USD273006S - Twin heat sink for electronic semiconductor devices - Google Patents

Twin heat sink for electronic semiconductor devices Download PDF

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Publication number
USD273006S
USD273006S US06/252,029 US25202981F USD273006S US D273006 S USD273006 S US D273006S US 25202981 F US25202981 F US 25202981F US D273006 S USD273006 S US D273006S
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US
United States
Prior art keywords
heat sink
semiconductor devices
electronic semiconductor
twin heat
twin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/252,029
Inventor
Alfred F. McCarthy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LaSalle Business Credit LLC
Original Assignee
Aavid Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Engineering Inc filed Critical Aavid Engineering Inc
Priority to US06/252,029 priority Critical patent/USD273006S/en
Assigned to AAVID ENGINEERING,INC. A CORP OF NEW HAMPSHIRE reassignment AAVID ENGINEERING,INC. A CORP OF NEW HAMPSHIRE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: MC CARTHY, ALFRED F.
Application granted granted Critical
Publication of USD273006S publication Critical patent/USD273006S/en
Assigned to MNC COMMERCIAL CORP. reassignment MNC COMMERCIAL CORP. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC., A NH CORP.
Assigned to MNC COMMERCIAL CORP., A MD CORP. reassignment MNC COMMERCIAL CORP., A MD CORP. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC., A N.H. CORP.
Assigned to MNC COMMERCIAL CORP., A MD CORP. reassignment MNC COMMERCIAL CORP., A MD CORP. SPECIAL POWER ATTY., ASSIGNOR HEREBY APPOINTS ASSIGNEE AS ITS POWER OF ATTORNEY TO ACT IN ALL MATTERS INVOLVING SAID PATENTS. Assignors: AAVID ENGINEERING, INC., A N.H. CORP.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC.
Assigned to AAVID ENGINEERING, INC. reassignment AAVID ENGINEERING, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MARYLAND NATIONAL BANK (AS SUCCESSOR-IN-INTEREST TO MNC CREDIT CORP.)
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. CORRECTIVE ASSIGNMENT OF SECURITY INTEREST IN PATENTS TO AMEND THE CONVEYING PARTY NAME, PREVIOUSLY RECORDED AT REEL 6747, FRAME 0635. Assignors: AAVID THERMAL PRODCUTS, INC.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. AMENDMENT: AMEND CONVEYING PARTY'S NAME ON PREVIOUSLY RECORDED ASSIGNMENT OF SECURITY INTEREST IN PATENTS, REEL 8059 FRAME 0087, RECORDED 10/07/96 Assignors: AAVID THERMAL PRODUCTS, INC.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a twin heat sink for electronic semiconductor devices showing my new design; the broken lines being shown for illustrative purposes, only;
FIG. 2 is a front elevational view of the same heat sink;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof, looking toward the right side of the heat sink as it is shown in FIG. 1;
FIG. 5 is a side elevational view thereof, looking toward the left side of the heat sink as it is shown in FIG. 1;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a twin heat sink for electronic semiconductor devices, substantially as shown and described.
US06/252,029 1981-04-08 1981-04-08 Twin heat sink for electronic semiconductor devices Expired - Lifetime USD273006S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/252,029 USD273006S (en) 1981-04-08 1981-04-08 Twin heat sink for electronic semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/252,029 USD273006S (en) 1981-04-08 1981-04-08 Twin heat sink for electronic semiconductor devices

Publications (1)

Publication Number Publication Date
USD273006S true USD273006S (en) 1984-03-13

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ID=69944883

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/252,029 Expired - Lifetime USD273006S (en) 1981-04-08 1981-04-08 Twin heat sink for electronic semiconductor devices

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US (1) USD273006S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633485B1 (en) 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Amperex Transistor brochure, 6/66, Extruded Aluminum Heat-Sink.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6633485B1 (en) 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
US20040201964A1 (en) * 2002-11-20 2004-10-14 Sigl Dennis R. Snap-in heat sink for semiconductor mounting

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