USD465207S1 - Leadframe matrix for a surface mount package - Google Patents

Leadframe matrix for a surface mount package Download PDF

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Publication number
USD465207S1
USD465207S1 US29/143,226 US14322601F USD465207S US D465207 S1 USD465207 S1 US D465207S1 US 14322601 F US14322601 F US 14322601F US D465207 S USD465207 S US D465207S
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US
United States
Prior art keywords
surface mount
mount package
leadframe matrix
leadframe
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/143,226
Inventor
Richard K. Williams
James Harnden
Anthony Chia
Chu Weibing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
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GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/143,226 priority Critical patent/USD465207S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIA, ANTHONY, WEIBING, CHU, WILLIAMS, RICHARD K., HARNDEN, JAMES
Application granted granted Critical
Publication of USD465207S1 publication Critical patent/USD465207S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a portion of a leadframe matrix for a surface mount package showing my new design;
FIG. 2 is a top plan view of a single surface mount package shown at a lager scale for clarity of illustration; and,
FIG. 3 is a perspective view of FIG. 1.
The leadframe matrix for a surface mount package is shown broken away in FIGS. 1 and 3 of the drawing to indicate indeterminant length, it being understood that it has a uniform shape and appearance throughout its length.

Claims (1)

  1. The ornamental design for leadframe matrix for a surface mount package, as shown and described.
US29/143,226 2001-06-08 2001-06-08 Leadframe matrix for a surface mount package Expired - Lifetime USD465207S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/143,226 USD465207S1 (en) 2001-06-08 2001-06-08 Leadframe matrix for a surface mount package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/143,226 USD465207S1 (en) 2001-06-08 2001-06-08 Leadframe matrix for a surface mount package

Publications (1)

Publication Number Publication Date
USD465207S1 true USD465207S1 (en) 2002-11-05

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Family Applications (1)

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US29/143,226 Expired - Lifetime USD465207S1 (en) 2001-06-08 2001-06-08 Leadframe matrix for a surface mount package

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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD483337S1 (en) 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485243S1 (en) 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20040041222A1 (en) * 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
USD491900S1 (en) 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20040124487A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. LED package die having a small footprint
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
USD494939S1 (en) 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
US20050270666A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Composite optical lens with an integrated reflector
USD513608S1 (en) 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US20070138497A1 (en) * 2003-05-27 2007-06-21 Loh Ban P Power surface mount light emitting die package
USD585847S1 (en) * 2006-09-08 2009-02-03 Cree, Inc. LED lighting tile
USD629760S1 (en) * 2008-11-03 2010-12-28 Aehr Test Systems Interface on an electronics connector
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118859A (en) 1976-12-01 1978-10-10 Amp Incorporated Packaging and assembly of sheet metal parts
US4234666A (en) 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4633582A (en) 1985-08-14 1987-01-06 General Instrument Corporation Method for assembling an optoisolator and leadframe therefor
US4809054A (en) 1986-07-25 1989-02-28 Kurt Waldner Semiconductor lead frame
US4818960A (en) 1987-04-06 1989-04-04 Tdk Corporation Composite part and method of manufacturing same
US4852250A (en) 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making
US4865193A (en) 1987-06-23 1989-09-12 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
US5115299A (en) 1989-07-13 1992-05-19 Gte Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
US5900582A (en) 1992-06-05 1999-05-04 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
US6016918A (en) 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4118859A (en) 1976-12-01 1978-10-10 Amp Incorporated Packaging and assembly of sheet metal parts
US4234666A (en) 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4633582A (en) 1985-08-14 1987-01-06 General Instrument Corporation Method for assembling an optoisolator and leadframe therefor
US4809054A (en) 1986-07-25 1989-02-28 Kurt Waldner Semiconductor lead frame
US4818960A (en) 1987-04-06 1989-04-04 Tdk Corporation Composite part and method of manufacturing same
US4865193A (en) 1987-06-23 1989-09-12 Mitsubishi Denki Kabushiki Kaisha Tape carrier for tape automated bonding process and a method of producing the same
US4852250A (en) 1988-01-19 1989-08-01 Microelectronics And Computer Technology Corporation Hermetically sealed package having an electronic component and method of making
US5115299A (en) 1989-07-13 1992-05-19 Gte Products Corporation Hermetically sealed chip carrier with ultra violet transparent cover
US5900582A (en) 1992-06-05 1999-05-04 Mitsubishi Denki Kabushiki Kaisha Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame
US6016918A (en) 1998-08-18 2000-01-25 Dial Tool Industries, Inc. Part carrier strip

Cited By (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US8530915B2 (en) 2002-09-04 2013-09-10 Cree, Inc. Power surface mount light emitting die package
US8622582B2 (en) 2002-09-04 2014-01-07 Cree, Inc. Power surface mount light emitting die package
US8608349B2 (en) 2002-09-04 2013-12-17 Cree, Inc. Power surface mount light emitting die package
US8167463B2 (en) 2002-09-04 2012-05-01 Cree, Inc. Power surface mount light emitting die package
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US20040041222A1 (en) * 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US8710514B2 (en) 2002-09-04 2014-04-29 Cree, Inc. Power surface mount light emitting die package
US7264378B2 (en) 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
USD485243S1 (en) 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20040124487A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. LED package die having a small footprint
US6897486B2 (en) 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
USD491900S1 (en) 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20070138497A1 (en) * 2003-05-27 2007-06-21 Loh Ban P Power surface mount light emitting die package
US8188488B2 (en) 2003-05-27 2012-05-29 Cree, Inc. Power surface mount light emitting die package
US7659551B2 (en) 2003-05-27 2010-02-09 Cree, Inc. Power surface mount light emitting die package
US20070181901A1 (en) * 2003-05-27 2007-08-09 Loh Ban P Power surface mount light emitting die package
US7976186B2 (en) 2003-05-27 2011-07-12 Cree, Inc. Power surface mount light emitting die package
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US20100301372A1 (en) * 2003-05-27 2010-12-02 Cree, Inc. Power surface mount light emitting die package
US8446004B2 (en) 2004-06-04 2013-05-21 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
US7280288B2 (en) 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US8932886B2 (en) 2004-06-04 2015-01-13 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US20050270666A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Composite optical lens with an integrated reflector
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US7777247B2 (en) 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
US8308331B2 (en) 2005-06-14 2012-11-13 Cree, Inc. LED backlighting for displays
USD585847S1 (en) * 2006-09-08 2009-02-03 Cree, Inc. LED lighting tile
USD629760S1 (en) * 2008-11-03 2010-12-28 Aehr Test Systems Interface on an electronics connector
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

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