USD440582S1 - Sputtering chamber coil - Google Patents

Sputtering chamber coil Download PDF

Info

Publication number
USD440582S1
USD440582S1 US29/090,631 US9063198F USD440582S US D440582 S1 USD440582 S1 US D440582S1 US 9063198 F US9063198 F US 9063198F US D440582 S USD440582 S US D440582S
Authority
US
United States
Prior art keywords
sputtering chamber
chamber coil
coil
sputtering
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/090,631
Inventor
Praburam Gopalraja
Zheng Xu
Michael Rosenstein
John C. Forster
Peijun Ding
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/090,631 priority Critical patent/USD440582S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FORSTER, JOHN C., XU, ZHENG, DING, PEIJUN, GOPALRAJA, PRABURAM, ROSENSTEIN, MICHAEL
Application granted granted Critical
Publication of USD440582S1 publication Critical patent/USD440582S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 is a front elevational view;
FIG. 2 is a top view;
FIG. 3 is a right side elevational view;
FIG. 4 is a bottom view; and,
FIG. 5 is a rear elevational view of our sputtering chamber coil.
The left side elevation view (not shown) is the same as the right side elevational view (FIG. 3) because of coil symmetry.

Claims (1)

  1. The ornamental design for sputtering chamber coil, as shown and described.
US29/090,631 1998-03-16 1998-07-13 Sputtering chamber coil Expired - Lifetime USD440582S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/090,631 USD440582S1 (en) 1998-03-16 1998-07-13 Sputtering chamber coil

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3969598 1998-03-16
US29/090,631 USD440582S1 (en) 1998-03-16 1998-07-13 Sputtering chamber coil

Publications (1)

Publication Number Publication Date
USD440582S1 true USD440582S1 (en) 2001-04-17

Family

ID=21906880

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/090,631 Expired - Lifetime USD440582S1 (en) 1998-03-16 1998-07-13 Sputtering chamber coil

Country Status (1)

Country Link
US (1) USD440582S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6660134B1 (en) * 1998-07-10 2003-12-09 Applied Materials, Inc. Feedthrough overlap coil

