USD1005295S1 - Computer memory module - Google Patents
Computer memory module Download PDFInfo
- Publication number
- USD1005295S1 USD1005295S1 US29/791,101 US202129791101F USD1005295S US D1005295 S1 USD1005295 S1 US D1005295S1 US 202129791101 F US202129791101 F US 202129791101F US D1005295 S USD1005295 S US D1005295S
- Authority
- US
- United States
- Prior art keywords
- memory module
- computer memory
- view
- design
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The dashed broken lines depict portions of a computer memory module in which the design is embodied that form no part of the claimed design.
The dot-dash broken lines are for defining the bounds of the claimed design only and form no part of the claimed design.
Claims (1)
- The ornamental design for a computer memory module, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110306520 | 2021-11-30 | ||
| TW110306520F TWD220530S (en) | 2021-11-30 | 2021-11-30 | Memory Module (1) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1005295S1 true USD1005295S1 (en) | 2023-11-21 |
Family
ID=88758098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/791,101 Active USD1005295S1 (en) | 2021-11-30 | 2021-12-29 | Computer memory module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1005295S1 (en) |
| TW (1) | TWD220530S (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1070863S1 (en) * | 2022-12-20 | 2025-04-15 | Kingston Digital, Inc. | Heat sink for memory module |
| USD1080566S1 (en) * | 2022-02-23 | 2025-06-24 | Kingston Digital, Inc. | Heat sink for memory module |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD343391S (en) * | 1991-02-14 | 1994-01-18 | Portacom Pty. Ltd. | Cover plate for touch sensor plug-in module for computers |
| USD348469S (en) * | 1992-01-27 | 1994-07-05 | At&T Bell Laboratories | Electronics cabinet door |
| USD394845S (en) * | 1996-09-24 | 1998-06-02 | Motorola, Inc. | Front panel with perforations for infrastructure equipment |
| USD482691S1 (en) * | 2002-07-26 | 2003-11-25 | Hewlett-Packard Development Company, L.P. | Server blade |
| USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
| USD660810S1 (en) * | 2011-10-17 | 2012-05-29 | Corsair Memory, Inc. | Heat spreader with fins for a computer memory module |
| USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
| USD697479S1 (en) * | 2010-10-18 | 2014-01-14 | Apple Inc. | Electronic device |
| USD733145S1 (en) * | 2014-03-14 | 2015-06-30 | Kingston Digital, Inc. | Memory module |
| USD782417S1 (en) * | 2016-04-20 | 2017-03-28 | Chyng Hong Electronic Co., Ltd. | Back panel for power supply |
| USD795255S1 (en) * | 2015-05-12 | 2017-08-22 | HYPR Corp. | Biometric payment gateway device |
| USD807824S1 (en) * | 2016-07-18 | 2018-01-16 | General Electric Company | Heat spreader |
| USD826945S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD826944S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD828357S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
| US10809452B2 (en) * | 2016-10-07 | 2020-10-20 | G.Skill International Enterprise Co., Ltd. | Memory device and assembling method thereof |
| USD964947S1 (en) * | 2021-06-03 | 2022-09-27 | Kingston Digital, Inc. | Heat sink for memory module |
| USD988318S1 (en) * | 2020-09-10 | 2023-06-06 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
-
2021
- 2021-11-30 TW TW110306520F patent/TWD220530S/en unknown
- 2021-12-29 US US29/791,101 patent/USD1005295S1/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD343391S (en) * | 1991-02-14 | 1994-01-18 | Portacom Pty. Ltd. | Cover plate for touch sensor plug-in module for computers |
| USD348469S (en) * | 1992-01-27 | 1994-07-05 | At&T Bell Laboratories | Electronics cabinet door |
| USD394845S (en) * | 1996-09-24 | 1998-06-02 | Motorola, Inc. | Front panel with perforations for infrastructure equipment |
| USD482691S1 (en) * | 2002-07-26 | 2003-11-25 | Hewlett-Packard Development Company, L.P. | Server blade |
| USD697479S1 (en) * | 2010-10-18 | 2014-01-14 | Apple Inc. | Electronic device |
| USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
| USD660810S1 (en) * | 2011-10-17 | 2012-05-29 | Corsair Memory, Inc. | Heat spreader with fins for a computer memory module |
| USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
| USD733145S1 (en) * | 2014-03-14 | 2015-06-30 | Kingston Digital, Inc. | Memory module |
| USD795255S1 (en) * | 2015-05-12 | 2017-08-22 | HYPR Corp. | Biometric payment gateway device |
| USD782417S1 (en) * | 2016-04-20 | 2017-03-28 | Chyng Hong Electronic Co., Ltd. | Back panel for power supply |
| USD807824S1 (en) * | 2016-07-18 | 2018-01-16 | General Electric Company | Heat spreader |
| US10809452B2 (en) * | 2016-10-07 | 2020-10-20 | G.Skill International Enterprise Co., Ltd. | Memory device and assembling method thereof |
| USD826945S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD826944S1 (en) * | 2017-02-17 | 2018-08-28 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD828357S1 (en) * | 2017-02-17 | 2018-09-11 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
| USD988318S1 (en) * | 2020-09-10 | 2023-06-06 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
| USD964947S1 (en) * | 2021-06-03 | 2022-09-27 | Kingston Digital, Inc. | Heat sink for memory module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1080566S1 (en) * | 2022-02-23 | 2025-06-24 | Kingston Digital, Inc. | Heat sink for memory module |
| USD1070863S1 (en) * | 2022-12-20 | 2025-04-15 | Kingston Digital, Inc. | Heat sink for memory module |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD220530S (en) | 2022-08-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |