USD513608S1 - Portion of a matrix for surface mount package leadframe - Google Patents

Portion of a matrix for surface mount package leadframe Download PDF

Info

Publication number
USD513608S1
USD513608S1 US29/173,644 US17364403F USD513608S US D513608 S1 USD513608 S1 US D513608S1 US 17364403 F US17364403 F US 17364403F US D513608 S USD513608 S US D513608S
Authority
US
United States
Prior art keywords
matrix
surface mount
mount package
package leadframe
leadframe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/173,644
Inventor
James Harnden
Richard K. Williams
Anthony Chia
Chu Weibing
Allen K. Lam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
Original Assignee
GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/173,644 priority Critical patent/USD513608S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HARNDEN, JAMES, CHIA, ANTHONY, WEIBING, CHU, LAM, ALLEN K., WILLIAMS, RICHARD K.
Application granted granted Critical
Publication of USD513608S1 publication Critical patent/USD513608S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.

Claims (1)

    CLAIM
  1. The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.
US29/173,644 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe Expired - Lifetime USD513608S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/173,644 USD513608S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/173,644 USD513608S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

Publications (1)

Publication Number Publication Date
USD513608S1 true USD513608S1 (en) 2006-01-17

Family

ID=35550946

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/173,644 Expired - Lifetime USD513608S1 (en) 2003-01-03 2003-01-03 Portion of a matrix for surface mount package leadframe

Country Status (1)

