USD1005295S1 - Computer memory module - Google Patents

Computer memory module Download PDF

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Publication number
USD1005295S1
USD1005295S1 US29/791,101 US202129791101F USD1005295S US D1005295 S1 USD1005295 S1 US D1005295S1 US 202129791101 F US202129791101 F US 202129791101F US D1005295 S USD1005295 S US D1005295S
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United States
Prior art keywords
memory module
computer memory
view
design
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/791,101
Inventor
Chiung-Huang HUANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GSkill International Enterprise Co Ltd
Original Assignee
GSkill International Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GSkill International Enterprise Co Ltd filed Critical GSkill International Enterprise Co Ltd
Assigned to G.SKILL INTERNATIONAL ENTERPRISE CO., LTD. reassignment G.SKILL INTERNATIONAL ENTERPRISE CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, CHIUNG-HUANG
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Description

FIG. 1 is a perspective view of a computer memory module showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view thereof taken along line 8-8 in FIG. 2 ;
FIG. 9 is a cross-sectional view thereof taken along line 9-9 in FIGS. 2 ; and,
FIG. 10 is an exploded perspective view thereof.
The dashed broken lines depict portions of a computer memory module in which the design is embodied that form no part of the claimed design.
The dot-dash broken lines are for defining the bounds of the claimed design only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a computer memory module, as shown and described.
US29/791,101 2021-11-30 2021-12-29 Computer memory module Active USD1005295S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW110306520 2021-11-30
TW110306520F TWD220530S (en) 2021-11-30 2021-11-30 Memory Module (1)

Publications (1)

Publication Number Publication Date
USD1005295S1 true USD1005295S1 (en) 2023-11-21

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ID=88758098

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/791,101 Active USD1005295S1 (en) 2021-11-30 2021-12-29 Computer memory module

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US (1) USD1005295S1 (en)
TW (1) TWD220530S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1070863S1 (en) * 2022-12-20 2025-04-15 Kingston Digital, Inc. Heat sink for memory module
USD1080566S1 (en) * 2022-02-23 2025-06-24 Kingston Digital, Inc. Heat sink for memory module

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD343391S (en) * 1991-02-14 1994-01-18 Portacom Pty. Ltd. Cover plate for touch sensor plug-in module for computers
USD348469S (en) * 1992-01-27 1994-07-05 At&T Bell Laboratories Electronics cabinet door
USD394845S (en) * 1996-09-24 1998-06-02 Motorola, Inc. Front panel with perforations for infrastructure equipment
USD482691S1 (en) * 2002-07-26 2003-11-25 Hewlett-Packard Development Company, L.P. Server blade
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD697479S1 (en) * 2010-10-18 2014-01-14 Apple Inc. Electronic device
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
USD782417S1 (en) * 2016-04-20 2017-03-28 Chyng Hong Electronic Co., Ltd. Back panel for power supply
USD795255S1 (en) * 2015-05-12 2017-08-22 HYPR Corp. Biometric payment gateway device
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
USD826945S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD826944S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD828357S1 (en) * 2017-02-17 2018-09-11 Samsung Electronics Co., Ltd. SSD storage device
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
US10809452B2 (en) * 2016-10-07 2020-10-20 G.Skill International Enterprise Co., Ltd. Memory device and assembling method thereof
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module
USD988318S1 (en) * 2020-09-10 2023-06-06 Samsung Electronics Co., Ltd. Solid state drive memory device

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD343391S (en) * 1991-02-14 1994-01-18 Portacom Pty. Ltd. Cover plate for touch sensor plug-in module for computers
USD348469S (en) * 1992-01-27 1994-07-05 At&T Bell Laboratories Electronics cabinet door
USD394845S (en) * 1996-09-24 1998-06-02 Motorola, Inc. Front panel with perforations for infrastructure equipment
USD482691S1 (en) * 2002-07-26 2003-11-25 Hewlett-Packard Development Company, L.P. Server blade
USD697479S1 (en) * 2010-10-18 2014-01-14 Apple Inc. Electronic device
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD660810S1 (en) * 2011-10-17 2012-05-29 Corsair Memory, Inc. Heat spreader with fins for a computer memory module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
USD795255S1 (en) * 2015-05-12 2017-08-22 HYPR Corp. Biometric payment gateway device
USD782417S1 (en) * 2016-04-20 2017-03-28 Chyng Hong Electronic Co., Ltd. Back panel for power supply
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
US10809452B2 (en) * 2016-10-07 2020-10-20 G.Skill International Enterprise Co., Ltd. Memory device and assembling method thereof
USD826945S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD826944S1 (en) * 2017-02-17 2018-08-28 Samsung Electronics Co., Ltd. SSD storage device
USD828357S1 (en) * 2017-02-17 2018-09-11 Samsung Electronics Co., Ltd. SSD storage device
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module
USD988318S1 (en) * 2020-09-10 2023-06-06 Samsung Electronics Co., Ltd. Solid state drive memory device
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1080566S1 (en) * 2022-02-23 2025-06-24 Kingston Digital, Inc. Heat sink for memory module
USD1070863S1 (en) * 2022-12-20 2025-04-15 Kingston Digital, Inc. Heat sink for memory module

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