Citations (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US118252A (en) 1871-08-22 Improvement in metal hoops
US565698A (en) 1896-08-11 Half to j
US4154011A (en) 1977-11-21 1979-05-15 Rakestraw Donald L Personalized identification band
US4361472A (en) 1980-09-15 1982-11-30 Vac-Tec Systems, Inc. Sputtering method and apparatus utilizing improved ion source
US4478437A (en) 1981-07-27 1984-10-23 Press/Seal Gasket Corp. Radially expandable locking sleeve device
US4948458A (en) 1989-08-14 1990-08-14 Lam Research Corporation Method and apparatus for producing magnetically-coupled planar plasma
US4990229A (en) 1989-06-13 1991-02-05 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US4999096A (en) 1987-06-30 1991-03-12 Hitachi, Ltd. Method of and apparatus for sputtering
US5001816A (en) 1989-04-04 1991-03-26 Hans Oetiker Ag Maschinen- Und Apparatefabrik Method for connecting two parts along abutting edges and connection obtained thereby
US5122251A (en) 1989-06-13 1992-06-16 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5146137A (en) 1989-12-23 1992-09-08 Leybold Aktiengesellschaft Device for the generation of a plasma
US5150503A (en) 1990-07-07 1992-09-29 Gkn Automotive Ag Continuous tensioning ring for mounting convoluted boots
EP0520519A1 (en) 1991-06-27 1992-12-30 Applied Materials, Inc. Plasma processing reactor and process for plasma etching
US5178739A (en) 1990-10-31 1993-01-12 International Business Machines Corporation Apparatus for depositing material into high aspect ratio holes
US5231334A (en) 1992-04-15 1993-07-27 Texas Instruments Incorporated Plasma source and method of manufacturing
US5234560A (en) 1989-08-14 1993-08-10 Hauzer Holdings Bv Method and device for sputtering of films
US5241245A (en) 1992-05-06 1993-08-31 International Business Machines Corporation Optimized helical resonator for plasma processing
US5280154A (en) 1992-01-30 1994-01-18 International Business Machines Corporation Radio frequency induction plasma processing system utilizing a uniform field coil
GB2231197B (en) 1989-03-06 1994-03-30 Nordiko Ltd Electrode assembly and apparatus
US5304279A (en) 1990-08-10 1994-04-19 International Business Machines Corporation Radio frequency induction/multipole plasma processing tool
US5346578A (en) 1992-11-04 1994-09-13 Novellus Systems, Inc. Induction plasma source
US5397962A (en) 1992-06-29 1995-03-14 Texas Instruments Incorporated Source and method for generating high-density plasma with inductive power coupling
US5401350A (en) 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
US5404079A (en) 1992-08-13 1995-04-04 Matsushita Electric Industrial Co., Ltd. Plasma generating apparatus
EP0653776A1 (en) 1993-10-29 1995-05-17 Applied Materials, Inc. Plasma deposition systems for sputter deposition
US5418431A (en) 1993-08-27 1995-05-23 Hughes Aircraft Company RF plasma source and antenna therefor
US5429995A (en) 1992-07-17 1995-07-04 Kabushiki Kaisha Toshiba Method of manufacturing silicon oxide film containing fluorine
US5429070A (en) 1989-06-13 1995-07-04 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5430355A (en) 1993-07-30 1995-07-04 Texas Instruments Incorporated RF induction plasma source for plasma processing
US5556501A (en) 1989-10-03 1996-09-17 Applied Materials, Inc. Silicon scavenger in an inductively coupled RF plasma reactor
US5637961A (en) 1994-08-23 1997-06-10 Tokyo Electron Limited Concentric rings with different RF energies applied thereto
US5669975A (en) 1996-03-27 1997-09-23 Sony Corporation Plasma producing method and apparatus including an inductively-coupled plasma source
US5681393A (en) 1995-01-24 1997-10-28 Anelva Corporation Plasma processing apparatus
US5683537A (en) 1993-10-04 1997-11-04 Tokyo Electron Limited Plasma processing apparatus
EP0807954A1 (en) 1996-05-09 1997-11-19 Applied Materials, Inc. Coils for generating a plasma and for sputtering
US5707498A (en) 1996-07-12 1998-01-13 Applied Materials, Inc. Avoiding contamination from induction coil in ionized sputtering
EP0813227A3 (en) 1996-06-10 1998-02-04 Lam Research Corporation RF plasma processors
US5721021A (en) 1995-10-11 1998-02-24 Anelva Corporation Method of depositing titanium-containing conductive thin film
US5770098A (en) 1993-03-19 1998-06-23 Tokyo Electron Kabushiki Kaisha Etching process
US5783492A (en) 1994-03-04 1998-07-21 Tokyo Electron Limited Plasma processing method, plasma processing apparatus, and plasma generating apparatus
EP0840351A3 (en) 1996-10-31 1998-09-16 Applied Materials, Inc. Method of reducing generation of particulate matter in a sputtering chamber
EP0836219A3 (en) 1996-10-08 1998-09-16 Applied Materials, Inc. Active shield for generating a plasma for sputtering
EP0836218A3 (en) 1996-10-08 1998-09-16 Applied Materials, Inc. Active shield for generating a plasma for sputtering
EP0727923B1 (en) 1995-02-15 1999-04-21 Applied Materials, Inc. Modifications in or relating to RF plasma reactors and methods of operation thereof
EP0758148A3 (en) 1995-08-07 1999-08-18 Applied Materials, Inc. Method and apparatus for forming electrical contacts in multi-layer integrated circuits
EP0727807B1 (en) 1995-02-15 1999-09-15 Applied Materials, Inc. Plasma reactor

