USB413006I5 - - Google Patents

Info

Publication number
USB413006I5
USB413006I5 US41300673A USB413006I5 US B413006 I5 USB413006 I5 US B413006I5 US 41300673 A US41300673 A US 41300673A US B413006 I5 USB413006 I5 US B413006I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US413006A priority Critical patent/US3914850A/en
Priority to US05/488,860 priority patent/US3964093A/en
Priority to CA206,029A priority patent/CA1012802A/en
Publication of USB413006I5 publication Critical patent/USB413006I5/en
Application granted granted Critical
Publication of US3914850A publication Critical patent/US3914850A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
US413006A 1973-11-05 1973-11-05 Bonding of dissimilar workpieces to a substrate Expired - Lifetime US3914850A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US413006A US3914850A (en) 1973-11-05 1973-11-05 Bonding of dissimilar workpieces to a substrate
US05/488,860 US3964093A (en) 1973-11-05 1974-07-15 Bonding of dissimilar workpieces to a substrate
CA206,029A CA1012802A (en) 1973-11-05 1974-07-31 Bonding of dissimilar workpieces to a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US413006A US3914850A (en) 1973-11-05 1973-11-05 Bonding of dissimilar workpieces to a substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US05/488,860 Division US3964093A (en) 1973-11-05 1974-07-15 Bonding of dissimilar workpieces to a substrate

Publications (2)

Publication Number Publication Date
USB413006I5 true USB413006I5 (en) 1975-01-28
US3914850A US3914850A (en) 1975-10-28

Family

ID=23635397

Family Applications (1)

Application Number Title Priority Date Filing Date
US413006A Expired - Lifetime US3914850A (en) 1973-11-05 1973-11-05 Bonding of dissimilar workpieces to a substrate

Country Status (2)

Country Link
US (1) US3914850A (en)
CA (1) CA1012802A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0413937A3 (en) * 1989-08-25 1991-08-14 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4354629A (en) * 1980-06-09 1982-10-19 Raychem Corporation Solder delivery system
US4616412A (en) * 1981-01-13 1986-10-14 Schroeder Jon M Method for bonding electrical leads to electronic devices
DE3319339A1 (en) * 1982-05-31 1983-12-29 Sharp K.K., Osaka Driver system for an x-y electrode matrix
EP0330896A3 (en) * 1988-03-03 1991-01-09 Siemens Aktiengesellschaft Method for attaching semiconductor components to substrates, and arrangement for carrying it out
US5317803A (en) * 1991-05-30 1994-06-07 Sierra Research And Technology, Inc. Method of soldering an integrated circuit
US5240165A (en) * 1992-07-06 1993-08-31 Motorola, Inc. Method and apparatus for controlled deformation bonding
US5454160A (en) * 1993-12-03 1995-10-03 Ncr Corporation Apparatus and method for stacking integrated circuit devices
JP7032819B2 (en) * 2020-06-30 2022-03-09 株式会社アルテクス Joining method and joining device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533155A (en) * 1967-07-06 1970-10-13 Western Electric Co Bonding with a compliant medium
US3655177A (en) * 1967-07-06 1972-04-11 Western Electric Co Assembly including carrier for devices
US3669333A (en) * 1970-02-02 1972-06-13 Western Electric Co Bonding with a compliant medium
US3699640A (en) * 1970-12-01 1972-10-24 Western Electric Co Compliant bonding

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533155A (en) * 1967-07-06 1970-10-13 Western Electric Co Bonding with a compliant medium
US3655177A (en) * 1967-07-06 1972-04-11 Western Electric Co Assembly including carrier for devices
US3669333A (en) * 1970-02-02 1972-06-13 Western Electric Co Bonding with a compliant medium
US3699640A (en) * 1970-12-01 1972-10-24 Western Electric Co Compliant bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0413937A3 (en) * 1989-08-25 1991-08-14 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging

Also Published As

Publication number Publication date
US3914850A (en) 1975-10-28
CA1012802A (en) 1977-06-28

Similar Documents

Publication Publication Date Title
AR201758A1 (en)
AR201235Q (en)
AR201231Q (en)
AU474593B2 (en)
AU474838B2 (en)
AU471343B2 (en)
AU465453B2 (en)
AU450229B2 (en)
AU476714B2 (en)
AR201229Q (en)
AU472848B2 (en)
AU476696B2 (en)
AU466283B2 (en)
AR199451A1 (en)
AU477823B2 (en)
AR201432A1 (en)
AR195311A1 (en)
AR197627A1 (en)
AR200885A1 (en)
AR200256A1 (en)
AR193950A1 (en)
AU476873B1 (en)
AU447540B2 (en)
AU477824B2 (en)
AR210729A1 (en)

Legal Events

Date Code Title Description
AS Assignment

Owner name: AT & T TECHNOLOGIES, INC.,

Free format text: CHANGE OF NAME;ASSIGNOR:WESTERN ELECTRIC COMPANY, INCORPORATED;REEL/FRAME:004251/0868

Effective date: 19831229