USD467884S1 - Surface mount package - Google Patents
Surface mount package Download PDFInfo
- Publication number
- USD467884S1 USD467884S1 US29/141,966 US14196601F USD467884S US D467884 S1 USD467884 S1 US D467884S1 US 14196601 F US14196601 F US 14196601F US D467884 S USD467884 S US D467884S
- Authority
- US
- United States
- Prior art keywords
- surface mount
- mount package
- package
- view
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of a surface mount package showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof:
FIG. 4 is a front elevational view thereof:
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 the right side elevational view thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Claims (1)
- The ornamental design for a surface mount package, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/141,966 USD467884S1 (en) | 2001-05-15 | 2001-05-15 | Surface mount package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/141,966 USD467884S1 (en) | 2001-05-15 | 2001-05-15 | Surface mount package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD467884S1 true USD467884S1 (en) | 2002-12-31 |
Family
ID=27754548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/141,966 Expired - Lifetime USD467884S1 (en) | 2001-05-15 | 2001-05-15 | Surface mount package |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD467884S1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD505122S1 (en) | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD513608S1 (en) | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD558694S1 (en) * | 2005-10-11 | 2008-01-01 | Gem Services, Inc. | Quad-28JW surface mount package |
| USD560623S1 (en) * | 2005-10-11 | 2008-01-29 | Gem Services, Inc. | Quad-24JW surface mount package |
| USD729182S1 (en) * | 2014-04-24 | 2015-05-12 | Lhv Power Corporation | Integrated board mount device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4984062A (en) | 1987-03-30 | 1991-01-08 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device |
| US5224021A (en) | 1989-10-20 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Surface-mount network device |
| US5446623A (en) | 1993-08-24 | 1995-08-29 | Rohm Co. Ltd. | Surface mounting type polar electronic component |
| US5625226A (en) | 1994-09-19 | 1997-04-29 | International Rectifier Corporation | Surface mount package with improved heat transfer |
| US6040626A (en) | 1998-09-25 | 2000-03-21 | International Rectifier Corp. | Semiconductor package |
| US6211462B1 (en) | 1998-11-05 | 2001-04-03 | Texas Instruments Incorporated | Low inductance power package for integrated circuits |
| US6249041B1 (en) | 1998-06-02 | 2001-06-19 | Siliconix Incorporated | IC chip package with directly connected leads |
-
2001
- 2001-05-15 US US29/141,966 patent/USD467884S1/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4984062A (en) | 1987-03-30 | 1991-01-08 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device |
| US5224021A (en) | 1989-10-20 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Surface-mount network device |
| US5446623A (en) | 1993-08-24 | 1995-08-29 | Rohm Co. Ltd. | Surface mounting type polar electronic component |
| US5625226A (en) | 1994-09-19 | 1997-04-29 | International Rectifier Corporation | Surface mount package with improved heat transfer |
| US6249041B1 (en) | 1998-06-02 | 2001-06-19 | Siliconix Incorporated | IC chip package with directly connected leads |
| US6040626A (en) | 1998-09-25 | 2000-03-21 | International Rectifier Corp. | Semiconductor package |
| US6211462B1 (en) | 1998-11-05 | 2001-04-03 | Texas Instruments Incorporated | Low inductance power package for integrated circuits |
Non-Patent Citations (3)
| Title |
|---|
| JEDEC Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun., 1999, MO-199, pp. 1-5. |
| JEDEC Solid State Product Outlines, "Plastic Small Outline (SOJ) Package Family with 0.330 Inch Body Width", Issue B, May, 1992, MO-121, pp. 1-2. |
| JEDEC Solid State Product Outlines, "Small Outline J-Lead" (SOJ) .300 Body Family (MS-013 Body), Issue A, Jun., 1988, MO-088, AA-AF. |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD505122S1 (en) | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD513608S1 (en) | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD558694S1 (en) * | 2005-10-11 | 2008-01-01 | Gem Services, Inc. | Quad-28JW surface mount package |
| USD560623S1 (en) * | 2005-10-11 | 2008-01-29 | Gem Services, Inc. | Quad-24JW surface mount package |
| USD729182S1 (en) * | 2014-04-24 | 2015-05-12 | Lhv Power Corporation | Integrated board mount device |
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