USD585394S1 - Groove formed around a semiconductor device on a circuit board - Google Patents

Groove formed around a semiconductor device on a circuit board Download PDF

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Publication number
USD585394S1
USD585394S1 US29/306,335 US30633508F USD585394S US D585394 S1 USD585394 S1 US D585394S1 US 30633508 F US30633508 F US 30633508F US D585394 S USD585394 S US D585394S
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US
United States
Prior art keywords
circuit board
semiconductor device
groove formed
formed around
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/306,335
Inventor
Tetsuya Ohsawa
Emiko TANI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to US29/306,335 priority Critical patent/USD585394S1/en
Application granted granted Critical
Publication of USD585394S1 publication Critical patent/USD585394S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;
FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1; and,
FIG. 3 shows an enlarged sectional view along the line 33 in FIG. 2.
The broken lines represent unclaimed subject matter.

Claims (1)

  1. The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.
US29/306,335 2005-04-13 2008-04-07 Groove formed around a semiconductor device on a circuit board Expired - Lifetime USD585394S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/306,335 USD585394S1 (en) 2005-04-13 2008-04-07 Groove formed around a semiconductor device on a circuit board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005010971 2005-04-13
JP2005010989 2005-04-13
US29/240,252 USD568836S1 (en) 2005-04-13 2005-10-11 Groove formed around a semiconductor device on a circuit board
US29/306,335 USD585394S1 (en) 2005-04-13 2008-04-07 Groove formed around a semiconductor device on a circuit board

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/240,252 Division USD568836S1 (en) 2005-04-13 2005-10-11 Groove formed around a semiconductor device on a circuit board

Publications (1)

Publication Number Publication Date
USD585394S1 true USD585394S1 (en) 2009-01-27

Family

ID=39362045

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/240,252 Expired - Lifetime USD568836S1 (en) 2005-04-13 2005-10-11 Groove formed around a semiconductor device on a circuit board
US29/306,335 Expired - Lifetime USD585394S1 (en) 2005-04-13 2008-04-07 Groove formed around a semiconductor device on a circuit board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/240,252 Expired - Lifetime USD568836S1 (en) 2005-04-13 2005-10-11 Groove formed around a semiconductor device on a circuit board

Country Status (1)

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US (2) USD568836S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD877739S1 (en) * 2017-09-15 2020-03-10 uQontrol, Inc. Smartcard with Q-shaped contact pad

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD877739S1 (en) * 2017-09-15 2020-03-10 uQontrol, Inc. Smartcard with Q-shaped contact pad

Also Published As

Publication number Publication date
USD568836S1 (en) 2008-05-13

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