USD461783S1 - Surface mount package - Google Patents

Surface mount package Download PDF

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Publication number
USD461783S1
USD461783S1 US29/143,227 US14322701F USD461783S US D461783 S1 USD461783 S1 US D461783S1 US 14322701 F US14322701 F US 14322701F US D461783 S USD461783 S US D461783S
Authority
US
United States
Prior art keywords
surface mount
mount package
package
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/143,227
Inventor
Richard K. Williams
James Harnden
Anthony Chia
Chu Weibing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
Original Assignee
GEM Services Inc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/143,227 priority Critical patent/USD461783S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WILLIAMS, RICHARD K., HARNDEN, JAMES, CHIA, ANTHONY, WEIBING, CHU
Application granted granted Critical
Publication of USD461783S1 publication Critical patent/USD461783S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a surface mount package showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 the right side elevational view thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a surface mount package, as shown and described.
US29/143,227 2001-06-08 2001-06-08 Surface mount package Expired - Lifetime USD461783S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/143,227 USD461783S1 (en) 2001-06-08 2001-06-08 Surface mount package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/143,227 USD461783S1 (en) 2001-06-08 2001-06-08 Surface mount package

Publications (1)

Publication Number Publication Date
USD461783S1 true USD461783S1 (en) 2002-08-20

Family

ID=27611437

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/143,227 Expired - Lifetime USD461783S1 (en) 2001-06-08 2001-06-08 Surface mount package

Country Status (1)

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US (1) USD461783S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD505122S1 (en) 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD729182S1 (en) * 2014-04-24 2015-05-12 Lhv Power Corporation Integrated board mount device
USD1116338S1 (en) * 2023-11-22 2026-03-03 Byd Company Limited Car-mounted terminal

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984062A (en) 1987-03-30 1991-01-08 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device
US5224021A (en) 1989-10-20 1993-06-29 Matsushita Electric Industrial Co., Ltd. Surface-mount network device
US5446623A (en) 1993-08-24 1995-08-29 Rohm Co. Ltd. Surface mounting type polar electronic component
US5625226A (en) 1994-09-19 1997-04-29 International Rectifier Corporation Surface mount package with improved heat transfer
USD402638S (en) 1997-04-25 1998-12-15 Micron Technology, Inc. Temporary package for semiconductor dice
US6040626A (en) 1998-09-25 2000-03-21 International Rectifier Corp. Semiconductor package
US6211462B1 (en) 1998-11-05 2001-04-03 Texas Instruments Incorporated Low inductance power package for integrated circuits
US6249041B1 (en) 1998-06-02 2001-06-19 Siliconix Incorporated IC chip package with directly connected leads

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984062A (en) 1987-03-30 1991-01-08 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device
US5224021A (en) 1989-10-20 1993-06-29 Matsushita Electric Industrial Co., Ltd. Surface-mount network device
US5446623A (en) 1993-08-24 1995-08-29 Rohm Co. Ltd. Surface mounting type polar electronic component
US5625226A (en) 1994-09-19 1997-04-29 International Rectifier Corporation Surface mount package with improved heat transfer
USD402638S (en) 1997-04-25 1998-12-15 Micron Technology, Inc. Temporary package for semiconductor dice
US6249041B1 (en) 1998-06-02 2001-06-19 Siliconix Incorporated IC chip package with directly connected leads
US6040626A (en) 1998-09-25 2000-03-21 International Rectifier Corp. Semiconductor package
US6211462B1 (en) 1998-11-05 2001-04-03 Texas Instruments Incorporated Low inductance power package for integrated circuits

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Jedec Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun., 1999, MO-199, pp. 1-5.
Jedec Solid State Product Outlines, "Plastic Small Outline (SOJ) Package Family with 0.330 Inch Body Width", Issue B, May, 1992, MO-121, pp. 1-2.
Jedec Solid State Product Outlines, "Small Outline J-Lead" (SOJ) 0.300 Body Family (MS-013 Body), Issue A, Jun. 1988, MO-088, AA-AF.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD505122S1 (en) 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD729182S1 (en) * 2014-04-24 2015-05-12 Lhv Power Corporation Integrated board mount device
USD1116338S1 (en) * 2023-11-22 2026-03-03 Byd Company Limited Car-mounted terminal

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