USD574339S1 - Pattern formed on the ground layer of a multilayer printed circuit board - Google Patents

Pattern formed on the ground layer of a multilayer printed circuit board Download PDF

Info

Publication number
USD574339S1
USD574339S1 US29/245,352 US24535205F USD574339S US D574339 S1 USD574339 S1 US D574339S1 US 24535205 F US24535205 F US 24535205F US D574339 S USD574339 S US D574339S
Authority
US
United States
Prior art keywords
circuit board
printed circuit
pattern formed
ground layer
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/245,352
Inventor
Mitsuru Honjo
Hiroshi Yamazaki
Toshiki Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Assigned to NITTO DENKO CORPORATION reassignment NITTO DENKO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HONJO, MITSURU, NAITO, TOSHIKI, YAMAZAKI, HIROSHI
Application granted granted Critical
Publication of USD574339S1 publication Critical patent/USD574339S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 shows a front view of the design according to a first embodiment of the present invention.
FIG. 2 shows a back view of the design according to a first embodiment of the present invention.
FIG. 3 shows a top plan view of the design according to a first embodiment of the present invention.
FIG. 4 shows a bottom plan view of the design according to a first embodiment of the present invention.
FIG. 5 shows a left side view of the design according to a first embodiment of the present invention.
FIG. 6 shows a right side view of the design according to a first embodiment of the present invention.
FIG. 7 shows a partial view of FIG. 1 corresponding to the area indicated by the dashed box in FIG. 1.
FIG. 8 shows a detailed view of an enlarged portion of FIG. 7 indicated by the dashed box in FIG. 7.
FIG. 9 shows a sectional view along the line 9—9 indicated in FIG. 7.
FIG. 10 shows a front plan view of the design according to a second embodiment of the present invention. In this embodiment, the ground layer is transparent.
FIG. 11 shows a back view of the design according to a second embodiment of the present invention.
FIG. 12 shows a top plan view of the design according to a second embodiment of the present invention.
FIG. 13 shows a bottom plan view of the design according to a second embodiment of the present invention.
FIG. 14 shows a right side view of the design according to a second embodiment of the present invention.
FIG. 15 shows a left side view of the design according to a second embodiment of the present invention.
FIG. 16 shows a partial view of FIG. 11 corresponding to the area indicated by the dashed box in FIG. 11.
FIG. 17 shows a detailed view of an enlarged portion of FIG. 17 indicated by the dashed box in FIG. 17; and,
FIG. 18 shows a sectional view along the line 19—19 indicated in FIG. 17.
The broken lines represent unclaimed subject matter.

Claims (1)

  1. The ornamental design for a pattern formed on the ground layer of a multilayer printed circuit board, as shown and described.
US29/245,352 2005-06-24 2005-12-22 Pattern formed on the ground layer of a multilayer printed circuit board Expired - Lifetime USD574339S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005018349 2005-06-24
JP2005018348 2005-06-24

Publications (1)

Publication Number Publication Date
USD574339S1 true USD574339S1 (en) 2008-08-05

Family

ID=39671125

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/245,352 Expired - Lifetime USD574339S1 (en) 2005-06-24 2005-12-22 Pattern formed on the ground layer of a multilayer printed circuit board

Country Status (1)

Country Link
US (1) USD574339S1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130015234A1 (en) * 2010-06-11 2013-01-17 Global Unichip Corp. Method of Forming a Package Substrate
USD737230S1 (en) 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD739363S1 (en) * 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
US10677538B2 (en) 2018-01-05 2020-06-09 Baltimore Aircoil Company Indirect heat exchanger
USD889420S1 (en) * 2018-01-05 2020-07-07 Baltimore Aircoil Company, Inc. Heat exchanger cassette
USD949136S1 (en) * 2020-09-21 2022-04-19 Comcast Cable Communications, Llc Gateway
USD949134S1 (en) * 2020-09-21 2022-04-19 Comcast Cable Communications, Llc Gateway
USD962211S1 (en) * 2020-04-20 2022-08-30 Comcast Cable Communications, Llc Gateway

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130015234A1 (en) * 2010-06-11 2013-01-17 Global Unichip Corp. Method of Forming a Package Substrate
US9449909B2 (en) * 2010-06-11 2016-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a package substrate
USD737230S1 (en) 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD737229S1 (en) 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD739363S1 (en) * 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD743356S1 (en) * 2011-06-17 2015-11-17 Soraa, Inc. Diamond-shaped semiconductor die
USD803171S1 (en) * 2011-06-17 2017-11-21 Soraa, Inc. Array of triangular semiconductor dies
US10677538B2 (en) 2018-01-05 2020-06-09 Baltimore Aircoil Company Indirect heat exchanger
USD889420S1 (en) * 2018-01-05 2020-07-07 Baltimore Aircoil Company, Inc. Heat exchanger cassette
USD962211S1 (en) * 2020-04-20 2022-08-30 Comcast Cable Communications, Llc Gateway
USD949136S1 (en) * 2020-09-21 2022-04-19 Comcast Cable Communications, Llc Gateway
USD949134S1 (en) * 2020-09-21 2022-04-19 Comcast Cable Communications, Llc Gateway

Similar Documents

Publication Publication Date Title
USD574339S1 (en) Pattern formed on the ground layer of a multilayer printed circuit board
USD552048S1 (en) Printed circuit board
USD570300S1 (en) Push button for electronic circuit
USD665774S1 (en) Electronic device
USD602486S1 (en) Electronic device
USD602014S1 (en) Electronic device
USD604297S1 (en) Electronic device
USD578154S1 (en) Electronic copying machine
USD594062S1 (en) Display board
USD577025S1 (en) Controller for electronic game machine
USD586346S1 (en) Electronic data key
USD571365S1 (en) Portion of a housing for an electronic device
USD601978S1 (en) Printed circuit board
USD576577S1 (en) Portion of a printed circuit board
USD605627S1 (en) Electronic device
CA110757S (en) Edge board member
USD570307S1 (en) Portion of a printed circuit board
USD503745S1 (en) Mask for a display unit and display unit for an electronic display board
USD577691S1 (en) Grooves formed around a semiconductor device on a circuit board
USD553586S1 (en) Electronic module
USD621773S1 (en) Motorcycle steering stabilizer
USD884531S1 (en) Spectrometer having a flexible printed circuit
USD602886S1 (en) Shield design
USD612816S1 (en) Switch
USD584249S1 (en) Grooves formed around a semiconductor device on a circuit board