Patent Citations (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US565698A (en) 1896-08-11 Half to j
US118252A (en) 1871-08-22 Improvement in metal hoops
US4154011A (en) 1977-11-21 1979-05-15 Rakestraw Donald L Personalized identification band
US4361472A (en) 1980-09-15 1982-11-30 Vac-Tec Systems, Inc. Sputtering method and apparatus utilizing improved ion source
US4478437A (en) 1981-07-27 1984-10-23 Press/Seal Gasket Corp. Radially expandable locking sleeve device
US4999096A (en) 1987-06-30 1991-03-12 Hitachi, Ltd. Method of and apparatus for sputtering
GB2231197B (en) 1989-03-06 1994-03-30 Nordiko Ltd Electrode assembly and apparatus
US5001816A (en) 1989-04-04 1991-03-26 Hans Oetiker Ag Maschinen- Und Apparatefabrik Method for connecting two parts along abutting edges and connection obtained thereby
US4990229A (en) 1989-06-13 1991-02-05 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5429070A (en) 1989-06-13 1995-07-04 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5122251A (en) 1989-06-13 1992-06-16 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5234560A (en) 1989-08-14 1993-08-10 Hauzer Holdings Bv Method and device for sputtering of films
US4948458A (en) 1989-08-14 1990-08-14 Lam Research Corporation Method and apparatus for producing magnetically-coupled planar plasma
US5556501A (en) 1989-10-03 1996-09-17 Applied Materials, Inc. Silicon scavenger in an inductively coupled RF plasma reactor
US5146137A (en) 1989-12-23 1992-09-08 Leybold Aktiengesellschaft Device for the generation of a plasma
US5150503A (en) 1990-07-07 1992-09-29 Gkn Automotive Ag Continuous tensioning ring for mounting convoluted boots
US5304279A (en) 1990-08-10 1994-04-19 International Business Machines Corporation Radio frequency induction/multipole plasma processing tool
US5178739A (en) 1990-10-31 1993-01-12 International Business Machines Corporation Apparatus for depositing material into high aspect ratio holes
EP0520519A1 (en) 1991-06-27 1992-12-30 Applied Materials, Inc. Plasma processing reactor and process for plasma etching
US5280154A (en) 1992-01-30 1994-01-18 International Business Machines Corporation Radio frequency induction plasma processing system utilizing a uniform field coil
US5231334A (en) 1992-04-15 1993-07-27 Texas Instruments Incorporated Plasma source and method of manufacturing
US5241245A (en) 1992-05-06 1993-08-31 International Business Machines Corporation Optimized helical resonator for plasma processing
US5397962A (en) 1992-06-29 1995-03-14 Texas Instruments Incorporated Source and method for generating high-density plasma with inductive power coupling
US5429995A (en) 1992-07-17 1995-07-04 Kabushiki Kaisha Toshiba Method of manufacturing silicon oxide film containing fluorine
US5404079A (en) 1992-08-13 1995-04-04 Matsushita Electric Industrial Co., Ltd. Plasma generating apparatus
US5346578A (en) 1992-11-04 1994-09-13 Novellus Systems, Inc. Induction plasma source
US5401350A (en) 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
US5770098A (en) 1993-03-19 1998-06-23 Tokyo Electron Kabushiki Kaisha Etching process
US5430355A (en) 1993-07-30 1995-07-04 Texas Instruments Incorporated RF induction plasma source for plasma processing
US5418431A (en) 1993-08-27 1995-05-23 Hughes Aircraft Company RF plasma source and antenna therefor
US5683537A (en) 1993-10-04 1997-11-04 Tokyo Electron Limited Plasma processing apparatus
EP0653776A1 (en) 1993-10-29 1995-05-17 Applied Materials, Inc. Plasma deposition systems for sputter deposition
US5783492A (en) 1994-03-04 1998-07-21 Tokyo Electron Limited Plasma processing method, plasma processing apparatus, and plasma generating apparatus
US5637961A (en) 1994-08-23 1997-06-10 Tokyo Electron Limited Concentric rings with different RF energies applied thereto
US5681393A (en) 1995-01-24 1997-10-28 Anelva Corporation Plasma processing apparatus
EP0727807B1 (en) 1995-02-15 1999-09-15 Applied Materials, Inc. Plasma reactor
EP0727923B1 (en) 1995-02-15 1999-04-21 Applied Materials, Inc. Modifications in or relating to RF plasma reactors and methods of operation thereof
EP0758148A3 (en) 1995-08-07 1999-08-18 Applied Materials, Inc. Method and apparatus for forming electrical contacts in multi-layer integrated circuits
US5721021A (en) 1995-10-11 1998-02-24 Anelva Corporation Method of depositing titanium-containing conductive thin film
US5669975A (en) 1996-03-27 1997-09-23 Sony Corporation Plasma producing method and apparatus including an inductively-coupled plasma source
EP0807954A1 (en) 1996-05-09 1997-11-19 Applied Materials, Inc. Coils for generating a plasma and for sputtering
EP0813227A3 (en) 1996-06-10 1998-02-04 Lam Research Corporation RF plasma processors
US5707498A (en) 1996-07-12 1998-01-13 Applied Materials, Inc. Avoiding contamination from induction coil in ionized sputtering
EP0836219A3 (en) 1996-10-08 1998-09-16 Applied Materials, Inc. Active shield for generating a plasma for sputtering
EP0836218A3 (en) 1996-10-08 1998-09-16 Applied Materials, Inc. Active shield for generating a plasma for sputtering
EP0840351A3 (en) 1996-10-31 1998-09-16 Applied Materials, Inc. Method of reducing generation of particulate matter in a sputtering chamber