Country Link
US (1) USD513608S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD585847S1 (en) * 2006-09-08 2009-02-03 Cree, Inc. LED lighting tile
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
US20130175679A1 (en) * 2007-12-13 2013-07-11 Cheng-Hong Su Optoisolator leadframe assembly
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698074A (en) * 1970-06-29 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US4118859A (en) 1976-12-01 1978-10-10 Amp Incorporated Packaging and assembly of sheet metal parts
US4234666A (en) 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4298883A (en) 1977-04-26 1981-11-03 Tokyo Shibaura Electric Co., Ltd. Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
US4633582A (en) 1985-08-14 1987-01-06 General Instrument Corporation Method for assembling an optoisolator and leadframe therefor
US4809054A (en) 1986-07-25 1989-02-28 Kurt Waldner Semiconductor lead frame
US4818960A (en) 1987-04-06 1989-04-04 Tdk Corporation Composite part and method of manufacturing same
US4852250A (en) 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making
US4865193A (en) 1987-06-23 1989-09-12 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
US5115299A (en) 1989-07-13 1992-05-19 Gte Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
US5554886A (en) 1994-03-30 1996-09-10 Goldstar Electron Co., Ltd. Lead frame and semiconductor package with such lead frame
US5900582A (en) 1992-06-05 1999-05-04 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
US6016918A (en) 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip
US6170151B1 (en) * 1997-03-04 2001-01-09 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
US6265761B1 (en) * 1999-05-07 2001-07-24 Maxim Integrated Products, Inc. Semiconductor devices with improved lead frame structures
US6329710B1 (en) * 1996-09-13 2001-12-11 Micron Technology, Inc. Integrated circuit package electrical enhancement
US6389672B1 (en) * 1996-05-10 2002-05-21 Matsushita Electric Industrial Co., Ltd. Component assembling method and component assembling apparatus
USD461172S1 (en) 2001-07-17 2002-08-06 Gem Services, Inc. Surface mount package
USD461170S1 (en) 2001-05-15 2002-08-06 Gem Services, Inc. Surface mount package
USD461459S1 (en) 2001-07-17 2002-08-13 Gem Services, Inc. Surface mount package
USD461784S1 (en) 2001-07-17 2002-08-20 Gem Services, Inc. Surface mount package
USD461783S1 (en) 2001-06-08 2002-08-20 Gem Services, Inc. Surface mount package
USD462062S1 (en) 2001-05-18 2002-08-27 Gem Services, Inc. Surface mount package
USD465207S1 (en) 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
USD467231S1 (en) 2001-07-17 2002-12-17 Gem Services, Inc. Surface mount package
USD467560S1 (en) 2001-07-17 2002-12-24 Gem Services, Inc. Surface mount package
USD467884S1 (en) 2001-05-15 2002-12-31 Gem Services, Inc. Surface mount package
USD467885S1 (en) 2001-07-18 2002-12-31 Gem Services, Inc. Surface mount package
USD471165S1 (en) 2001-05-15 2003-03-04 Gem Services, Inc. Surface mount package
US6543512B1 (en) * 1998-10-28 2003-04-08 Micron Technology, Inc. Carrier, method and system for handling semiconductor components
US6566740B2 (en) * 2000-03-23 2003-05-20 Mitsui High-Tec, Inc. Lead frame for a semiconductor device and method of manufacturing a semiconductor device
USD483336S1 (en) 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698074A (en) * 1970-06-29 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US4118859A (en) 1976-12-01 1978-10-10 Amp Incorporated Packaging and assembly of sheet metal parts
US4298883A (en) 1977-04-26 1981-11-03 Tokyo Shibaura Electric Co., Ltd. Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet
US4234666A (en) 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4633582A (en) 1985-08-14 1987-01-06 General Instrument Corporation Method for assembling an optoisolator and leadframe therefor
US4809054A (en) 1986-07-25 1989-02-28 Kurt Waldner Semiconductor lead frame
US4818960A (en) 1987-04-06 1989-04-04 Tdk Corporation Composite part and method of manufacturing same
US4865193A (en) 1987-06-23 1989-09-12 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
US4852250A (en) 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making
US5115299A (en) 1989-07-13 1992-05-19 Gte Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
US5900582A (en) 1992-06-05 1999-05-04 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
US5554886A (en) 1994-03-30 1996-09-10 Goldstar Electron Co., Ltd. Lead frame and semiconductor package with such lead frame
US6389672B1 (en) * 1996-05-10 2002-05-21 Matsushita Electric Industrial Co., Ltd. Component assembling method and component assembling apparatus
US6329710B1 (en) * 1996-09-13 2001-12-11 Micron Technology, Inc. Integrated circuit package electrical enhancement
US6170151B1 (en) * 1997-03-04 2001-01-09 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
US6016918A (en) 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip
US6543512B1 (en) * 1998-10-28 2003-04-08 Micron Technology, Inc. Carrier, method and system for handling semiconductor components
US6265761B1 (en) * 1999-05-07 2001-07-24 Maxim Integrated Products, Inc. Semiconductor devices with improved lead frame structures
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
US6566740B2 (en) * 2000-03-23 2003-05-20 Mitsui High-Tec, Inc. Lead frame for a semiconductor device and method of manufacturing a semiconductor device
USD461170S1 (en) 2001-05-15 2002-08-06 Gem Services, Inc. Surface mount package
USD467884S1 (en) 2001-05-15 2002-12-31 Gem Services, Inc. Surface mount package
USD471165S1 (en) 2001-05-15 2003-03-04 Gem Services, Inc. Surface mount package
USD462062S1 (en) 2001-05-18 2002-08-27 Gem Services, Inc. Surface mount package
USD465207S1 (en) 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
USD461783S1 (en) 2001-06-08 2002-08-20 Gem Services, Inc. Surface mount package
USD467231S1 (en) 2001-07-17 2002-12-17 Gem Services, Inc. Surface mount package
USD467560S1 (en) 2001-07-17 2002-12-24 Gem Services, Inc. Surface mount package
USD461784S1 (en) 2001-07-17 2002-08-20 Gem Services, Inc. Surface mount package
USD461459S1 (en) 2001-07-17 2002-08-13 Gem Services, Inc. Surface mount package
USD461172S1 (en) 2001-07-17 2002-08-06 Gem Services, Inc. Surface mount package
USD467885S1 (en) 2001-07-18 2002-12-31 Gem Services, Inc. Surface mount package
USD483336S1 (en) 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD585847S1 (en) * 2006-09-08 2009-02-03 Cree, Inc. LED lighting tile
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
US20130175679A1 (en) * 2007-12-13 2013-07-11 Cheng-Hong Su Optoisolator leadframe assembly
US8853837B2 (en) * 2007-12-13 2014-10-07 Lite-On Electronics (Guangzhou) Limited Optoisolator leadframe assembly
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

Similar Documents

Publication Publication Date Title
USD515701S1 (en) Adhesive patch
USD480811S1 (en) Adhesive patch
USD473911S1 (en) Knife
USD485126S1 (en) Ramekin
USD473641S1 (en) Breast pad
USD455652S1 (en) Package
USD474419S1 (en) Diamond
USD516429S1 (en) Jar
USD499959S1 (en) Bottle
USD495602S1 (en) Molded bottle
USD502952S1 (en) Substrate for manufacturing cutting elements
USD493119S1 (en) Gemstone
USD460611S1 (en) Portion of a shoe upper
USD484858S1 (en) Portion of a matrix for surface mount package leadframe
USD484859S1 (en) Portion of a matrix for surface mount package leadframe
USD513639S1 (en) Adhesive patch
USD492266S1 (en) Portion of a matrix for surface mount package leadframe
USD483336S1 (en) Portion of a matrix for surface mount package leadframe
USD487431S1 (en) Portion of a matrix for surface mount package leadframe
USD488136S1 (en) Portion of a matrix for surface mount package leadframe
USD484104S1 (en) Portion of a matrix for surface mount package leadframe
USD487432S1 (en) Portion of a matrix for surface mount package leadframe
USD497286S1 (en) Plate
USD485244S1 (en) Portion of a matrix for surface mount package leadframe
USD485808S1 (en) Portion of a matrix for surface mount package leadframe