USD589003S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD589003S1
USD589003S1 US29/300,058 US30005808F USD589003S US D589003 S1 USD589003 S1 US D589003S1 US 30005808 F US30005808 F US 30005808F US D589003 S USD589003 S US D589003S
Authority
US
United States
Prior art keywords
heat sink
view
ornamental design
elevational view
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/300,058
Inventor
Yu-Hung Huang
Chun-Yang Hung
Sung-Ching Ho
Wen-Tsao Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to US29/300,058 priority Critical patent/USD589003S1/en
Assigned to DELTA ELECTRONICS INC. reassignment DELTA ELECTRONICS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HO, SUNG-CHING, HUANG, YU-HUNG, HUNG, CHUN-YANG, LEE, WEN-TSAO
Application granted granted Critical
Publication of USD589003S1 publication Critical patent/USD589003S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a heat sink showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink, as shown and described herein.
US29/300,058 2008-02-15 2008-02-15 Heat sink Expired - Lifetime USD589003S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/300,058 USD589003S1 (en) 2008-02-15 2008-02-15 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/300,058 USD589003S1 (en) 2008-02-15 2008-02-15 Heat sink

Publications (1)

Publication Number Publication Date
USD589003S1 true USD589003S1 (en) 2009-03-24

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ID=40457591

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/300,058 Expired - Lifetime USD589003S1 (en) 2008-02-15 2008-02-15 Heat sink

Country Status (1)

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US (1) USD589003S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD715748S1 (en) * 2013-11-26 2014-10-21 Heatscape, Inc. Inverted floating core heat sink
US20150296662A1 (en) * 2014-04-10 2015-10-15 Advanced Thermal Solutions, Inc. Multiple Flow Entrance Heat sink
USD849991S1 (en) * 2017-03-27 2019-05-28 Alejandro Piedra Chandelier

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD376132S (en) * 1995-12-27 1996-12-03 Orton Kevin R Heatsink-outfitted speed controller housing
US5986888A (en) * 1997-06-09 1999-11-16 Power Trends, Inc. Heat sink for auxiliary circuit board
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
US6735084B1 (en) * 2002-11-01 2004-05-11 Samsung Electronics Co., Ltd. Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink
US6894900B2 (en) * 2002-09-17 2005-05-17 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe and base fins
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
US7227752B2 (en) * 2005-05-23 2007-06-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD376132S (en) * 1995-12-27 1996-12-03 Orton Kevin R Heatsink-outfitted speed controller housing
US5986888A (en) * 1997-06-09 1999-11-16 Power Trends, Inc. Heat sink for auxiliary circuit board
US20040035558A1 (en) * 2002-06-14 2004-02-26 Todd John J. Heat dissipation tower for circuit devices
US6894900B2 (en) * 2002-09-17 2005-05-17 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe and base fins
US6735084B1 (en) * 2002-11-01 2004-05-11 Samsung Electronics Co., Ltd. Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
US7227752B2 (en) * 2005-05-23 2007-06-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD715748S1 (en) * 2013-11-26 2014-10-21 Heatscape, Inc. Inverted floating core heat sink
US20150296662A1 (en) * 2014-04-10 2015-10-15 Advanced Thermal Solutions, Inc. Multiple Flow Entrance Heat sink
US10692798B2 (en) * 2014-04-10 2020-06-23 Advanced Thermal Solutions, Inc. Multiple flow entrance heat sink
USD849991S1 (en) * 2017-03-27 2019-05-28 Alejandro Piedra Chandelier

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