USD561120S1 - Heat dissipating module - Google Patents

Heat dissipating module Download PDF

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Publication number
USD561120S1
USD561120S1 US29/266,730 US26673006F USD561120S US D561120 S1 USD561120 S1 US D561120S1 US 26673006 F US26673006 F US 26673006F US D561120 S USD561120 S US D561120S
Authority
US
United States
Prior art keywords
heat dissipating
dissipating module
module
ornamental design
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/266,730
Inventor
Chin-Ming Chen
Yuhsien Lin
Tsung-Lin Chen
Alex Hsia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to US29/266,730 priority Critical patent/USD561120S1/en
Assigned to DELTA ELECTRONICS INC. reassignment DELTA ELECTRONICS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HSIA, ALEX, CHEN, CHIN-MING, CHEN, TSUNG-LIN, LIN, YUHSIEN
Application granted granted Critical
Publication of USD561120S1 publication Critical patent/USD561120S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a heat dissipating module;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a left side elevational view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a heat dissipating module, as shown and described herein.
US29/266,730 2006-09-28 2006-09-28 Heat dissipating module Expired - Lifetime USD561120S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/266,730 USD561120S1 (en) 2006-09-28 2006-09-28 Heat dissipating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/266,730 USD561120S1 (en) 2006-09-28 2006-09-28 Heat dissipating module

Publications (1)

Publication Number Publication Date
USD561120S1 true USD561120S1 (en) 2008-02-05

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ID=38989200

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/266,730 Expired - Lifetime USD561120S1 (en) 2006-09-28 2006-09-28 Heat dissipating module

Country Status (1)

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US (1) USD561120S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070242433A1 (en) * 2006-04-14 2007-10-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20080106869A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device
US20080174967A1 (en) * 2007-01-24 2008-07-24 Foxconn Technology Co., Ltd. Fan bracket and heat dissipation apparatus incorporating the same
USD576567S1 (en) * 2007-02-13 2008-09-09 Nidec Corporation Heat sink fan
USD593042S1 (en) 2008-01-31 2009-05-26 Nidec Corporation Heat sink

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407919B1 (en) * 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module
US20020182068A1 (en) * 2001-05-21 2002-12-05 Ching-Tang Liu Frame structure for radiator fan
USD501450S1 (en) * 2003-06-10 2005-02-01 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US20050141992A1 (en) * 2003-12-25 2005-06-30 Fang-Cheng Lin Fan assembly
US20050271506A1 (en) * 2004-06-03 2005-12-08 Ming-Hui Pan Supporting frame with locating function
US20050280992A1 (en) * 2001-09-10 2005-12-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
US20060067053A1 (en) * 2004-09-30 2006-03-30 Hon Hai Precision Industry Co., Ltd. Locking device for heat dissipating device
US20060219386A1 (en) * 2005-04-01 2006-10-05 Delta Electronics, Inc. Heat dissipating assembly with composite heat dissipating structure
US7221567B2 (en) * 2004-04-12 2007-05-22 Nidec Corporation Heat sink fan

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407919B1 (en) * 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module
US20020182068A1 (en) * 2001-05-21 2002-12-05 Ching-Tang Liu Frame structure for radiator fan
US20050280992A1 (en) * 2001-09-10 2005-12-22 Intel Corporation Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
USD501450S1 (en) * 2003-06-10 2005-02-01 Sanyo Denki Co., Ltd. Electronic component cooling apparatus
US20050141992A1 (en) * 2003-12-25 2005-06-30 Fang-Cheng Lin Fan assembly
US7221567B2 (en) * 2004-04-12 2007-05-22 Nidec Corporation Heat sink fan
US20050271506A1 (en) * 2004-06-03 2005-12-08 Ming-Hui Pan Supporting frame with locating function
US20060067053A1 (en) * 2004-09-30 2006-03-30 Hon Hai Precision Industry Co., Ltd. Locking device for heat dissipating device
US20060219386A1 (en) * 2005-04-01 2006-10-05 Delta Electronics, Inc. Heat dissipating assembly with composite heat dissipating structure

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070242433A1 (en) * 2006-04-14 2007-10-18 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7532472B2 (en) * 2006-04-14 2009-05-12 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20080106869A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device
US7480144B2 (en) * 2006-11-03 2009-01-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20080174967A1 (en) * 2007-01-24 2008-07-24 Foxconn Technology Co., Ltd. Fan bracket and heat dissipation apparatus incorporating the same
US7495921B2 (en) * 2007-01-24 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Fan bracket and heat dissipation apparatus incorporating the same
USD576567S1 (en) * 2007-02-13 2008-09-09 Nidec Corporation Heat sink fan
USD593042S1 (en) 2008-01-31 2009-05-26 Nidec Corporation Heat sink

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