USD566057S1 - LED chip - Google Patents

LED chip Download PDF

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Publication number
USD566057S1
USD566057S1 US29/275,362 US27536206F USD566057S US D566057 S1 USD566057 S1 US D566057S1 US 27536206 F US27536206 F US 27536206F US D566057 S USD566057 S US D566057S
Authority
US
United States
Prior art keywords
led chip
view
ornamental design
led
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/275,362
Inventor
John Edmond
James Ibbetson
Michael John Bergmann
Amber Christine Salter
David Todd Emerson
Kevin Haberern
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CreeLED Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to US29/275,362 priority Critical patent/USD566057S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IBBETSON, JAMES, EDMOND, JOHN, BERGMANN, MICHAEL JOHN, HABERERN, KEVIN, SALTER, AMBER CHRISTINE, EMERSON, DAVID TODD
Application granted granted Critical
Publication of USD566057S1 publication Critical patent/USD566057S1/en
Assigned to CREE LED, INC. reassignment CREE LED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top perspective view of a LED chip showing our design;
FIG. 2 is a top view thereof;
FIG. 3 is a first side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a different side view thereof;
FIG. 6 is an end view thereof; and,
FIG. 7 is an opposing end view thereof.

Claims (1)

  1. The ornamental design for an LED chip, as shown and described.
US29/275,362 2006-12-21 2006-12-21 LED chip Expired - Lifetime USD566057S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/275,362 USD566057S1 (en) 2006-12-21 2006-12-21 LED chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/275,362 USD566057S1 (en) 2006-12-21 2006-12-21 LED chip

Publications (1)

Publication Number Publication Date
USD566057S1 true USD566057S1 (en) 2008-04-08

Family

ID=39263866

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/275,362 Expired - Lifetime USD566057S1 (en) 2006-12-21 2006-12-21 LED chip

Country Status (1)

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US (1) USD566057S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090050924A1 (en) * 2007-06-11 2009-02-26 Cree, Inc. Droop-free high output light emitting devices and methods of fabricating and operating same
US20100124243A1 (en) * 2008-11-18 2010-05-20 Cree, Inc. Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same
WO2011005733A1 (en) 2009-07-10 2011-01-13 Cree, Inc. Lighting structures including diffuser particles comprising phosphor host materials
US8096671B1 (en) 2009-04-06 2012-01-17 Nmera, Llc Light emitting diode illumination system
US8698184B2 (en) 2011-01-21 2014-04-15 Cree, Inc. Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
US8748905B2 (en) 2008-11-18 2014-06-10 Cree, Inc. High efficacy semiconductor light emitting devices employing remote phosphor configurations
US8853712B2 (en) 2008-11-18 2014-10-07 Cree, Inc. High efficacy semiconductor light emitting devices employing remote phosphor configurations
US9052416B2 (en) 2008-11-18 2015-06-09 Cree, Inc. Ultra-high efficacy semiconductor light emitting devices
US9443903B2 (en) 2006-06-30 2016-09-13 Cree, Inc. Low temperature high strength metal stack for die attachment
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD773410S1 (en) * 2014-10-24 2016-12-06 Epistar Corporation Light-emitting diode array
USD794582S1 (en) * 2016-07-29 2017-08-15 Enraytek Optoelectronics Co., Ltd. LED chip
USD795822S1 (en) * 2016-07-29 2017-08-29 Enraytek Optoelectronics Co., Ltd. LED chip
USD824343S1 (en) * 2016-07-27 2018-07-31 Enraytek Optoelectronics Co., Ltd. LED chip
USD866623S1 (en) * 2017-11-17 2019-11-12 Greenlee Tools, Inc. Die
USD894852S1 (en) * 2018-11-08 2020-09-01 Epistar Corporation Light-emitting diode
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9443903B2 (en) 2006-06-30 2016-09-13 Cree, Inc. Low temperature high strength metal stack for die attachment
US20090050924A1 (en) * 2007-06-11 2009-02-26 Cree, Inc. Droop-free high output light emitting devices and methods of fabricating and operating same
US7843060B2 (en) 2007-06-11 2010-11-30 Cree, Inc. Droop-free high output light emitting devices and methods of fabricating and operating same
US8524515B2 (en) 2007-06-11 2013-09-03 Cree, Inc. Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die
US20110042705A1 (en) * 2007-06-11 2011-02-24 Cree, Inc. Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die
US8362681B2 (en) 2008-11-18 2013-01-29 Cree, Inc. Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes
US20100124243A1 (en) * 2008-11-18 2010-05-20 Cree, Inc. Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same
US8004172B2 (en) 2008-11-18 2011-08-23 Cree, Inc. Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same
US8748905B2 (en) 2008-11-18 2014-06-10 Cree, Inc. High efficacy semiconductor light emitting devices employing remote phosphor configurations
US8853712B2 (en) 2008-11-18 2014-10-07 Cree, Inc. High efficacy semiconductor light emitting devices employing remote phosphor configurations
US9046248B2 (en) 2008-11-18 2015-06-02 Cree, Inc. Semiconductor light emitting apparatus including bulb and screw-type base
US9052416B2 (en) 2008-11-18 2015-06-09 Cree, Inc. Ultra-high efficacy semiconductor light emitting devices
US8096671B1 (en) 2009-04-06 2012-01-17 Nmera, Llc Light emitting diode illumination system
WO2011005733A1 (en) 2009-07-10 2011-01-13 Cree, Inc. Lighting structures including diffuser particles comprising phosphor host materials
US8698184B2 (en) 2011-01-21 2014-04-15 Cree, Inc. Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
USD773410S1 (en) * 2014-10-24 2016-12-06 Epistar Corporation Light-emitting diode array
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD790487S1 (en) * 2015-04-02 2017-06-27 Genesis Photonics Inc. Light emitting diode package substrate
USD824343S1 (en) * 2016-07-27 2018-07-31 Enraytek Optoelectronics Co., Ltd. LED chip
USD794582S1 (en) * 2016-07-29 2017-08-15 Enraytek Optoelectronics Co., Ltd. LED chip
USD795822S1 (en) * 2016-07-29 2017-08-29 Enraytek Optoelectronics Co., Ltd. LED chip
USD866623S1 (en) * 2017-11-17 2019-11-12 Greenlee Tools, Inc. Die
US10576557B2 (en) 2017-11-17 2020-03-03 Greenlee Tools, Inc. Workpiece shearing apparatus
USD878435S1 (en) 2017-11-17 2020-03-17 Greenlee Tools, Inc. Die
US11072029B2 (en) 2017-11-17 2021-07-27 Greenlee Tools, Inc. Assembly for supporting and shearing a workpiece
US11565332B2 (en) 2017-11-17 2023-01-31 Greenlee Tools, Inc. Assembly for supporting and shearing a workpiece
USD1003957S1 (en) 2017-11-17 2023-11-07 Greenlee Tools, Inc. Die for shearing a workpiece
US12036618B2 (en) 2017-11-17 2024-07-16 Greenlee Tools, Inc. Workpiece shearing apparatus
USD894852S1 (en) * 2018-11-08 2020-09-01 Epistar Corporation Light-emitting diode
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD920933S1 (en) 2019-11-04 2021-06-01 Putco, Inc. Surface-mount device

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