USD484103S1 - Portion of a matrix for surface mount package leadframe - Google Patents
Portion of a matrix for surface mount package leadframe Download PDFInfo
- Publication number
- USD484103S1 USD484103S1 US29/171,103 US17110302F USD484103S US D484103 S1 USD484103 S1 US D484103S1 US 17110302 F US17110302 F US 17110302F US D484103 S USD484103 S US D484103S
- Authority
- US
- United States
- Prior art keywords
- matrix
- surface mount
- mount package
- package leadframe
- leadframe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011159 matrix material Substances 0.000 title claims description 5
- 239000012634 fragment Substances 0.000 description 1
Images
Description
FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a matrix for surface mount package leadframes showing my new design.
Claims (1)
- The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/171,103 USD484103S1 (en) | 2002-11-15 | 2002-11-15 | Portion of a matrix for surface mount package leadframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/171,103 USD484103S1 (en) | 2002-11-15 | 2002-11-15 | Portion of a matrix for surface mount package leadframe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD484103S1 true USD484103S1 (en) | 2003-12-23 |
Family
ID=29732684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/171,103 Expired - Lifetime USD484103S1 (en) | 2002-11-15 | 2002-11-15 | Portion of a matrix for surface mount package leadframe |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD484103S1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD505122S1 (en) | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD513608S1 (en) | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
| USD588557S1 (en) * | 2007-10-02 | 2009-03-17 | Gem Services, Inc. | 4040-28J matrix leadframe |
| USD761216S1 (en) * | 2014-12-12 | 2016-07-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED leadframe |
| USD803799S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4118859A (en) | 1976-12-01 | 1978-10-10 | Amp Incorporated | Packaging and assembly of sheet metal parts |
| US4234666A (en) | 1978-07-26 | 1980-11-18 | Western Electric Company, Inc. | Carrier tapes for semiconductor devices |
| US4298883A (en) | 1977-04-26 | 1981-11-03 | Tokyo Shibaura Electric Co., Ltd. | Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet |
| US4633582A (en) | 1985-08-14 | 1987-01-06 | General Instrument Corporation | Method for assembling an optoisolator and leadframe therefor |
| US4809054A (en) | 1986-07-25 | 1989-02-28 | Kurt Waldner | Semiconductor lead frame |
| US4818960A (en) | 1987-04-06 | 1989-04-04 | Tdk Corporation | Composite part and method of manufacturing same |
| US4852250A (en) | 1988-01-19 | 1989-08-01 | Microelectronics And Computer Technology Corporation | Hermetically sealed package having an electronic component and method of making |
| US4865193A (en) | 1987-06-23 | 1989-09-12 | Mitsubishi Denki Kabushiki Kaisha | Tape carrier for tape automated bonding process and a method of producing the same |
| US5115299A (en) | 1989-07-13 | 1992-05-19 | Gte Products Corporation | Hermetically sealed chip carrier with ultra violet transparent cover |
| US5554886A (en) | 1994-03-30 | 1996-09-10 | Goldstar Electron Co., Ltd. | Lead frame and semiconductor package with such lead frame |
| US5900582A (en) | 1992-06-05 | 1999-05-04 | Mitsubishi Denki Kabushiki Kaisha | Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame |
| US6016918A (en) | 1998-08-18 | 2000-01-25 | Dial Tool Industries, Inc. | Part carrier strip |
| USD465207S1 (en) | 2001-06-08 | 2002-11-05 | Gem Services, Inc. | Leadframe matrix for a surface mount package |
-
2002
- 2002-11-15 US US29/171,103 patent/USD484103S1/en not_active Expired - Lifetime
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4118859A (en) | 1976-12-01 | 1978-10-10 | Amp Incorporated | Packaging and assembly of sheet metal parts |
| US4298883A (en) | 1977-04-26 | 1981-11-03 | Tokyo Shibaura Electric Co., Ltd. | Plastic material package semiconductor device having a mechanically stable mounting unit for a semiconductor pellet |
| US4234666A (en) | 1978-07-26 | 1980-11-18 | Western Electric Company, Inc. | Carrier tapes for semiconductor devices |
| US4633582A (en) | 1985-08-14 | 1987-01-06 | General Instrument Corporation | Method for assembling an optoisolator and leadframe therefor |
| US4809054A (en) | 1986-07-25 | 1989-02-28 | Kurt Waldner | Semiconductor lead frame |
| US4818960A (en) | 1987-04-06 | 1989-04-04 | Tdk Corporation | Composite part and method of manufacturing same |
| US4865193A (en) | 1987-06-23 | 1989-09-12 | Mitsubishi Denki Kabushiki Kaisha | Tape carrier for tape automated bonding process and a method of producing the same |
| US4852250A (en) | 1988-01-19 | 1989-08-01 | Microelectronics And Computer Technology Corporation | Hermetically sealed package having an electronic component and method of making |
| US5115299A (en) | 1989-07-13 | 1992-05-19 | Gte Products Corporation | Hermetically sealed chip carrier with ultra violet transparent cover |
| US5900582A (en) | 1992-06-05 | 1999-05-04 | Mitsubishi Denki Kabushiki Kaisha | Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame |
| US5554886A (en) | 1994-03-30 | 1996-09-10 | Goldstar Electron Co., Ltd. | Lead frame and semiconductor package with such lead frame |
| US6016918A (en) | 1998-08-18 | 2000-01-25 | Dial Tool Industries, Inc. | Part carrier strip |
| USD465207S1 (en) | 2001-06-08 | 2002-11-05 | Gem Services, Inc. | Leadframe matrix for a surface mount package |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD505122S1 (en) | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD513608S1 (en) | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
| USD588557S1 (en) * | 2007-10-02 | 2009-03-17 | Gem Services, Inc. | 4040-28J matrix leadframe |
| USD761216S1 (en) * | 2014-12-12 | 2016-07-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED leadframe |
| USD803799S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
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