18 Creeled, Inc. Light-emitting diode package

Also Published As

Publication number Publication date
TWD148142S (en) 2012-07-11
TWD148141S (en) 2012-07-11

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