USD615937S1 - Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers - Google Patents
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers Download PDFInfo
- Publication number
- USD615937S1 USD615937S1 US29/342,851 US34285109F USD615937S US D615937 S1 USD615937 S1 US D615937S1 US 34285109 F US34285109 F US 34285109F US D615937 S USD615937 S US D615937S
- Authority
- US
- United States
- Prior art keywords
- semiconductor wafers
- manufacturing semiconductor
- insulating cylinder
- radiation fin
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 230000005855 radiation Effects 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 title claims description 3
- 235000012431 wafers Nutrition 0.000 title claims description 3
Images
Description
Claims (1)
- The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-004986 | 2009-03-06 | ||
JP2009004986 | 2009-03-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD615937S1 true USD615937S1 (en) | 2010-05-18 |
Family
ID=42167005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/342,851 Expired - Lifetime USD615937S1 (en) | 2009-03-06 | 2009-09-02 | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
Country Status (2)
Country | Link |
---|---|
US (1) | USD615937S1 (en) |
TW (1) | TWD137194S1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
USD798250S1 (en) * | 2015-12-01 | 2017-09-26 | Nuflare Technology, Inc. | Heater |
USD918848S1 (en) * | 2019-07-18 | 2021-05-11 | Kokusai Electric Corporation | Retainer of ceiling heater for semiconductor fabrication apparatus |
USD981972S1 (en) * | 2021-03-22 | 2023-03-28 | Kokusai Electric Corporation | Adiabatic plate for substrate processing appratus |
USD1042372S1 (en) * | 2022-09-26 | 2024-09-17 | Poynting Antennas (Pty) Limited | Heat sink |
-
2009
- 2009-09-02 US US29/342,851 patent/USD615937S1/en not_active Expired - Lifetime
- 2009-09-04 TW TW098304189F patent/TWD137194S1/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
USD798250S1 (en) * | 2015-12-01 | 2017-09-26 | Nuflare Technology, Inc. | Heater |
USD918848S1 (en) * | 2019-07-18 | 2021-05-11 | Kokusai Electric Corporation | Retainer of ceiling heater for semiconductor fabrication apparatus |
USD981972S1 (en) * | 2021-03-22 | 2023-03-28 | Kokusai Electric Corporation | Adiabatic plate for substrate processing appratus |
USD1042372S1 (en) * | 2022-09-26 | 2024-09-17 | Poynting Antennas (Pty) Limited | Heat sink |
Also Published As
Publication number | Publication date |
---|---|
TWD137194S1 (en) | 2010-10-01 |
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