USB355026I5 - - Google Patents
Info
- Publication number
- USB355026I5 USB355026I5 US355026DD USB355026I5 US B355026 I5 USB355026 I5 US B355026I5 US 355026D D US355026D D US 355026DD US B355026 I5 USB355026 I5 US B355026I5
- Authority
- US
- United States
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4822—Beam leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Dicing (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68219367A | 1967-11-13 | 1967-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USB355026I5 true USB355026I5 (xx) |
Family
ID=24738624
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US355026D Pending USB355026I5 (xx) | 1967-11-13 | ||
| US682193A Expired - Lifetime US3550261A (en) | 1967-11-13 | 1967-11-13 | Method of bonding and an electrical contact construction |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US682193A Expired - Lifetime US3550261A (en) | 1967-11-13 | 1967-11-13 | Method of bonding and an electrical contact construction |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US3550261A (xx) |
| ES (1) | ES360199A1 (xx) |
| FR (1) | FR1605395A (xx) |
| GB (1) | GB1237099A (xx) |
| NL (1) | NL6814388A (xx) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1952216A1 (de) * | 1969-10-16 | 1971-04-29 | Siemens Ag | Verfahren zum Trennen von aus einem Halbleitergrundkoerper herzustellenden Halbleiterchips |
| US3771219A (en) * | 1970-02-05 | 1973-11-13 | Sharp Kk | Method for manufacturing semiconductor device |
| US3824678A (en) * | 1970-08-31 | 1974-07-23 | North American Rockwell | Process for laser scribing beam lead semiconductor wafers |
| US3947952A (en) * | 1970-12-28 | 1976-04-06 | Bell Telephone Laboratories, Incorporated | Method of encapsulating beam lead semiconductor devices |
| US3839781A (en) * | 1971-04-21 | 1974-10-08 | Signetics Corp | Method for discretionary scribing and breaking semiconductor wafers for yield improvement |
| US3747202A (en) * | 1971-11-22 | 1973-07-24 | Honeywell Inf Systems | Method of making beam leads on substrates |
| BE791930A (fr) * | 1971-12-02 | 1973-03-16 | Western Electric Co | Dispositif electroluminescent et procede pour sa fabrication |
| US3760238A (en) * | 1972-02-28 | 1973-09-18 | Microsystems Int Ltd | Fabrication of beam leads |
| US3838501A (en) * | 1973-02-09 | 1974-10-01 | Honeywell Inf Systems | Method in microcircuit package assembly providing nonabrasive, electrically passive edges on integrated circuit chips |
| US4086375A (en) * | 1975-11-07 | 1978-04-25 | Rockwell International Corporation | Batch process providing beam leads for microelectronic devices having metallized contact pads |
| US4685210A (en) * | 1985-03-13 | 1987-08-11 | The Boeing Company | Multi-layer circuit board bonding method utilizing noble metal coated surfaces |
| GB2208453B (en) * | 1987-08-24 | 1991-11-20 | Marconi Electronic Devices | Capacitors |
| US5756370A (en) * | 1996-02-08 | 1998-05-26 | Micron Technology, Inc. | Compliant contact system with alignment structure for testing unpackaged semiconductor dice |
| US6713374B2 (en) * | 1999-07-30 | 2004-03-30 | Formfactor, Inc. | Interconnect assemblies and methods |
| US7435108B1 (en) * | 1999-07-30 | 2008-10-14 | Formfactor, Inc. | Variable width resilient conductive contact structures |
| US6882048B2 (en) * | 2001-03-30 | 2005-04-19 | Dainippon Printing Co., Ltd. | Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
| US6759311B2 (en) * | 2001-10-31 | 2004-07-06 | Formfactor, Inc. | Fan out of interconnect elements attached to semiconductor wafer |
| US8236613B2 (en) * | 2010-05-24 | 2012-08-07 | Alpha & Omega Semiconductor Inc. | Wafer level chip scale package method using clip array |
| WO2013087101A1 (en) * | 2011-12-14 | 2013-06-20 | Reinhardt Microtech Gmbh | Substrate-supported circuit parts with free-standing three-dimensional structures |
-
0
- US US355026D patent/USB355026I5/en active Pending
-
1967
- 1967-11-13 US US682193A patent/US3550261A/en not_active Expired - Lifetime
-
1968
- 1968-09-04 GB GB42135/68A patent/GB1237099A/en not_active Expired
- 1968-10-04 FR FR168751A patent/FR1605395A/fr not_active Expired
- 1968-10-08 NL NL6814388A patent/NL6814388A/xx not_active Application Discontinuation
- 1968-11-13 ES ES360199A patent/ES360199A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR1605395A (xx) | 1975-02-28 |
| DE1804349B2 (de) | 1975-09-11 |
| NL6814388A (xx) | 1969-05-16 |
| ES360199A1 (es) | 1970-10-16 |
| US3550261A (en) | 1970-12-29 |
| GB1237099A (en) | 1971-06-30 |
| DE1804349A1 (de) | 1969-06-19 |