USD561124S1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- USD561124S1 USD561124S1 US29/271,911 US27191107F USD561124S US D561124 S1 USD561124 S1 US D561124S1 US 27191107 F US27191107 F US 27191107F US D561124 S USD561124 S US D561124S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- view
- elevational view
- ornamental design
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001125 extrusion Methods 0.000 description 1
Images
Description
Claims (1)
- The ornamental design for a heat sink, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/271,911 USD561124S1 (en) | 2007-01-30 | 2007-01-30 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/271,911 USD561124S1 (en) | 2007-01-30 | 2007-01-30 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD561124S1 true USD561124S1 (en) | 2008-02-05 |
Family
ID=38989205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/271,911 Expired - Lifetime USD561124S1 (en) | 2007-01-30 | 2007-01-30 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD561124S1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070242433A1 (en) * | 2006-04-14 | 2007-10-18 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
| US20080223558A1 (en) * | 2007-03-12 | 2008-09-18 | Nidec Corporation | Cooling device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6407919B1 (en) * | 2000-12-18 | 2002-06-18 | Fargo Chou | Structure of computer CPU heat dissipation module |
| US20020182068A1 (en) * | 2001-05-21 | 2002-12-05 | Ching-Tang Liu | Frame structure for radiator fan |
| USD501450S1 (en) * | 2003-06-10 | 2005-02-01 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| US20050141992A1 (en) * | 2003-12-25 | 2005-06-30 | Fang-Cheng Lin | Fan assembly |
| US20050271506A1 (en) * | 2004-06-03 | 2005-12-08 | Ming-Hui Pan | Supporting frame with locating function |
| US20050280992A1 (en) * | 2001-09-10 | 2005-12-22 | Intel Corporation | Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods |
| US20060067053A1 (en) * | 2004-09-30 | 2006-03-30 | Hon Hai Precision Industry Co., Ltd. | Locking device for heat dissipating device |
| US20060219386A1 (en) * | 2005-04-01 | 2006-10-05 | Delta Electronics, Inc. | Heat dissipating assembly with composite heat dissipating structure |
| US7221567B2 (en) * | 2004-04-12 | 2007-05-22 | Nidec Corporation | Heat sink fan |
-
2007
- 2007-01-30 US US29/271,911 patent/USD561124S1/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6407919B1 (en) * | 2000-12-18 | 2002-06-18 | Fargo Chou | Structure of computer CPU heat dissipation module |
| US20020182068A1 (en) * | 2001-05-21 | 2002-12-05 | Ching-Tang Liu | Frame structure for radiator fan |
| US20050280992A1 (en) * | 2001-09-10 | 2005-12-22 | Intel Corporation | Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods |
| USD501450S1 (en) * | 2003-06-10 | 2005-02-01 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
| US20050141992A1 (en) * | 2003-12-25 | 2005-06-30 | Fang-Cheng Lin | Fan assembly |
| US7221567B2 (en) * | 2004-04-12 | 2007-05-22 | Nidec Corporation | Heat sink fan |
| US20050271506A1 (en) * | 2004-06-03 | 2005-12-08 | Ming-Hui Pan | Supporting frame with locating function |
| US20060067053A1 (en) * | 2004-09-30 | 2006-03-30 | Hon Hai Precision Industry Co., Ltd. | Locking device for heat dissipating device |
| US20060219386A1 (en) * | 2005-04-01 | 2006-10-05 | Delta Electronics, Inc. | Heat dissipating assembly with composite heat dissipating structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070242433A1 (en) * | 2006-04-14 | 2007-10-18 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device |
| US7532472B2 (en) * | 2006-04-14 | 2009-05-12 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
| US20080223558A1 (en) * | 2007-03-12 | 2008-09-18 | Nidec Corporation | Cooling device |
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