USD273006S - Twin heat sink for electronic semiconductor devices - Google Patents
Twin heat sink for electronic semiconductor devices Download PDFInfo
- Publication number
- USD273006S USD273006S US06/252,029 US25202981F USD273006S US D273006 S USD273006 S US D273006S US 25202981 F US25202981 F US 25202981F US D273006 S USD273006 S US D273006S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- semiconductor devices
- electronic semiconductor
- twin heat
- twin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a perspective view of a twin heat sink for electronic semiconductor devices showing my new design; the broken lines being shown for illustrative purposes, only;
FIG. 2 is a front elevational view of the same heat sink;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof, looking toward the right side of the heat sink as it is shown in FIG. 1;
FIG. 5 is a side elevational view thereof, looking toward the left side of the heat sink as it is shown in FIG. 1;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a twin heat sink for electronic semiconductor devices, substantially as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/252,029 USD273006S (en) | 1981-04-08 | 1981-04-08 | Twin heat sink for electronic semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/252,029 USD273006S (en) | 1981-04-08 | 1981-04-08 | Twin heat sink for electronic semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
USD273006S true USD273006S (en) | 1984-03-13 |
Family
ID=69944883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/252,029 Expired - Lifetime USD273006S (en) | 1981-04-08 | 1981-04-08 | Twin heat sink for electronic semiconductor devices |
Country Status (1)
Country | Link |
---|---|
US (1) | USD273006S (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6633485B1 (en) | 2002-11-20 | 2003-10-14 | Illinois Tool Works Inc. | Snap-in heat sink for semiconductor mounting |
-
1981
- 1981-04-08 US US06/252,029 patent/USD273006S/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
Amperex Transistor brochure, 6/66, Extruded Aluminum Heat-Sink. |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6633485B1 (en) | 2002-11-20 | 2003-10-14 | Illinois Tool Works Inc. | Snap-in heat sink for semiconductor mounting |
US20040201964A1 (en) * | 2002-11-20 | 2004-10-14 | Sigl Dennis R. | Snap-in heat sink for semiconductor mounting |
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