Non-Patent Citations (19)

* Cited by examiner, † Cited by third party
Title
Applied Materials, Inc., Exhibit A, Dated prior to Jul. 13, 1998, the filing date of the present application.(Exhibit A is a drawing of a prior art coil design which is prior to the design of the present application).
J. Hopwood et al., "Mechanisms for Highly Ionized Magnetron Sputtering," J. Appl. Phys., vol. 78, pp. 758-765, 1995.
N. Jiwari et al., "Helicon wave plasma reactor employing single-loop antenna," J. of Vac. Sci. Technol., A 12(4), pp. 1322-1327, Jul./Aug. 1994.
S.M. Rossnagel et al., "Magnetron Sputter Deposition with High Levels of Metal Ionization," Appl. Phys. Lett., vol. 63, pp. 3285-3287, 1993.
S.M. Rossnagel, "Directional and Ionized Sputter Deposition for Microelectronics Applications," Proc. of 3rd ISSP (Tokyo), pp. 253-260, 1995.
Search report in PCT/US98/10058 issued Nov. 4, 1998.
U.S. application No. 08/559,345 filed Nov. 15, 1995.
U.S. application No. 08/730,722 filed Oct. 8, 1996.
U.S. application No. 08/856,335, filed May 14, 1997.
U.S. application No. 08/857,719, filed May 16, 1997.
U.S. application No. 08/857,944, filed May 16, 1997.
U.S. application No. 09/039,695, filed Mar. 16, 1998.
U.S. application No. 09/049,276 filed Mar. 27, 1998.
U.S. application No. 09/064,355, filed Apr. 22, 1998.
U.S. application No. 09/113,577, filed Jul. 10, 1998.
U.S. application No. 29/090,618, filed Jul. 13, 1998.
U.S. application No. 29/109,870.
U.S. application No. 29/109,892.
U.S. application No. 29/109,893.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6660134B1 (en) * 1998-07-10 2003-12-09 Applied Materials, Inc. Feedthrough overlap coil

Similar Documents

Publication Publication Date Title
USD430916S (en) Handgun
USD448203S1 (en) Cabinet
USD447550S1 (en) Substance evaporator
USD439379S1 (en) Vacuum cleaner
USD441632S1 (en) Adjustable handgrip
USD425513S (en) Antenna
USD441091S1 (en) PCR plate
USD427403S (en) Iron
USD458366S1 (en) Ampoule
USD470635S1 (en) Iron
USD413020S (en) Gun case
USD436713S1 (en) Thermal underwear
USD444998S1 (en) Igniter
USD443833S1 (en) Wrist-watch
USD418641S (en) Vacuum cleaner
USD404914S (en) Gun case
USD449828S1 (en) Tiltable loudspeaker enclosure
USD447985S1 (en) Motorcycle
USD441930S1 (en) Iron
USD423549S (en) Sunglasses
USD441004S1 (en) Electric contrabass
USD422831S (en) Pitcher
USD439721S1 (en) Sprocket
USD441694S1 (en) Walker
USD428467S (en) Revolver